JPS5872840U - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS5872840U
JPS5872840U JP1981167351U JP16735181U JPS5872840U JP S5872840 U JPS5872840 U JP S5872840U JP 1981167351 U JP1981167351 U JP 1981167351U JP 16735181 U JP16735181 U JP 16735181U JP S5872840 U JPS5872840 U JP S5872840U
Authority
JP
Japan
Prior art keywords
wire bonding
bonding equipment
drive source
rotating shaft
swinging arm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981167351U
Other languages
English (en)
Inventor
鈴木 悦四
鶴田 寿郎
永島 純雄
宏一 千葉
政義 山口
規安 加島
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1981167351U priority Critical patent/JPS5872840U/ja
Publication of JPS5872840U publication Critical patent/JPS5872840U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301Capillary
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78Apparatus for connecting with wire connectors
    • H01L2224/7825Means for applying energy, e.g. heating means
    • H01L2224/783Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/7835Stable and mobile yokes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00014Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
図面は本考案の一実施例を示し、第1図は一部断面した
正面図、第2図は平面図、第3図は要部の斜視図である
。 1・・・揺動アーム、7・・・ウオームホイール、8・
・・ウオーム、11・・・DCモータ(駆動源)、12
・・・回転軸、25・・・キャピラリアーム。

Claims (1)

    【実用新案登録請求の範囲】
  1. 回転軸を有しこの回転軸が正方向と逆方向に交互に回転
    駆動される駆動源と、回転自在に設けられウオームとウ
    オームホイールとからなる歯車機構を介して上記駆動源
    により揺動駆動される揺動アームと、この揺動アームに
    保持されたキャピラリアームとを具備したことを特徴と
    するワイヤボンディング装置。
JP1981167351U 1981-11-10 1981-11-10 ワイヤボンデイング装置 Pending JPS5872840U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981167351U JPS5872840U (ja) 1981-11-10 1981-11-10 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981167351U JPS5872840U (ja) 1981-11-10 1981-11-10 ワイヤボンデイング装置

Publications (1)

Publication Number Publication Date
JPS5872840U true JPS5872840U (ja) 1983-05-17

Family

ID=29959450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981167351U Pending JPS5872840U (ja) 1981-11-10 1981-11-10 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS5872840U (ja)

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