JPS5887077A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPS5887077A JPS5887077A JP56185808A JP18580881A JPS5887077A JP S5887077 A JPS5887077 A JP S5887077A JP 56185808 A JP56185808 A JP 56185808A JP 18580881 A JP18580881 A JP 18580881A JP S5887077 A JPS5887077 A JP S5887077A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- alumina
- thermal head
- heating resistor
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 239000011521 glass Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract 2
- 238000005338 heat storage Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 5
- 238000001259 photo etching Methods 0.000 abstract description 2
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- 238000007740 vapor deposition Methods 0.000 abstract description 2
- 230000003647 oxidation Effects 0.000 abstract 1
- 238000007254 oxidation reaction Methods 0.000 abstract 1
- 238000000059 patterning Methods 0.000 abstract 1
- 239000010408 film Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 241000270666 Testudines Species 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
Abstract
Description
【発明の詳細な説明】
本発明はテーク、図形的・を記録するサーマルへラドに
関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thermal recorder for recording graphics.
従来より製法上大別すると厚膜形と薄膜形に分類される
。近年記録速度の高速化に伴い薄膜形のサーマルヘッド
が主流となりつつある。本発明も薄膜形に関し特に改良
されたサーマルヘッドを提供するものである。Traditionally, they have been broadly classified into thick film type and thin film type based on the manufacturing method. In recent years, as recording speeds have increased, thin-film thermal heads have become mainstream. The present invention also provides a particularly improved thermal head of the thin film type.
従来の薄膜形サーマルヘッドの断面描造を第1図に示す
。FIG. 1 shows a cross-sectional view of a conventional thin film thermal head.
第1図に於いて1はアルミナ等の絶縁性基板、2は前記
絶縁性基板に形成された、蓄熱ガラス層である。さらに
蒸着又はスパッタリング等で発熱抵抗体3、リード亀&
4、劇卑耗層5のjlに形成して成る。In FIG. 1, 1 is an insulating substrate made of alumina or the like, and 2 is a heat storage glass layer formed on the insulating substrate. Furthermore, by vapor deposition or sputtering, etc., heat generating resistor 3, lead turtle &
4. It is formed in the jl of the dramatically worn layer 5.
然しなから従来の構成でtユ発発熱かリード電極の厚み
分たけ凹状態となるためh11録紙との接触が不光全で
あり記録紙への熱伝達効率か悪いという欠点があった。However, in the conventional configuration, heat is generated or the lead electrode becomes concave due to its thickness, so that the contact with the H11 recording paper is not perfect and the heat transfer efficiency to the recording paper is poor.
本発明の目的は上記欠点に鑑み発熱体から記録紙への熱
伝達効率を向−卜せしめ消費電力を抵減可能なサーマル
へ、ドを提供することにある。SUMMARY OF THE INVENTION In view of the above-mentioned drawbacks, it is an object of the present invention to provide a thermal device that improves the heat transfer efficiency from the heating element to the recording paper and reduces power consumption.
本発明によれけり一ド霜、極を形成するためにアルミニ
ウムを被層し発熱払抗体」二もしくけ発熱抵抗体直下の
アルミニウムを陽極師化しアルミナ化成膜として残存さ
せる小により発熱抵抗体部分がフラットになるようにし
た事を特徴とする特許ルヘッドが得られる。According to the present invention, aluminum is coated to form a pole and the aluminum is coated to form a heat dissipating antibody.Aluminum directly under the heat generating resistor is anodized and remains as an alumina film formed on the small heat generating resistor portion. A patented head is obtained which is characterized in that the head is made flat.
以下本発明の一実施例を一曲を用いて祝鴫する。Hereinafter, one embodiment of the present invention will be celebrated using a song.
第2図の如く、アルミナ基極1の上に蓄熱ガラス層2ケ
形成する。次に従来知られている魚倉又はスパッタリン
ク等の方〃くでリート′出極4を形成するだめのアルミ
ニウム膜を松崩し七■抗体形成部のみ陽極酪化しつ′ル
ミナ化成服6合形成する。次にリード′!11極2をフ
ォトエ、ナンク法によりパターンニングする。As shown in FIG. 2, two heat storage glass layers are formed on the alumina substrate 1. Next, the remaining aluminum film for forming the REET's output electrode 4 is pine-broken using a conventionally known method such as a fish tank or a sputter link. do. Next, lead′! 11 poles 2 are patterned by photo-etching and NANC methods.
次に発熱抵抗着・3.1屋に崩5を形成し、て成る。Next, form a crack 5 on the heat generating resistor 3.1 and complete.
第2図Φ)は本発明の他の笑Aii+例を力、す。上記
実施例に於いて、発熱抵抗体3とリード電極4、アルミ
ナ化成膜6の製造]−程を入れ替えたものである。この
ようにして伶られたサーマルヘッドは発熱抵抗体部かフ
ラットであるため記録組への熱伝達効率が改告され印字
品位か艮くなると共に消費箪力紮低砂、出来るという効
果か認められた。Figure 2 Φ) shows another example of the invention. In the above-mentioned embodiment, the manufacturing steps of the heating resistor 3, lead electrode 4, and alumina chemical film 6 are replaced. Since the thermal head constructed in this way has a flat heating resistor, the efficiency of heat transfer to the recorder is improved, the printing quality becomes questionable, and it is recognized that it has the effect of reducing power consumption and reducing sand. Ta.
以上本発明の実施例について述へたかザーマルヘノドに
広く応用出来るものである。The embodiments of the present invention described above can be widely applied to thermal densities.
第1図は従来のサーマルへラドの基本朽成を示す断面昭
1、第2図(a)、 (b)i、を本発明の実施例を陵
、す」するだめのサーマルヘッド鵬面図で4つる。
■・・・・・・アルミナ基板、2・・・山蓄熱ガラス層
、3・・・・・・発熱抵抗体、4・・・・・リードを格
、5・・・・・劇厚粍層、6・・・・・・アルミナ化成
膜。Fig. 1 is a cross section showing the basic deterioration of a conventional thermal head, and Figs. So there are 4 vines. ■...Alumina substrate, 2...Heat storage glass layer, 3...Heating resistor, 4...Lead placement, 5...Thick layer , 6...Alumina chemical formation film.
Claims (1)
耐膠層を形成して構成されたサーマルヘッドにおいて、
前記Kmm鉢体アルミニウムで形成し、発熱抵抗体直下
もしくけ1゛−上のアルミニウムをアルミナ化して形成
したことを特徴とするサーマルヘッド。Heat storage glass cup, heating resistor, 11L polar conductor,
In a thermal head configured by forming an anti-glue layer,
A thermal head characterized in that the pot body is made of the above-mentioned Kmm aluminum, and the aluminum immediately below and above the heating resistor is aluminized.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56185808A JPS5887077A (en) | 1981-11-19 | 1981-11-19 | Thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56185808A JPS5887077A (en) | 1981-11-19 | 1981-11-19 | Thermal head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5887077A true JPS5887077A (en) | 1983-05-24 |
Family
ID=16177245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56185808A Pending JPS5887077A (en) | 1981-11-19 | 1981-11-19 | Thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5887077A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60137670A (en) * | 1983-12-26 | 1985-07-22 | Hitachi Ltd | Thermal head |
US8319809B2 (en) | 2008-01-31 | 2012-11-27 | Kyocera Corporation | Recording head and recording device |
-
1981
- 1981-11-19 JP JP56185808A patent/JPS5887077A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60137670A (en) * | 1983-12-26 | 1985-07-22 | Hitachi Ltd | Thermal head |
JPH0582302B2 (en) * | 1983-12-26 | 1993-11-18 | Hitachi Ltd | |
US8319809B2 (en) | 2008-01-31 | 2012-11-27 | Kyocera Corporation | Recording head and recording device |
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