JPS5873981A - Method of producing terminal board - Google Patents
Method of producing terminal boardInfo
- Publication number
- JPS5873981A JPS5873981A JP17339381A JP17339381A JPS5873981A JP S5873981 A JPS5873981 A JP S5873981A JP 17339381 A JP17339381 A JP 17339381A JP 17339381 A JP17339381 A JP 17339381A JP S5873981 A JPS5873981 A JP S5873981A
- Authority
- JP
- Japan
- Prior art keywords
- terminal board
- plate
- copper foil
- brass
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
この発明は端子板（３）となる黄銅板（１）Ｋ必要最小
限の鋼（２）を溶接する端子板の製法に係る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a terminal plate by welding a brass plate (1) K and a necessary minimum amount of steel (2) to become the terminal plate (3).
この発明は端子（３）と導線（船の接触抵抗を高めず。This invention connects the terminal (3) to the conductor (without increasing the contact resistance of the ship).
かつ端子板（３）の形成に使用する鋼（２）の量を必要
最小限にして材料コストを下げることを目的とす墨。Also, the purpose is to reduce the material cost by minimizing the amount of steel (2) used to form the terminal plate (3).
従来端子板（３）としては銅板が使用されており材料コ
ストが高いものについている。そこで端子板（３）を黄
銅で形成することが考えられたが、材料コストは下がる
が端子板（３）と導線の接触抵抗が大きくなり電気的損
失が大壷くなる欠点があった。Conventionally, a copper plate has been used as the terminal plate (3), and the material cost is high. Therefore, it has been considered to form the terminal plate (3) from brass, but this method reduces the material cost, but has the disadvantage that the contact resistance between the terminal plate (3) and the conductor increases, resulting in a large electrical loss.
この発明は上記欠点を除去せんとする。The present invention seeks to eliminate the above drawbacks.
以下この発明を第ｔｍ乃至第５図に示す一実施例に基づ
いて説明する。The present invention will be explained below based on an embodiment shown in Figs. tm to 5.
第１−及び第２図は超音波溶接機で黄銅板（１）に銅１
１（２１を一層して溶接する状態を示す。Figures 1- and 2 show copper 1 on brass plate (1) using an ultrasonic welding machine.
1 (shows the state in which 21 are welded in one layer).
ソノトロード（６）の溶接面にはメツシュ目状のローレ
ット（ηが形成され、これ番こ対向するマントル（（至
）のＩｉＫは前記り一レフト（７）が嵌合するメツシュ
目状のローレフト（ωが形成されている。A mesh-like knurl (η) is formed on the welding surface of the sonotrode (6), and a mesh-like knurl (η) is formed on the welding surface of the sonotrode (6). ω is formed.
而して上記超音波溶接機で銅箔偉）は黄銅板（１）上に
ローレット（７）の凸部により圧入されローレット（７
）の目状にスポット的に溶接される。銅箔（２）の非溶
接部分は剥離除去される。第３図はこの状態を示し、黄
銅板（１）上に銅箔（２）がソノトロード（６）のロー
レット■の目状（凸部に対応する部分）Ｋスポット的に
溶接されてい墨。Then, using the ultrasonic welding machine, the copper foil (copper foil) is press-fitted onto the brass plate (1) by the convex part of the knurling (7).
) spot welding. The non-welded portion of the copper foil (2) is peeled off and removed. Figure 3 shows this state, in which the copper foil (2) is welded onto the brass plate (1) in the K spot pattern (corresponding to the convex portion) of the knurling (■) of the sonotrode (6).
剥離した銅箔（ｌＯ）は再び使用される。The stripped copper foil (lO) is used again.
つづいて乙の黄銅板（１）はロール機やプレス機（図略
）により平板化される。第４ｉ１！Ａはこの状態を示し
、銅箔（２）は平板でなる黄銅板（１）上に平面的かつ
スポット的に溶接される。即ち黄銅板（１）の表面層に
銅箔（２）が一部存在する構造となる。Next, the brass plate (1) is flattened using a roll machine or a press machine (not shown). 4th i1! A shows this state, in which the copper foil (2) is welded flatly and spot-wise onto the flat brass plate (1). That is, the structure is such that the copper foil (2) is partially present on the surface layer of the brass plate (1).
との銅箔（２）をスポット溶接した黄銅板（１）は所要
形状にプレス加工等されて端子板（３）に形成される。A brass plate (1) to which a copper foil (2) is spot-welded is pressed into a desired shape to form a terminal plate (3).
第５図は以上の如く形成された端子板（３）を示すが、
導線（５）との溶接は表面層を形成する銅箔鰺）を介し
て爺こなわれるので接触抵抗は大会くなることがないの
である。Figure 5 shows the terminal plate (3) formed as described above.
Since the welding with the conducting wire (5) is carried out through the copper foil forming the surface layer, the contact resistance will not be too high.
以上の如く本発明による端子板の製法は黄銅板（１）に
銅箔（２）を積ねてメツシュ状の四−レフト（７）を形
成したソノロード（６）を有する麺音波溶接機でスポッ
ト溶接し、銅箔（２）の非溶接部を鯛離した黄銅板（１
）をプレス加工、ロール加工等により平板化してのち所
定形状の端子板に形成することを特徴とするものである
ので、銅の使用量を極力おさえた上で銅板を使用したの
と同様の効果を持つ端子板を製造することができる。As described above, the method for manufacturing the terminal board according to the present invention is to use a sonic welding machine equipped with a sonic rod (6) in which copper foil (2) is laminated on a brass plate (1) to form a mesh-like four-left (7). Brass plate (1) welded and separated from the non-welded part of copper foil (2)
) is flattened by pressing, rolling, etc., and then formed into a terminal plate of a predetermined shape, so the amount of copper used is minimized and the same effect as using a copper plate is obtained. It is possible to manufacture a terminal board with
第１図乃至第Ｖ図はこの発明の一実施例を示す図で、第
１図は断面−，第２−は平面図、第３図乃至第５図は断
面図である。
特許出願人
松下電工株式会社
代理人弁理士 竹 元 敏 丸
（ほか２名）
１１１
第１ＵＡ
ｉ′
第２図
第３図
□ 第４図
第５図
′５1 to 5 are views showing an embodiment of the present invention, in which FIG. 1 is a cross-sectional view, FIG. 2 is a plan view, and FIGS. 3 to 5 are cross-sectional views. Patent applicant Matsushita Electric Works Co., Ltd. Patent attorney Toshimaru Takemoto (and 2 others) 111 1UA i' Figure 2 Figure 3 □ Figure 4 Figure 5 '5
Claims (1)
ュ状のローレット（７）を形成したソノロード（６）を
有する超音波溶接機でスポット溶接し、銅箔（２）の非
溶接部を剥離した黄銅板（！）をプレス加工、ｐ−ル加
工等により平板化してのち所定形吠の端子板に形成する
ことを特徴とする端子板の製法。l) Brass plates (1) E 11?1 (2) are stacked together and spot welded using an ultrasonic welding machine equipped with a sonorod (6) that forms a mesh-like knurling (7). A method for manufacturing a terminal board, which comprises flattening a brass plate (!) from which the welded portion has been removed by pressing, rolling, etc., and then forming it into a terminal board of a predetermined shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339381A JPS5873981A (en) | 1981-10-28 | 1981-10-28 | Method of producing terminal board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17339381A JPS5873981A (en) | 1981-10-28 | 1981-10-28 | Method of producing terminal board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5873981A true JPS5873981A (en) | 1983-05-04 |
Family
ID=15959567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17339381A Pending JPS5873981A (en) | 1981-10-28 | 1981-10-28 | Method of producing terminal board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5873981A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119190A (en) * | 2002-09-26 | 2004-04-15 | Yazaki Corp | Ultrasonic joining device |
-
1981
- 1981-10-28 JP JP17339381A patent/JPS5873981A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004119190A (en) * | 2002-09-26 | 2004-04-15 | Yazaki Corp | Ultrasonic joining device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3921595B2 (en) | Interconnect method for multilayer printed circuit boards | |
| JPS61140199A (en) | Manufacture of multilayer printed circuit board and multilayer printed circuit board manufacture thereby | |
| US4164071A (en) | Method of forming a circuit board with integral terminals | |
| JP3515479B2 (en) | Conductive member and method of manufacturing the same | |
| JPS5873981A (en) | Method of producing terminal board | |
| JPS60250891A (en) | Manufacture of electric contact | |
| JP2023044113A5 (en) | Manufacturing method of image forming apparatus | |
| US4629928A (en) | Electrode terminal structure for a piezoelectric polymer | |
| JPH08236401A (en) | Manufacture of aluminum electrolytic capacitor | |
| JPH0564479B2 (en) | ||
| JPS58178547A (en) | Electric part assembly and manufacture thereof | |
| JPH1041600A (en) | Flexible wiring board fitted with terminal | |
| JPS59500338A (en) | 1 Method of electrically connecting both sides of a conductor plate | |
| JPS60210374A (en) | Spot welding method of composite metallic plate | |
| JP2520035B2 (en) | Method for manufacturing multi-layer electric contact forming material having non-bonded portion | |
| JPH0561771B2 (en) | ||
| JPH0414918Y2 (en) | ||
| JPS6244438A (en) | Conductive laminated board | |
| JPS604378Y2 (en) | terminal | |
| JP3060929B2 (en) | Method of manufacturing metal rotor for trimmer capacitor | |
| JP2507391Y2 (en) | Thin coil | |
| JPH0442905Y2 (en) | ||
| JPH0797521B2 (en) | Sliding contact and manufacturing method thereof | |
| JPH07105245B2 (en) | Male electrical connector and method of manufacturing the same | |
| JPH0677861B2 (en) | Method of forming aluminum conductor electrical contact surface |