JPS5887368U - 発光ダイオ−ド - Google Patents

発光ダイオ−ド

Info

Publication number
JPS5887368U
JPS5887368U JP18246881U JP18246881U JPS5887368U JP S5887368 U JPS5887368 U JP S5887368U JP 18246881 U JP18246881 U JP 18246881U JP 18246881 U JP18246881 U JP 18246881U JP S5887368 U JPS5887368 U JP S5887368U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
pellet
metal
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18246881U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6236312Y2 (en, 2012
Inventor
田代　嘉宣
箕輪　文雄
Original Assignee
日本インタ−ナシヨナル整流器株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本インタ−ナシヨナル整流器株式会社 filed Critical 日本インタ−ナシヨナル整流器株式会社
Priority to JP18246881U priority Critical patent/JPS5887368U/ja
Publication of JPS5887368U publication Critical patent/JPS5887368U/ja
Application granted granted Critical
Publication of JPS6236312Y2 publication Critical patent/JPS6236312Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
JP18246881U 1981-12-08 1981-12-08 発光ダイオ−ド Granted JPS5887368U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18246881U JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Publications (2)

Publication Number Publication Date
JPS5887368U true JPS5887368U (ja) 1983-06-14
JPS6236312Y2 JPS6236312Y2 (en, 2012) 1987-09-16

Family

ID=29980855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18246881U Granted JPS5887368U (ja) 1981-12-08 1981-12-08 発光ダイオ−ド

Country Status (1)

Country Link
JP (1) JPS5887368U (en, 2012)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5271179A (en) * 1975-12-11 1977-06-14 Toshiba Corp Semiconductor device
JPS5610983A (en) * 1979-07-06 1981-02-03 Mitsubishi Electric Corp Composite semiconductor device

Also Published As

Publication number Publication date
JPS6236312Y2 (en, 2012) 1987-09-16

Similar Documents

Publication Publication Date Title
JPS5887368U (ja) 発光ダイオ−ド
JPS5892751U (ja) 発光ダイオ−ド素子
JPS58158460U (ja) 半導体発光装置
JPS5887367U (ja) 発光ダイオ−ド
JPS5918448U (ja) 光半導体装置
JPS5889956U (ja) 発光ダイオ−ド素子
JPS592171U (ja) 発光ダイオ−ドランプ
JPS60133653U (ja) 発光ダイオ−ド
JPS5872859U (ja) 低損失光散乱発光ダイオ−ド
JPS5811264U (ja) 半導体発光装置
JPS59195758U (ja) 発光ダイオ−ドランプ
JPS5887365U (ja) 反射型光電変換素子
JPS60135239U (ja) 車両用尾灯
JPS6049655U (ja) 発光ダイオ−ド装置
JPS5887366U (ja) 発光ダイオ−ド
JPS5977248U (ja) 発光ダイオ−ド
JPS59135657U (ja) 発光ダイオ−ド
JPS61106059U (en, 2012)
JPS58159583U (ja) 発光ダイオ−ド表示器
JPS5944059U (ja) 発光ダイオ−ド表示器
JPS5918453U (ja) 発光ダイオ−ド
JPS6113940U (ja) 半導体装置
JPS5851455U (ja) 発光ダイオ−ド
JPS5977250U (ja) 発光ダイオ−ド
JPS5892748U (ja) 半導体発光装置