JPS5878436A - Assembled body of test probe - Google Patents

Abstract

PURPOSE:To fix the probe of each layer at a time while reducing the thickness of a block by coating the proper section of respective probe with the layer of an insulating material in an apparatus, the block thereof contains the probes mounted in plural layers in order to check a semiconductor chip, to a surface section at the inside thereof an electrode extracting section is formed. CONSTITUTION:The assembled body contains a board 1 supporting a proper number of the probes, and a hole 2 is formed at the adequate position of the board 1. The board 1 is flat, and is made of a proper material such as synthetic resin. The block 3 molded with epoxy resin or ceramics or the like is set up into the hole 2 of the board 1. The probes 10 are mounted in plural layers by epoxy resin 3' in the block 3 and cross in three dimensions, the proper sections 12 of each probe 10 are coated with the layers 14 of the insulating material, and the mutual electrical contact of the probes 10 is prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a test probe assembly for a semiconductor chip incorporating a microelectronic device therein. This invention relates to an improvement of a test probe assembly for checking semiconductor chips.

Conventionally, a semiconductor chip has an electrode lead-out part around its periphery, from which a lead wire is taken out. A suitable number of electrode extraction parts are now installed on the surface of the A test probe assembly for checking such a semiconductor chip consists of a group of probes whose tips contact each electrode extraction part around the chip, and a group of probes whose tips contact each electrode extraction part inside the chip. Consisting of groups, these probes are mounted around an aperture in a block mounted on the board, in which the probes are arranged in layers for each group, thus being mounted in multiple layers. However, in the manufacturing process of conventional test probe assemblies, each probe belonging to one layer is first installed around the opening of the board using epoxy resin, and after the resin dries, each probe of the next layer is attached to its own. It took a lot of time to manufacture because it had to be installed on a block and fixed with resin in the same way, and each layer had to be done sequentially like this! -It took a lot of time. Furthermore, since the probes cross three-dimensionally with probes on other layers, the distance between the eyebrows of the probes had to be increased to avoid contact between the probes, which resulted in the disadvantage of increasing the thickness of the block. .

The present invention overcomes the drawbacks of the prior art described above, and comprises:
SUMMARY OF THE INVENTION It is an object of the invention to provide a test probe assembly that is easy to manufacture and convenient to handle.

To achieve the above object, a test probe assembly for a semiconductor chip according to the present invention includes probes provided in multiple layers in a block in order to check a semiconductor chip that also has an electrode extraction part on the inner surface part. The main body portion of each probe is coated with a layer of insulating material, so that each layer of probes can be fixed at once and the thickness of the block can be reduced.

Next, an embodiment of the test probe assembly according to the present invention will be described with reference to the drawings. FIG. 1 shows the entirety of an example of the test probe assembly embodying the present invention.
This assembly consists of a board (1) that supports the appropriate number of probes.
A hole (2) is formed at an appropriate position on the board 111. This hole 121 Fi is often circular, but may have other shapes.

A board (IJFi flat plate made of a suitable material such as synthetic resin).This board (11 holes + 21 [d) A block (3
) will be installed. In this embodiment, a circular opening (4) is formed in the center of the block (3), and an appropriate number of probes are fixed around the opening (4).

The test probe assembly d1 to which the present invention relates is for checking a semiconductor chip which is also provided with an electrode extraction part on the inner surface part, and therefore, as shown in FIG. are provided in multiple layers in the block (3) using epoxy resin 13') and intersect three-dimensionally. Each probe 0I is made of a thin electrically conductive wire, - in the example approximately 2 cm long and approximately 02 m in diameter.
m wire, preferably made of tungsten or beryllium-copper alloy. and each probe (IG
are gathered at the position of the aperture 14), each tip being pointed and lying in a common plane (A). The diameter of the tip of the probe fil is usually 50 to 60 Pm.

The main feature of the invention is that the body portion (121) of each probe (II) is coated with a layer I of insulating material, as shown in FIGS. This is to prevent electrical contact.Each probe tl
A dielectric material such as glass or quartz is preferably used as the insulating material constituting the covering layer a4. A layer of a conductor (151) such as copper or nickel is coated by vapor deposition or electroless plating on the layer I to be processed as desired.
It may be structured like a coaxial shielded cable for high frequency measurements.

The connection end (131) of each probe II is connected to the printed circuit (5) by a hook 2, etc., and connected to the tester (7) by the printed circuit and cable (6).
Each probe (it) is connected to a coaxial shielded cable (8
) to the tester (7), in which case the connection end (8a) of each cable (8) is connected to the probe +I
It has a shape that mates with the end of I (131).If each probe is connected to the tester (7) by the coaxial shield cable (81 & Since only the tip part (111 and its vicinity) can be used, it is possible to prevent electrical noise caused by radio waves, allowing accurate testing and testing using ultra-high frequencies. Note that ■ in Figure 3 is a semiconductor chip. be.

An additional feature of the present invention is that when a semiconductor chip is checked by a test probe assembly, the same force is applied to the tip of each probe when the tip of the probe contacts the corresponding electrode extraction portion of the chip. Therefore, as shown in Figure 6, a group of probes (lQa) whose tips are on the outside in the common plane (A) VC are compared to probes whose tips are on the inside (10bχ(10c)). Each probe (II is the old tip) is made of thin wire.
is bent from the main body part H and is perpendicular to the plane of the board (1), but it is a cantilevered rod that receives the load at the tip, so the probe with the tip inside has a lower body than the probe with the tip outside. Since the length of the section is large, a relatively large bending rigidity is required11, and the probe whose tip is inside is made of a thick wire. Note that the main body part (12) of the probe here refers to the intermediate part other than the tip part (lυ and the opposite connection end (13), and the probe (lO) is the main part (blocked at 1z). (31K is fixed.The tip of the probe (old)) is longer as the tip is on the inside, and the length of each tip is determined from the outside as Ja, No.b, and No.C. Then, no.

(Jb < JQ. If the same force is applied to the tip of each probe, accurate characteristic checks can be made and the life of the probe assembly can be improved.

In the above embodiment, the opening (4) of the block (3) is circular, but the shape of the opening (4) is not limited to circular, and may be other shapes such as square. Furthermore, the block (3) may be provided with a plurality of openings (4),
For example, there may be two as shown in FIG. When there are multiple openings (4), an appropriate number of probes α are installed around each opening. It should be understood that the present invention can be similarly implemented even when a plurality of openings (4) are formed in the block (3). Needless to say, if there are two openings, for example, two semiconductor chips can be checked at the same time.

As described above, according to the present invention, the body portion of each probe is coated with a layer of insulating material, so there is no risk of electrical contact even when the probes are installed in a three-dimensional intersection, and the mounting block There is no need to fix the probes to the block during blowing, and all the probes can be placed at once and fixed at the same time using epoxy resin, making it easy to manufacture.

[Brief explanation of drawings]

FIG. 1 is a plan view of a test probe assembly according to an example of the present invention, and FIG. 2 is an enlarged view somewhat schematically showing the main parts thereof.
Figure 3 is a sectional view taken along line S-S in Figure 2;
The figure is a sectional view similar to FIG. 3C showing another embodiment, and FIG. 5 is a plan view of the main part showing still another embodiment. In the figure, 1... Board, 2... Hole, 6... Block, 4... Opening, 5... Printed circuit, 7... Tester, 8... Coaxial shield cable, 10... ... Probe, 14... Layer of insulating material, 15... Layer of conductor

Claims (1)

[Scope of Claims] (1) A test probe assembly for checking a semiconductor chip having an electrode extraction portion also on an inner surface portion, the assembly comprising: a board having one hole; The board includes a block having an opening or a plurality of openings therein, and a suitable number of probes made of thin conductive wire arranged at an angle around the opening. the probes have their respective tips collected on a common surface at the location of the opening and are provided in a plurality of layers at the location of the block, and the body portion of each probe is coated with a layer of insulating material. (2. In the assembly according to claim 1,
The test probe assembly wherein the insulating material is a dielectric material. I3) A test probe assembly according to claim 2, wherein the layer of dielectric material is further coated with a layer of conductor. (4) In the assembly according to claim 1, the probe has a tip on the outside of the common surface and is made of a thinner wire than a probe with the tip on the inside. probe assembly. (5) The test probe assembly according to claim 1, wherein the block is provided with one of the openings. (6) In the assembly according to claim 1, the test probe assembly is provided with a plurality of the openings in the block &Cd. (7) 2% allowance The test probe assembly according to claim 1, wherein the connecting end of each probe is connected to a tester via a printed circuit. (8) The test probe assembly according to claim 1, wherein the connection end of each probe is connected to a tester by a coaxial shielded cable.