JPS5885433A - Photomask - Google Patents
PhotomaskInfo
- Publication number
- JPS5885433A JPS5885433A JP56182274A JP18227481A JPS5885433A JP S5885433 A JPS5885433 A JP S5885433A JP 56182274 A JP56182274 A JP 56182274A JP 18227481 A JP18227481 A JP 18227481A JP S5885433 A JPS5885433 A JP S5885433A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- photomask
- wafer
- magnetic bubble
- bubble memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/60—Substrates
Abstract
Description
【発明の詳細な説明】
本発明はフォトマスク、特に磁気バブルメモリ素子のパ
ター ン形成用フォトマスクのマスク基板に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a photomask, particularly a mask substrate for a photomask for forming a pattern of a magnetic bubble memory element.
一般にフォトマスク基板には、各種のガラス基板が用い
られ、特に磁気バブルメモリ素子の微細パターン形成用
としての遠紫外線露光用には遠紫外線の吸収が少ない石
英ガラス基板が用いられている。Generally, various glass substrates are used as photomask substrates, and in particular, quartz glass substrates that absorb little deep ultraviolet rays are used for deep ultraviolet exposure for forming fine patterns of magnetic bubble memory elements.
しかしながら、磁気バブルメモリ素子の基板け、通常ガ
リウム・ガドリニウム・ガーネット基板(以下単にCG
、G基板と称する)で形成され、このG。However, the substrate for magnetic bubble memory devices is usually a gallium-gadolinium-garnet substrate (hereinafter simply CG).
, G substrate), and this G.
G、G、基板の熱膨張係数(8,0XIO−6)と、マ
スク形成用石英ガラス基板の熱膨張係数(0,5X10
−6)との熱膨張係数の差が太きいため、露光時の周囲
温度の偏差(バラツキ)による転写パターンのンビート
ずれが発生し易いという問題があった。このため、従来
では最小寸法約1μm程度の微細パターンを形成する場
合には、ウェーハ全面にマスクを高精度にマスク合わせ
する際、ウェーハとホトマスクの温度を±05℃程度に
保持させ、熱膨張によるVピートずれ全防止させていた
。G, G, thermal expansion coefficient of the substrate (8,0XIO-6) and thermal expansion coefficient of the quartz glass substrate for mask formation (0,5X10
-6), there was a problem in that beat deviation of the transferred pattern was likely to occur due to deviations (variations) in the ambient temperature during exposure. For this reason, conventionally, when forming a fine pattern with a minimum dimension of approximately 1 μm, the temperature of the wafer and photomask is maintained at approximately ±05°C when aligning the mask over the entire surface of the wafer with high precision. V-peat slippage was completely prevented.
したがって本発明は、磁気バブルメモリ素子のパターン
形成において、遠紫外露光、X線露光を用いてパターン
の微細化に見合った高精度のマスク合わせを可能にした
フォトマスクを提供することを目的としている。Therefore, an object of the present invention is to provide a photomask that enables highly accurate mask alignment commensurate with the miniaturization of patterns using deep ultraviolet exposure and X-ray exposure in pattern formation of magnetic bubble memory elements. .
匂下本発明の詳細な説明する。The present invention will now be described in detail.
本発明は、磁気バブルメモリ素子を形成するG。The present invention provides a magnetic bubble memory element that forms a magnetic bubble memory element.
G、G基板(ウェーハ)が、第1図に特性■で示すよう
に遠紫外線透過率が特性■で示す石英ガラス基板の遠紫
外線透過率とほぼ同等かつ十分に透過することに着目し
てフォトマスク基板をウエーハと同一材質であるG、
G、 G基板で形成したものである。We focused on the fact that the far-UV transmittance of the G,G substrate (wafer), as shown by the characteristic ■ in Figure 1, is almost the same as and sufficiently transmittance of the far-UV transmittance of the quartz glass substrate, as shown by the characteristic ■. G, where the mask substrate is made of the same material as the wafer;
It is formed using G and G substrates.
第2図はG、 G、G基板からなるウェーハとフォトマ
スクとを密着してマスク合わせした場合の温度の偏差(
バラツキ)によるレビートのずれ量を示した図であり、
縦軸け5crn当りのウェーハ上でのレヒートずれ量を
、横軸はフォトマスクおヨヒウエーハの温度をそれぞれ
示したものである。同図において、実線で示す特性Tは
本発明によるGGG基板からなるホトマスク、点線で示
す特性■は石英ガラスから々るホトマ7りである。この
場合、実験はKASPER社製の2001HRZ型マス
クアライナケ用いウェーハは予めパターンを形成したG
、G。Figure 2 shows the temperature deviation (
This is a diagram showing the amount of deviation in rebeat due to variations in
The vertical axis shows the reheat shift amount on the wafer per 5 crn, and the horizontal axis shows the temperature of the photomask and the wafer. In the figure, the characteristic T shown by a solid line is a photomask made of a GGG substrate according to the present invention, and the characteristic (2) shown by a dotted line is a photomask made of quartz glass. In this case, the experiment was conducted using a 2001 HRZ mask aligner manufactured by KASPER.
,G.
Gウェーハを用いた。そして、ずれ量の測定はスケール
を含んだパターンを形成後、光学顕微鏡により測定した
ものである。この場合、この測定の分解能は±0.1μ
mである。同図・から明らかなように露光時の周囲温度
の偏差(バラツキ)に対するVビートずれを確実に抑え
ることができる。A G wafer was used. The amount of deviation was measured using an optical microscope after forming a pattern including a scale. In this case, the resolution of this measurement is ±0.1μ
It is m. As is clear from the figure, it is possible to reliably suppress V-beat shift due to deviations (variations) in ambient temperature during exposure.
壇上説明したように本発明により、ば、熱膨張にによる
レビートのずれを確実に防止できるので、ウェーハ全面
での高精度のマスク合わせが可卵となり、高精度、高品
質の微細パターンが容易に得られるという極めて優れた
効果を有する。As explained on stage, the present invention can reliably prevent deviations in rebeat due to thermal expansion, making it possible to perform high-precision mask alignment over the entire wafer surface, making it easy to create high-precision, high-quality fine patterns. It has extremely excellent effects.
第1図は石英ガラス基板,G.G.G基板の波長に対す
る光透過率を示す特性図、第2図は温度の偏差(バラツ
キ)によるレピートずれ量を示す特性図である。Figure 1 shows a quartz glass substrate, G. G. FIG. 2 is a characteristic diagram showing the light transmittance of the G substrate with respect to wavelength, and FIG. 2 is a characteristic diagram showing the amount of repeat shift due to temperature deviation (variation).
Claims (1)
おいて、前記マスク基板にガリウム・ガドリニウム・ガ
ーネット基板を用いたことを特徴とするフォトマスク。1. A photomask for pattern formation of a magnetic bubble memory element, characterized in that a gallium gadolinium garnet substrate is used as the mask substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56182274A JPS5885433A (en) | 1981-11-16 | 1981-11-16 | Photomask |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56182274A JPS5885433A (en) | 1981-11-16 | 1981-11-16 | Photomask |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5885433A true JPS5885433A (en) | 1983-05-21 |
Family
ID=16115394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56182274A Pending JPS5885433A (en) | 1981-11-16 | 1981-11-16 | Photomask |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5885433A (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115073A (en) * | 1978-02-28 | 1979-09-07 | Cho Lsi Gijutsu Kenkyu Kumiai | Xxray exposure mask and method of fabricating same |
JPS56132343A (en) * | 1980-03-22 | 1981-10-16 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Mask for x-ray exposure and its manufacture |
-
1981
- 1981-11-16 JP JP56182274A patent/JPS5885433A/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS54115073A (en) * | 1978-02-28 | 1979-09-07 | Cho Lsi Gijutsu Kenkyu Kumiai | Xxray exposure mask and method of fabricating same |
JPS56132343A (en) * | 1980-03-22 | 1981-10-16 | Chiyou Lsi Gijutsu Kenkyu Kumiai | Mask for x-ray exposure and its manufacture |
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