JPS5876829A - Low molecular weight resist of high resolution - Google Patents

Low molecular weight resist of high resolution

Info

Publication number
JPS5876829A
JPS5876829A JP17372581A JP17372581A JPS5876829A JP S5876829 A JPS5876829 A JP S5876829A JP 17372581 A JP17372581 A JP 17372581A JP 17372581 A JP17372581 A JP 17372581A JP S5876829 A JPS5876829 A JP S5876829A
Authority
JP
Japan
Prior art keywords
resist
cyclized
weight
molecular weight
weight average
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17372581A
Other languages
Japanese (ja)
Inventor
Chiharu Kato
千晴 加藤
Hatsuo Nakamura
中村 初雄
Kiyoto Mori
森 清人
Masahiko Igarashi
五十嵐 正彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Kanto Chemical Co Inc
Original Assignee
Toshiba Corp
Kanto Chemical Co Inc
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Kanto Chemical Co Inc, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP17372581A priority Critical patent/JPS5876829A/en
Publication of JPS5876829A publication Critical patent/JPS5876829A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To decrease swelling and dissolving phenomena by developing solns. and to improve resolution by decreasing the weight average mol.wt. of cyclized rubber and decreasing the degrees of dispersion of mol.wt. CONSTITUTION:The weight average mol.wt. of cyclized polyisoprene or cyclized polybutadiene is decreased to 10,000-50,000, whereby the degrees of dispersion of mol.wt., that is, the ratio of weight average mol.wt./number average mol.wt. is decreased to about 1.2-1.4. In the case of UV sensitive resist, a compsn. consisting of (a) 2-10% a cross-linking agent or a sensitizer, (b) 0.1-10wt% a stabilizer and (c) the balance the above-mentioned cyclized rubber is used, and in the case of far UV, X-rays and electron ray sensitive resist, a compsn. consisting of 2-30wt% (a), and 0.1-30wt% (b) is used. An arom. monocyclic hydrocarbon such as xylene is used for the solvent that dissolves said solid components (a), (b), (c), whereby the resist compsn. is prepd.

Description

【発明の詳細な説明】 本発明は、環化ゴム系レジストの組成に関するものであ
る。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the composition of a cyclized rubber resist.

環化ゴム系レジストは、イソプレン等の原料ゴムを触媒
を用いて環化させ、紫外線等により活性化する架橋剤・
増感剤を配合し、その細光、酸素、熱等に対する安定剤
を加え、キシレン等の溶剤に溶かしたもので、紫外線等
を照射すると露光部・が架橋反応を起して重合する、ネ
ガタイプのレジストである。
Cyclized rubber-based resists are made by cyclizing raw material rubber such as isoprene using a catalyst, and then using a crosslinking agent that is activated by ultraviolet light, etc.
A negative type that contains a sensitizer and a stabilizer against dim light, oxygen, heat, etc., and is dissolved in a solvent such as xylene. When exposed to ultraviolet rays, etc., the exposed area undergoes a crosslinking reaction and polymerizes. It is a resist of.

しかしながら、環化ゴム系レジストは、基板に対して密
着性がよく脆性による欠陥の発生がないという利点があ
るが、露光後レジストを有機溶剤で現像・リンスを行な
うと現像膨潤が発生しポジタイプレジストと比較して解
像度が悪いという問題があった。
However, cyclized rubber-based resists have the advantage of good adhesion to the substrate and no defects due to brittleness, but if the resist is developed and rinsed with an organic solvent after exposure, development swelling occurs, resulting in a positive type. There was a problem that the resolution was poor compared to resist.

この問題を改善するために、現゛像液をキシレン主体の
ものから、膨潤の少ないヘプタンのような炭素数5〜1
2の脂肪族炭化水素系のものに変更使用する方法や、ま
だ実用的となっていないが、湿式現像から、現像膨潤の
起らない乾式現像とする方法が試みられている。本発明
は、現像液や現像方法を改善するものではなく、レジス
ト材料そのものを改善するものであり、現像膨潤を少な
くして解像度を高めた環化ゴム系レジストを提供しよう
とするものである。
In order to improve this problem, we changed the developer solution from one based on xylene to a developer with 5 to 1 carbon atoms, such as heptane, which has less swelling.
Attempts have been made to change to aliphatic hydrocarbons (2) and to change from wet development to dry development, which does not cause development swelling, although this has not yet become practical. The present invention does not improve the developer or the developing method, but rather improves the resist material itself, and aims to provide a cyclized rubber resist with improved resolution by reducing development swelling.

即ち、本発明は固形成分と溶剤とからなり、固形成分と
して、(イ)2〜10重量%の架橋剤及び/又は増感剤
、(ロ)0.1〜10重量%の安定剤、並びに(ハ)残
量の、重量平均分子量がio、ooo〜50,000で
ある環化ポリイソプレン及び/又は環化ポリブタジェン
を含有して成る紫外線感光性レジストであり、また他の
本発明は、(イ)の架橋剤及び/又は増感剤量を固形成
分の2〜30重量%とし、架橋剤及び増感剤は遠紫外線
、X線及び電子線により活性化するものを用い←)の安
定剤量を固形成分の01〜30重量%とした点が上記紫
外線感光性レジストと異なる遠紫外線、X線及び電子線
感光性レジストである。
That is, the present invention consists of a solid component and a solvent, and the solid components include (a) 2 to 10% by weight of a crosslinking agent and/or sensitizer, (b) 0.1 to 10% by weight of a stabilizer, and (c) An ultraviolet-sensitive resist comprising the remaining amount of cyclized polyisoprene and/or cyclized polybutadiene having a weight average molecular weight of io, ooo to 50,000; The amount of the crosslinking agent and/or sensitizer in b) is 2 to 30% by weight of the solid component, and the crosslinking agent and sensitizer are those activated by deep ultraviolet rays, X-rays, and electron beams, and the stabilizer in ←) This resist is sensitive to deep ultraviolet rays, X-rays, and electron beams, and differs from the above-mentioned ultraviolet-sensitive resists in that the amount is 01 to 30% by weight of the solid components.

本発明のレジストに用いる環化ゴムは、重量平均分子量
がio、ooo〜50,000の範囲にしなければなら
ない。重量平均分子量の測定はゲル・パーミエイション
・クロマトグラフィの方法による数値である。従来のレ
ジストの重量平均分子量はioo 、 ooo〜200
 、000程度であり、その分子鎖長を電子顕微鏡下で
観察すると、03〜0.5μm程度である。そして合成
ポリイソプレンから作製されたレジストの分子鎖長け0
.3〜0.5μm程度と比較的そろっ□ているが、天然
ゴムから作製されたものはさらに分子鎖長が不ぞろいに
なっている。
The cyclized rubber used in the resist of the present invention must have a weight average molecular weight in the range of io, ooo to 50,000. The weight average molecular weight is determined by gel permeation chromatography. The weight average molecular weight of conventional resists is ioo, ooo ~ 200
, 000, and when its molecular chain length is observed under an electron microscope, it is approximately 0.03 to 0.5 μm. And the molecular chain length of the resist made from synthetic polyisoprene is 0.
.. The molecular chain lengths are relatively uniform at about 3 to 0.5 μm, but those made from natural rubber have even more uneven molecular chain lengths.

これに対し、本発明の環化ゴムは重量平均分子量が10
 、000〜50 、000であるので、その分子鎖長
け0.1〜0.2μm程度の短いものとなる。
In contrast, the cyclized rubber of the present invention has a weight average molecular weight of 10
,000 to 50,000, the molecular chain length is as short as about 0.1 to 0.2 μm.

第1図に示すように、ウェハ1に塗布したホトレジスト
膜2がホトマスク6を透して紫外線(矢印)で露光され
ると、架橋反応部4においては、環化ゴムポリマー(実
線)が架橋結合(点線)をして重合し巨大分子とカリ、
未架橋部5においては、環化ゴムポリマー(実線)は架
橋結合を起さない。このホトレジスト膜2を現像すると
、未架橋部5の架橋しないポリマーは溶解除去されるが
、一端が架橋反応部4にあって架橋したポリマーは残さ
れて、分子鎖長の分だけはみだしてギザギザとなったパ
ターン線が現像される。若し・々ターン幅が侠〈て、左
右からはみだした環化ゴムポリマーが連結されてしまう
とパクーニングができなくなる。本発明のレジストは、
分子鎖長が短いので、極めてシャープなパターン像を得
、解像度を高めることができる。
As shown in FIG. 1, when the photoresist film 2 coated on the wafer 1 is exposed to ultraviolet light (arrow) through a photomask 6, the cyclized rubber polymer (solid line) is crosslinked in the crosslinking reaction area 4. (dotted line) and polymerizes into macromolecules and potassium,
In the uncrosslinked portion 5, the cyclized rubber polymer (solid line) does not cause crosslinking. When this photoresist film 2 is developed, the non-crosslinked polymer in the uncrosslinked part 5 is dissolved and removed, but the crosslinked polymer whose one end is in the crosslinking reaction part 4 is left behind and protrudes by the length of the molecular chain, resulting in jagged edges. The resulting pattern lines are developed. If the turn width is too narrow and the cyclized rubber polymers protruding from the left and right sides are connected, pacooning will not be possible. The resist of the present invention is
Since the molecular chain length is short, extremely sharp pattern images can be obtained and resolution can be improved.

次に、環化ゴム系レジストにおける解像度を悪くしてい
る主要因子である現像膨潤に関し、本発明の詳細な説明
する。環化ゴム系レジストの現像反応は、現像液による
膨潤溶解現象である。膨潤はレジスト中の現像液の濃度
差により生ずる勢拡散により起り、レジスト中の現像液
濃度が一定(c。
Next, the present invention will be described in detail with regard to development swelling, which is a major factor that deteriorates resolution in cyclized rubber resists. The development reaction of a cyclized rubber resist is a swelling and dissolving phenomenon caused by a developer. Swelling occurs due to force diffusion caused by the difference in concentration of the developer in the resist, and the concentration of the developer in the resist remains constant (c).

なるまで膨潤現象は止まらない。本発明のように、環化
ゴムの平均分子量(M(りを小さく、即ち低分子量にす
れば、膨潤量Qは、式 %式%(: 溶媒の相互作用係数、ρ、:ボリマ一の密度、■、:溶
媒のモル容積)に従って小さくすることができる。
The swelling phenomenon will not stop until this happens. As in the present invention, if the average molecular weight (M) of the cyclized rubber is made small, that is, the molecular weight is made low, the swelling amount Q can be calculated using the formula % formula % (: interaction coefficient of solvent, ρ,: density of the polymer ,■,: molar volume of solvent).

更に、環化ゴムの重量平均分子量を小さくすることによ
って、一般に分子量の分散域を小さくすることができる
。分散度は、重量平均分子量/数平均分子量の比(MW
/MN)として表わすことができる。従来のレジストの
”W/MNは2.0〜2.5程度であったが、本発明の
レジストのMW/ MN は1.2〜1.4程度と分散
度が従来のものより改善された。特に原材料としてアニ
オン重合法による半分布のポリイソプレンゴムを用いて
環化させたところのレジストは分散度が極めて良いので
望ましい。分散度が良くなれば11分子鎖長の長いもの
は少なくなり、また膨潤の大きい高分子量のものも少な
くなり、高解像度のレジストが得られる。
Furthermore, by reducing the weight average molecular weight of the cyclized rubber, the molecular weight dispersion range can generally be reduced. The degree of dispersion is the ratio of weight average molecular weight/number average molecular weight (MW
/MN). The W/MN of conventional resists was about 2.0 to 2.5, but the MW/MN of the resist of the present invention was about 1.2 to 1.4, which is an improvement in dispersion compared to conventional resists. In particular, a resist made by cyclizing a half-cloth polyisoprene rubber produced by anionic polymerization as a raw material is desirable because it has an extremely good dispersion degree.The better the dispersion degree, the fewer the long molecular chain lengths. Furthermore, the amount of high-molecular-weight materials that cause large swelling is reduced, and a resist with high resolution can be obtained.

環化ゴムとして利用できる原材料はポリイソプレンゴム
、ポリブタジェンゴムがある。環化には硫酸、パラトル
エンスルホニルクロリド、塩化スず等の触媒を用いて反
応させることができる。
Raw materials that can be used as cyclized rubber include polyisoprene rubber and polybutadiene rubber. The cyclization can be carried out using a catalyst such as sulfuric acid, para-toluenesulfonyl chloride, or tin chloride.

架橋剤は2,6−ジー(4′−アジドベンザル)4−メ
チルンクローへキサノン等のビスアジド化合物を、安定
剤は4,4′−ブチリデンビス−(6−t−ブチル−η
1−クレゾール);のようなフェノール系等の光、熱、
酸化に対して安定性を与える化合物を用いる。増感剤は
感光波長領域を拡げ又は露光量に対する感光濃度の比を
大きくすることのできる化合物を用いる。
The crosslinking agent is a bisazide compound such as 2,6-di(4'-azidobenzal)4-methylchlorhexanone, and the stabilizer is 4,4'-butylidenebis-(6-t-butyl-η).
1-Cresol);
Compounds that provide stability against oxidation are used. As the sensitizer, a compound capable of expanding the sensitive wavelength range or increasing the ratio of the photosensitive density to the exposure amount is used.

架橋剤・増感剤”の量は、紫外線感光性ホトレジストの
場合には、環化ゴム、架橋剤、増感剤及び安定剤からな
る固形成分の2〜101重量%となる量を、遠紫外線、
X線及び電子線感光性レジストの場合には、固形成分の
2〜30重量%となる量を、感光性とレジスト性能の劣
化とを考慮して定められる。安定剤は架橋剤・増感剤の
量に応じた量として夫々添加される。固形成分の残量は
環化ゴムが占めるが、所望の性能を示す若干の副資材を
配合するのは差支えない。本′発明の架橋剤の添加量は
、従来のレジストにおける添加量に比べて若干多いめに
するのがよい。
In the case of ultraviolet-sensitive photoresists, the amount of crosslinking agent/sensitizer is 2 to 101% by weight of the solid components consisting of cyclized rubber, crosslinking agent, sensitizer, and stabilizer. ,
In the case of X-ray and electron beam-sensitive resists, the amount is determined to be 2 to 30% by weight of the solid components, taking into consideration photosensitivity and deterioration of resist performance. The stabilizer is added in an amount depending on the amount of the crosslinking agent and sensitizer. Although the remaining amount of the solid component is occupied by the cyclized rubber, there is no problem in blending some auxiliary materials that exhibit the desired performance. The amount of the crosslinking agent of the present invention is preferably slightly larger than that of conventional resists.

固形成分を溶解する溶剤はキシレン等芳香族単環式炭化
水素を主成分とするものであればよい。
The solvent for dissolving the solid component may be one containing an aromatic monocyclic hydrocarbon such as xylene as a main component.

本発明のレジストによれば、環化ゴムが低分子量であり
その分散度も小さいために、分子鎖長が短く膨潤が少な
く、従来解像度が3μ711程度であったものが2μm
程度となり、約1μmの解像度の改善ができる。また、
塗膜の厚さも十分得られ、感度も亦従来品と遜色のない
ものである。
According to the resist of the present invention, since the cyclized rubber has a low molecular weight and its degree of dispersion is small, the molecular chain length is short and there is little swelling, and the resolution of the conventional resist, which was about 3μ711, is reduced to 2μ.
The resolution can be improved by about 1 μm. Also,
The coating film is sufficiently thick, and the sensitivity is comparable to conventional products.

以下に本発明の実施例とその効果について具体的に説明
する。
Examples of the present invention and their effects will be specifically described below.

実施例 合成ポリインプレンを不飽和度7.1%となるように環
化反応し、重量平均分子量MW40,900、数平均分
子量IN 34,500、分散度MW/MN 1 、1
9の環化ポリイソプレンを4た。この環化ポリインプレ
ン14.0重量部(以下部とあるのは重量部)、2.6
−ジー(4′−アジドベンザル)−4−メチルシクロヘ
キサノン3.4部、フェノール系安定剤1,0部をキシ
レン81.4部に溶かして、25℃で18.60Pの紫
外線感光性レジストを得た。
Example Synthetic polyimprene was cyclized to give an unsaturation degree of 7.1%, weight average molecular weight MW 40,900, number average molecular weight IN 34,500, dispersity MW/MN 1,1.
9 cyclized polyisoprene was added to 4. 14.0 parts by weight of this cyclized polyimrene (hereinafter "parts" are parts by weight), 2.6 parts by weight
-G(4'-azidobenzal)-4-methylcyclohexanone (3.4 parts) and 1.0 parts of phenolic stabilizer were dissolved in 81.4 parts of xylene to obtain a UV-sensitive resist of 18.60P at 25°C. .

比較例として市販の環化ポリイソプレンレジストを採っ
た。この環化ポリイソプレンは不飽和度6.9%、Mw
 149,000、MN 65,000、MW/MN2
.28であった。架橋剤濃度は2.8重量%、固形成分
含有率は13.1重量%で、25℃で60 cPの粘度
を有するレジストであった。
A commercially available cyclized polyisoprene resist was used as a comparative example. This cyclized polyisoprene has a degree of unsaturation of 6.9% and a Mw
149,000, MN 65,000, MW/MN2
.. It was 28. The crosslinking agent concentration was 2.8% by weight, the solid component content was 13.1% by weight, and the resist had a viscosity of 60 cP at 25°C.

この実施例と比較例の解像度を比較するのに、ウェハ上
に1.0μmの膜厚にレジストを塗布し、1.50 、
1.75 、2.0 、2.5 、3.0 、3.5 
、4μm幅のテストパターンでパターニングしたところ
、比較例(市販品のなかで最も高解像度のものである)
の最小解像度は3.0μm程度であり、これより小さい
寸法ではパターンがゆがんだり直線性が得られなかった
。これに対し実施例の最小解像度は2.0μmであり、
約1.0μmの解像度の改善が行なわれた。
To compare the resolution of this example and the comparative example, a resist was coated on the wafer to a thickness of 1.0 μm, and the resolution was 1.50 μm.
1.75, 2.0, 2.5, 3.0, 3.5
, when patterned with a 4 μm wide test pattern, a comparative example (the one with the highest resolution among commercially available products)
The minimum resolution is about 3.0 μm, and if the size is smaller than this, the pattern is distorted or linearity cannot be obtained. On the other hand, the minimum resolution of the example is 2.0 μm,
An improvement in resolution of approximately 1.0 μm was achieved.

また塗膜の厚さは、実施例のホトレジストは低分子量の
し゛シストであるにもかかわらず、4000rpmの回
転数のスピンコータで約1.15μmの塗布膜厚が得ら
れ、実用上側等問題はなかった。また感度も、マスクア
ライナ−P LA、 500 F (キャノン社製)の
積算露光計で評価した結果、塗布膜厚が1.0μ2n 
のとき第2図の感度が得られており、実用的にも全く問
題のないことがわかる。この点について、ポリマーの分
子量が小さくなると感度が悪くなるのが一般であるが、
本発明のレジストは分子量の分布が狭くなっているため
に高感度にな′っているものと考えられる。次に光照射
部の現像後の残膜率も、第2図のとおり、従来のホトレ
ジストと比較して同等であり、実用的なホトレジストで
あることがわかる。
Regarding the thickness of the coating film, although the photoresist of the example is a low molecular weight resist, a coating film thickness of approximately 1.15 μm was obtained using a spin coater with a rotation speed of 4000 rpm, and there were no problems in practical terms. Ta. The sensitivity was also evaluated using a mask aligner PLA and a 500 F (manufactured by Canon) integrating exposure meter, and the coating film thickness was 1.0μ2n.
It can be seen that the sensitivity shown in Figure 2 is obtained when , and there is no practical problem at all. Regarding this point, it is common that the sensitivity decreases as the molecular weight of the polymer decreases.
It is believed that the resist of the present invention has a narrow molecular weight distribution and therefore has high sensitivity. Next, as shown in FIG. 2, the residual film rate after development in the light irradiated area is also the same as that of conventional photoresists, indicating that it is a practical photoresist.

次に解像度の目安としてよく用いられるγ値を比較する
。γ値は1、横軸に露光エネルギーを縦軸に現像後の膜
厚/塗布膜厚の残膜率をとって特性曲線を描きその直線
傾斜部の勾配であって、残膜率の露光エネルギー依存性
を示す。このγ値が大きい程高解像度となる。実施例の
塗布膜厚1.0μmの特性曲線を第2図に、比較例の同
じく特性曲線を第6図に示す。第2,6図にみるように
、市販品である比較例のγ値が1.67であるのに対し
、実施例のそれは5.25 であり、この点からも本発
明のレジストが極めて高解像度のものであることがわか
る。
Next, we will compare the γ value, which is often used as a measure of resolution. The γ value is 1, the horizontal axis is the exposure energy, and the vertical axis is the film thickness after development/remaining ratio of coated film thickness, and the slope of the linear slope is the slope of the linear slope, which is the exposure energy of the residual film ratio. Show dependencies. The larger the γ value, the higher the resolution. FIG. 2 shows the characteristic curve of the example with a coating film thickness of 1.0 μm, and FIG. 6 shows the same characteristic curve of the comparative example. As shown in Figures 2 and 6, the γ value of the commercially available comparative example is 1.67, while that of the example is 5.25, and from this point of view, the resist of the present invention has an extremely high γ value. It can be seen that the resolution is high.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はレジスト現像時の分子鎖長と解像度との関係の
説明図、第2図は実施例の特性曲線を示すグラフ、第3
図は比較例の特性曲線を示すグラフである。 2・・・レジスト膜、4・・・架橋反応部、5・・・未
架橋部。 特許出願人  東京芝浦電気株式会社 代理人   弁理士 諸田英二 第1図
Fig. 1 is an explanatory diagram of the relationship between molecular chain length and resolution during resist development, Fig. 2 is a graph showing the characteristic curve of the example, and Fig. 3 is a graph showing the characteristic curve of the example.
The figure is a graph showing a characteristic curve of a comparative example. 2... Resist film, 4... Crosslinked reaction part, 5... Uncrosslinked part. Patent applicant Tokyo Shibaura Electric Co., Ltd. Agent Patent attorney Eiji Morota Figure 1

Claims (1)

【特許請求の範囲】 1 固形成分と溶剤とからなり、固形成分として、 (イ) 2〜10重量%の架橋剤及び/又は増感剤、(
ロ) 0.1〜10重量%の安定剤、並びにC) 残量
の、重量平均分子量が10,000〜50.000であ
る環化ポリイソプレン及び/又は環化ポリブタジェン を含有して成る紫外線感光性レジスト。 2 固形成分と溶剤とからなり、固形成分として、 (イ) 2〜30重量%の架橋剤及び/又は増感剤、(
ロ) 0.1〜30重量%の安定剤、並びに(ハ)残量
の、重量平均分子量が10,000〜so、dooであ
る環化ポリイソプレン及び/又は環化ポリブタジェン を含有して成る遠紫外線、X線及び電子線感光性レジス
ト。
[Scope of Claims] 1 Consists of a solid component and a solvent, as solid components: (a) 2 to 10% by weight of a crosslinking agent and/or sensitizer;
b) 0.1 to 10% by weight of a stabilizer, and C) the remaining amount of cyclized polyisoprene and/or cyclized polybutadiene having a weight average molecular weight of 10,000 to 50,000. Sex resist. 2 Consists of a solid component and a solvent, as solid components: (a) 2 to 30% by weight of a crosslinking agent and/or sensitizer;
b) 0.1 to 30% by weight of a stabilizer, and (c) a residual amount of cyclized polyisoprene and/or cyclized polybutadiene having a weight average molecular weight of 10,000 to so, doo. UV, X-ray and electron beam sensitive resists.
JP17372581A 1981-10-31 1981-10-31 Low molecular weight resist of high resolution Pending JPS5876829A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17372581A JPS5876829A (en) 1981-10-31 1981-10-31 Low molecular weight resist of high resolution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17372581A JPS5876829A (en) 1981-10-31 1981-10-31 Low molecular weight resist of high resolution

Publications (1)

Publication Number Publication Date
JPS5876829A true JPS5876829A (en) 1983-05-10

Family

ID=15965979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17372581A Pending JPS5876829A (en) 1981-10-31 1981-10-31 Low molecular weight resist of high resolution

Country Status (1)

Country Link
JP (1) JPS5876829A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081158A (en) * 1983-10-11 1985-05-09 Hitachi Ltd Radiation-sensitive substance
JPH05158238A (en) * 1991-09-24 1993-06-25 Toppan Printing Co Ltd Method for preventing generation of development scum of electron beam crosslinking type resist

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136020A (en) * 1974-04-16 1975-10-28
JPS5598742A (en) * 1979-01-23 1980-07-28 Japan Synthetic Rubber Co Ltd Photosensitive resin film
JPS5840547A (en) * 1981-09-04 1983-03-09 Toshiba Corp Resist with low molecular weight and high resolution

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50136020A (en) * 1974-04-16 1975-10-28
JPS5598742A (en) * 1979-01-23 1980-07-28 Japan Synthetic Rubber Co Ltd Photosensitive resin film
JPS5840547A (en) * 1981-09-04 1983-03-09 Toshiba Corp Resist with low molecular weight and high resolution

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6081158A (en) * 1983-10-11 1985-05-09 Hitachi Ltd Radiation-sensitive substance
JPH0446267B2 (en) * 1983-10-11 1992-07-29 Hitachi Seisakusho Kk
JPH05158238A (en) * 1991-09-24 1993-06-25 Toppan Printing Co Ltd Method for preventing generation of development scum of electron beam crosslinking type resist

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