JPS5875899A - Housing for electronic equipment - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a housing for an electronic MS, and more particularly to a plastic housing containing a circuit network.

Conventionally, the main purpose of electronic device casings was to house and protect circuit networks such as electronic components and printed circuit boards. With the recent advances in device integration and high-density connection technology, the housing of recent electronic Il@ devices, even a simple 4S device, is
There is a trend toward thinner and more compact designs that take into consideration functionality and interpersonal comfort. Therefore, the Meiso Sakaki Sei was made into fusuma fibers, which required a great deal of man-hours to assemble and maintain.

Furthermore, in devices that require high-density packaging, there has been a limit to the packaging density due to circuit packaging and maintenance aspects.The purpose of the present invention is to eliminate such drawbacks by installing electronic circuits and making them heat-resistant. The aim is to simplify the mounting configuration and achieve high-density mounting by laminating plastic and plastic plates and integrating the casing and network.

According to the present invention, in an electronic device casing formed by laminating and bonding a plurality of thermoplastic plastic plates and molding the same by vacuum forming or the like, a terminal portion for mounting electronic components is formed on the surface, and the round portion is layered. Boards and Printers for Electronic Devices) An electronic circuit network constructed in the same manner as a circuit board is formed on one side and on both sides.
! The terminal section of the 111-layer board and the circuit network of the second layer board are comprised of through-holes for electrically conducting the circuit network and a one-way network protection JIO exterior board. A device casing is obtained.

Next, the drawings will be used to explain the invention in detail in terms of N%/h.

Part 1 II is a partial cross-sectional explanatory diagram of an electric body for electronic equipment according to the present invention, and l is an iris laminated plate having a terminal part 2 made of metal foil arranged in the dimensions for attaching the lead wires of electronic parts. 1 Examples of materials with a Tatsutawell hardness of about M7σ or higher at room temperature, hard vinyl chloride resin, acrylic resin, B8 resin, impact-resistant pristyrene tree, and hardwood.
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3 is made of the same material as the 111-layer board with **t on both sides. It is a 113-layer board.S is a through hole for electrically conducting between the terminal portion 2 and the circuit network 4 formed on both sides of the eighth layer board 30.

6 serves as an outer skin as a housing after molding); a circuit network 40; a first layer plate 1 for electrical insulation and physical protection; This is an exterior plate made of the same material as the second layer plate 3.

Fig. 2 is an explanatory diagram of the state of the terminal portion 2 formed of a thermoplastic plastic plate before lamination and adhesion of the circular one-layer plate 1), and similarly Fig. 3 shows the state of the terminal portion 2 formed of a thermoplastic plastic plate before lamination and bonding. It is an explanatory view of a two-layer board.

As a general manufacturing decision, the M1 layer plate shown in Figure 2 and w
The second layer plates 3 shown in FIG. 13 are each positioned in relation to the electric circuit pattern, and bonded under pressure using a solvent or adhesive.

At this point, holes are made using a drill or the like at locations where electrical conduction is established, and through-holes 5 are formed by electroless plating, which is applied to the manufacturing method of multilayer printed circuit boards. At '46, the outer layer plate 6 is bonded under pressure using an adhesive or a solvent.

In the above steps, the laminated sheet is heated to 150 to 170'' and formed into a predetermined shape using the so-called vacuum forming method.Finally, the outside mr* is bordered and finished as a casing.

In the embodiment of the present invention, only a 112-layer board 3O is used as the intermediate layer, but it is also possible to laminate a larger number of boards.On the other hand, if electrical and physical protection of the through-hole S is unnecessary, , it is also possible to omit the exterior plate 6. There are methods for moving electrical parts such as conductive adhesive and welding pressure welding.
According to the present invention, not only can the casing be made smaller and the packaging density higher by integrating the casing and the circuit network, but also the circuit network is not directly exposed to the outside air. In addition, the reliability can be improved, and at the same time, the assembly and maintenance man-hours can be reduced, which has a great effect on weight.

[Brief explanation of the drawing]

Figure 1 is an eclipse bM view of a partial cross section of the electronic ll5 ri housing 0 according to the present invention, Figure 2 is an explanatory diagram of the state of the 1-layer board l, and Figure 3 is an explanatory diagram of the state of the g-snow layer board 3. be. l is the first layer board,! 3 is the terminal part, 3 is the 82-layer board 4 is the one-way network, 5 is the through hole, and 6 is the exterior board.

Claims (1)

[Claims] A 111-layer board with terminals for mounting electronic components formed on the surface of an electronic device housing made by laminating and bonding a plurality of thermoplastic one-piece ivy boards and forming them by vacuum forming waves, etc.;
An electronic circuit network constructed in the same manner as a printed circuit board for electronic equipment is formed on both sides (11), and the round part is a two-layer board,
The terminal portion of the first layer plate and II! An electronic device housing characterized by comprising a circuit network of two-layer boards or a through hole for electrically conducting between the circuit networks, and an O exterior plate for protecting the circuit network that covers the second-layer board.