JPS5890792A - Manufacture of semiconductor photo device - Google Patents

Abstract

PURPOSE:To contrive the facilitation of the automatic assembly by a method wherein a frame constituted of the integral body of a plurality of base pieces is formed, semiconductor elements are mounted, and thereafter each base piece is separated as a stem. CONSTITUTION:The frame 32 is formed of a plurality of base pieces 211-21n and joint pieces 20 joining each base pieces 211-21n into an integral body. This frame 32 is thrown into an assembly device and carried continuously or intermittently in the A direction by one base piece 21. Every time of carriage, while determining reference surfaces XX', YY', a heat sink 6 whereon a semiconductor laser element 7 is previously brazed is positioned and simultaneously is brazed at the fixed position of each base piece 21. Thereafter, when each base piece 211-21n is cut along e.g. a cutting line 22 and separated as the stem 31 independently, a semiconductor laser device wherein the automatic assembly can be easily performed is completed.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a semiconductor device that facilitates automatic assembly.

Before a semiconductor device emits light, it is desirable that the median amount of light in the receiving direction be precisely determined with reference to the eye point or plane of the stem of the device. Conventionally, such a device was assembled by using nine stems separated one by one and sequentially feeding these stems into an assembly device. A conventional assembly method will be explained using a semiconductor laser device using a stem as shown in FIG. 1 as an example.

FIG. 1(6) is a plan view of the semiconductor device, and FIG. 1(6) is a partially cutaway side view of the semiconductor device. (1) is the base, (2)
are mounting holes, (3) and (4) are external leads, and (5) is glass that insulates the lead (3) from the base (1). The base (1), external leads (3), (4), etc. constitute a stem (b). (6) is a heat sink, to which a semiconductor laser element (7) is brazed in advance. To attach this heat sink (6) to the stem (b),
First, the stem (b) is placed in a fixed position from the assembly apparatus so that the light emitting point of the laser beam emitted from the semiconductor laser element (7) is located, and the base (6) is brazed to the base (6). After that, thin metal wire (1
In step 1), the semiconductor laser chip (7) and external leads (5) are connected to complete the semiconductor laser device.

However, with this conventional manufacturing method, when making multiple souvenirs, a large number of stems (B) must be inserted one by one into an assembly device and aligned, making it difficult to assemble automatically. There were some drawbacks.

The present invention was made in order to eliminate such drawbacks in the conventional manufacturing method, and after positioning and fixing a semiconductor element at a predetermined position of each base piece in a frame in which a plurality of base pieces are connected, each base piece is It is an object of the present invention to provide a method for manufacturing a semiconductor device that can be easily assembled automatically by separating and independent parts as a stem.

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 is a plan view showing a frame in which a plurality of base pieces are integrated, and the same parts as in FIG. (21+) to (2In) are a plurality of base pieces, and a connecting piece (1) and K that interconnect these base pieces (211) (21n) and each base piece (21s) to (2In) integrally with each other. A frame is formed.

This frame is put into an assembly device and assembled continuously. Each time, while determining the reference planes XX and YY, the heat sink (
6) (Fig. 3) is positioned in the same manner as in Fig. 1 and brazed to the predetermined position of each base piece (goods).

After that, each of the above base pieces (ins) to (21n),
For example, cut each along the cutting line (2), and
If the stem (B) is separated and independent as shown in the figure, a semiconductor laser device equivalent to that shown in FIG. 1 will be completed.

In addition, the bonding of the metal shaft m (8) is to the frame (to)
It may be carried out in the same state or after separation, and is not limited here.

If the frame (B) is formed in this way, it can be used not only when loading it into the assembly equipment, but also when transporting one base piece (B) at a time, or when drawing the XI and YY. It is also very easy to automate. Ease of automation is not limited to the steps described above; for example, when sealing the heat sink (6) and the semiconductor laser element (7) in the state of the frame (2) with a window cap (not shown), This also applies when measuring the characteristics of a semiconductor laser device.

Further, in the above embodiment, a semiconductor laser device was taken as an example, but other semiconductor devices can be easily assembled automatically by forming a frame in the same manner.

As described above, according to the manufacturing method of the present invention, a frame is formed by connecting a plurality of base pieces in series, a semiconductor element is attached to the frame, and each paste piece is then separated as a stem, which facilitates automatic assembly. This has the effect of making it possible to achieve this goal.

[Brief explanation of the drawing]

1A and 1B are a plan view and a partially cutaway side view, respectively, of a semiconductor laser device taken as an example to explain a conventional method of manufacturing a semiconductor device, and FIG. FIG. 3 is a plan view showing a frame for manufacturing a semiconductor device according to an embodiment, and FIG. 3 is a plan view showing nine semiconductor devices manufactured from the frame of FIG. 2. (3), (4)...External lead, (7)...Semiconductor element, (E)...Connecting piece,' (211) to (2
1! l)...Base piece, 0 force...Stem, (2)...
...7 reams. Note that the same reference numerals in the figures indicate the same or corresponding parts. Agent Makoto Kuzuno (1 other person) Figure 1 Figure 3 Procedural amendment (spontaneous) Patent 1”
Item 2. Name of the invention Method for manufacturing a semiconductor device 3. Person making the amendment 5. "Detailed description of the invention" of the specification to be amended 6. Contents of the amendment

Claims (1)

[Claims] (1) A frame consisting of a plurality of base pieces in which external leads are implanted and a connecting piece that connects these base pieces together is molded, and after that, the frame is conveyed continuously or intermittently, and each base piece is Using the reference point or reference plane of the base piece as a guide, each semiconductor element is sequentially positioned and fixed at a predetermined position, and then each base piece is moved from the frame to the position IwI'l! 1. A method of manufacturing a semiconductor device, characterized in that the semiconductor device is made to stand.