JPS5890753A - Tape connecting method - Google Patents

Abstract

PURPOSE:To obtain stable bonding condition and stably carry a film carrier tape by preparing for escape at the edge of tape connecting area. CONSTITUTION:After bonding a connecting tape 5 to the connecting area, both ends of tape connecting areas are punched with a punch 6a having the circular arc toward the center of tape or a punch 6b having an angled portion at the edge thereof, and thereby an escape by a circular or anglular cutting line can be formed. Thereby, a displacement generated by influence of a delicate error in accuracy of film carrier 1, accuracy of position and dimension of perforation 2', accuracy in position and dimension of positioning pin in the side of connecting jigs and thermal elongation of film carrier can be eliminated and stable transfer can be realized without any problems.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for splicing film tapes, and more particularly to a method for splicing film tapes using a tape splicer or the like in an editing process for film carrier tapes on which semiconductor devices are mounted.

Normally, a film carrier for connecting semiconductor devices is made by bonding copper foil to a strip-shaped flexible insulating film with holes for mounting semiconductors every few pitches of par 7 olefins, for example, 35U wide, and using photolithography. A foil-like lead frame is formed. In the film carrier method manufacturing process in which semiconductor devices are mounted and assembled on such a film carrier, defects in the film carrier tape, that is, defects in shape,
Due to factors such as tape defects due to damage, especially damage to the par 7 ore sheet 1, it may be necessary to cut and reconnect the defective tape section during the tape editing process, and to open and re-open the perforage seal. It's coming. Normally, this work is performed using a tape splicing jig, ie, a tape splicer.

FIG. 1 is a schematic diagram for explaining a good state of a film carrier connected by a tape connecting jig in an editing process. In the figure, 1 is a film carrier, 2 is a per-7 olefin, 3 is a lead frame formed on the film carrier, 4 is a semiconductor element, and 5 is a connecting tape. The method for connecting the film carrier 1 after being connected in the above mechanical arrangement is usually by using a tape connecting jig (not shown).
First, both ends of the film carrier 1 from which the defective tape portion has been cut are butted together on a connecting jig plate, and the perforation stamp 2 of the film is set in alignment with a positioning bin or the like on the plate for accurate positioning. After that, the connecting tape is pulled out and pasted on top of the film carrier 1, and then, using a par 7 olefin carbon punch and a cutter for cutting off unnecessary parts of the connecting tape 5, which are usually provided in the connecting jig, As shown, the connecting tape 5 is usually cut to the width of the film. Furthermore, there is a new par 7 on connection tape 5.
The oscilloscope 2' is opened and the tape connection is completed. In such connection work, the connection state is not always satisfactory.

In other words, the accuracy of the film carrier, the positional and dimensional accuracy of the %VC perforation, the positional and dimensional accuracy of the positioning pin on the connection jig side, and the slight errors due to the physical properties of the film carrier, especially shrinkage and elongation due to heat, etc. As a result, the connection state may be misaligned as shown in section A in FIG. This poses a problem in transporting the film carrier in the film carrier type manufacturing process, and is a cause of accelerated deterioration of the bonding state of the tape joint.

SUMMARY OF THE INVENTION An object of the present invention is to provide a film tape splicing method that solves the conventional problems by removing scratches on the end faces of the tape splicing parts.

A feature of the present invention is that, regarding the connection of film tape, the end face of the film tape connection part is punched with a nine-punch punch having a certain angle or circle toward the center of the tape, and a nick is removed at the tape connection part. It's in the film tape connection method.

Next, the film tape connection method of the present invention will be described in detail using the drawings. Figures 2 (1) and (b'') are explanatory diagrams of the embodiment of the present invention, and both figures are schematic diagrams for explaining the enlarged section A in Figure 1. In the figure, 6a is a nine punch punch with a circle, 6b is a punch punch with an angle, 7a,
7b shows the punched part of each punch. Film tape connection method F according to embodiments of the present invention
i First, after the connection state as shown in Fig. 1 or after pasting the connection tape 5 on the connection part, as shown in Fig. 2(a).
At the end face of the tape connection part shown in (b), use a punch 6a with a circle facing the center of the tape or a punch punch 6b with a certain corner threshold to punch out both ends of the tape connection part. , 7a17b shows a circle or an angled cut line to create a cut.

That is, according to the film tape connection method of the present invention, by creating a gap in the shape described above at the tape connection portion, stable conveyance of the film carrier tape and stable adhesion state of the tape connection portion are provided, and a semiconductor device using the film carrier method is provided. The effect will be shown in the production of.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram for explaining a conventional film tape connection state, and FIG. 2 is a schematic diagram for explaining a film tape connection method according to an embodiment of the present invention. In the figure, 1...film carrier tape, 2...perforage tape, 2...
A 7'[5 Occasionally opened par 7 Olesi,
3...Lid frame, 4...Semiconductor element, 5...Connecting tape, 6a...Nine punch with circle, 6b... ... Punch with an angle, 7a ... Nige with a circle, b
・・・・・・Shows an angle. Part A side Part 1 Figure 2 Procedural amendment (method) % formula % 1. Indication of case 1982 Patent application No. 1887
No. 89 No. 2, Title of the invention: Tape connection method 3, Relationship with the amended case: Applicant: 5-33-1-4, Shiba 5-chome, Minato-ku, Tokyo, Agent: 5-37-8 Shiba, Minato-ku, Tokyo 108 No. Sumira Mita Building 6, column for detailed explanation of the invention and column for brief explanation of drawings in the specification to be amended, and drawing 7, Contents of the amendment (1) "1. Figure 1
Figure (a) will be corrected as ". (2) "This is a schematic drawing" on page 2, line 15 of the specification,
[Schematic diagram, FIG. 1(b) is an enlarged view of the X portion in FIG. 1(m). ” I will correct it. lQl "Figure 1" on page 3, line 9 of the specification, [Figure 1]
I will correct it to J(a)J. (4) "Part A of Figure 1'" on page 3, line 19 of the specification,
We have corrected it to "Figure 1 (b)". (5) “A in Figure 1” on page 4, line 14 of the specification r
sr "X in Figure 1 (a)" is corrected. “Figure 1” on page 4, line 19 of the specification has been changed to “Figure 1 (a).
” I will correct it. On page 5 of the specification cylinder, lines 14 and 15, "No. 11...
...Figure 2 has been corrected as follows. [Figure 1(a) is a schematic diagram for explaining the conventional film tape connection state, Figure 1(b) is an enlarged view of the X section in Figure 1(a), Figure 2(a), ( (8) Figure 1 of the drawings is divided into sections as shown in the attached sheet. a)
, Figure 1 (b) 0 & Attachments catalog 1st copy / β2 ((2) skin 5 / coma (b)

Claims (1)

[Claims] Regarding the connection of the film tape, a film characterized in that the end face of the film tape connection part is punched with a punch having a certain angle or arc toward the center of the tape, and a nick is removed at the tape connection part. Tape connection method.