JPS5870598A - High density mounting structure for electronic equipment - Google Patents
High density mounting structure for electronic equipmentInfo
- Publication number
- JPS5870598A JPS5870598A JP16790681A JP16790681A JPS5870598A JP S5870598 A JPS5870598 A JP S5870598A JP 16790681 A JP16790681 A JP 16790681A JP 16790681 A JP16790681 A JP 16790681A JP S5870598 A JPS5870598 A JP S5870598A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- power supply
- power
- contact portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、プリント回路基板等を高密度に実装可能な電
子機器の高密度実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a high-density mounting structure for electronic equipment that allows printed circuit boards and the like to be mounted at high density.
従来、この積の電子機器実装構造は、例えば第１図に示
すような構造とされている。すなわち、集積回路パッケ
ージ１を複数個搭載したプリント回路基板２け、論理回
路ユニット４の筐体内部に設けたガイド１０に沿って挿
入され、奥部に設けられたコネクタを介してバックボー
ド３に接続される。論理回路ユニット４は複数個のプリ
ント回路基板２を収容し、プリント回路基板相互間の接
続は前記バックボード３によって會される。また、ユニ
ット４の筐体の図中前部上縁と下縁にバスノ（−８を設
け、各プリント回路基板２の前側角部から突設した受電
端子９ａが前記バスパー８に螺着される。受電端子９ａ
Ｆｉ、プリント回路基板２の上級部および下縁部に形成
されたバスパー９を介して基板２内の１［配線層に接続
されている。そして、電源回路ユニット５のバスパー７
と前記論理回路ユニット４のバスパー８とをケーブル６
で接続することによりグランドを含む異種電源を供給す
る構造である。Conventionally, an electronic device mounting structure of this product has been constructed as shown in FIG. 1, for example. That is, two printed circuit boards on which a plurality of integrated circuit packages 1 are mounted are inserted along the guide 10 provided inside the case of the logic circuit unit 4, and connected to the backboard 3 via the connector provided in the inner part. Connected. The logic circuit unit 4 accommodates a plurality of printed circuit boards 2, and the printed circuit boards are connected to each other by the backboard 3. In addition, bus nos (-8) are provided on the upper and lower edges of the front part of the housing of the unit 4 in the figure, and power receiving terminals 9a protruding from the front corners of each printed circuit board 2 are screwed onto the bus pars 8. .Power receiving terminal 9a
Fi is connected to the wiring layer 1 in the board 2 via buspers 9 formed on the upper and lower edges of the printed circuit board 2. Then, the busper 7 of the power supply circuit unit 5
and the busper 8 of the logic circuit unit 4 are connected to the cable 6.
This is a structure that supplies different types of power including ground by connecting the two.
従って、上述の従来構造では、電源勧１路ユニット５の
バスパー７から供給する全電流は、ケーブル６を通して
論理回路ユニット４のバスパー８の右端に入り、図中右
側から各プリント回路基板に電流を供給しながら順次電
波管減少し最後に図中左端のプリント回路基板に電流を
供給する。す々わち、バスパー８に流れる電流は図中右
側の部分では大きく、Ｍ中左側の部分（端末＠）では少
ない。しかるに、バスパー８の太きさけ、全長にわたっ
て同一であり、上述の最大電流（すなわち全電流）を流
すに足る大きさを有するｉ換言すれば、バスパー８の端
末＠Ｉは必要以上に大きく、そのため資材およびスペー
スの焦駄を生じる。各プリント回路基板２のバスパー９
においても同様に一端に突設された受電端子９ａから全
電流が流入し、端末側になる程少力い電流と々るから、
バスパー９は最大電流を流す大きさを必要とし、プリン
ト回路基板２０高密度配線を阻害するという欠点がある
。Therefore, in the conventional structure described above, the entire current supplied from the busper 7 of the power supply single-path unit 5 enters the right end of the busper 8 of the logic circuit unit 4 through the cable 6, and the current is supplied to each printed circuit board from the right side in the figure. While supplying the current, the current is gradually reduced to the radio wave tube, and finally the current is supplied to the printed circuit board at the left end in the figure. In other words, the current flowing through the bus spar 8 is large in the right part of the figure, and small in the left part (terminal @) of M. However, the thickness of the buspar 8 is the same over its entire length, and is large enough to flow the maximum current (i.e., the total current) mentioned above.In other words, the terminal @I of the buspar 8 is larger than necessary; This results in wasted materials and space. Busper 9 of each printed circuit board 2
In the same way, all the current flows from the power receiving terminal 9a protruding from one end, and the closer to the terminal side, the smaller the current is.
The busper 9 requires a size that allows maximum current to flow, and has the disadvantage that it obstructs high-density wiring on the printed circuit board 20.
従来社、′プリントー路基板２の搭載する集積回路パッ
ケージ１の消費電流も少なく、かつ搭載個数も小である
ため上述の従来構造であまり大きな問題は生じなかった
。しかるに、近年半導体素子の高集積化により、電子機
器の実装は、非常に高密度かつコンパクトとカリ、動作
速度の高速化。In the prior art, the current consumption of the integrated circuit package 1 mounted on the printed circuit board 2 was small, and the number of packages mounted was small, so no major problems occurred with the above-mentioned conventional structure. However, in recent years, with the increasing integration of semiconductor devices, the packaging of electronic devices has become extremely dense, compact, powerful, and has increased operating speed.
低レベルでの信号伝達が可能と々シ、一方において高密
度化に伴なう単位体積当りの消費電力が増加し、電源ラ
インの電流容量、電源変動が問題となってきている。す
なわち、電源ラインは短く、よりコンパクトにし、かつ
大電流を供給できることが要求されるようになった。こ
のため、前述の従来回路の欠点が助長され、ノくスノ＜
−Ｓ、９の電源入力近辺に流ねる局部的な大電流のため
、ノ（スパー８，９の大きさはますます大となり、バス
パー８，９の実装体積に占める割合が増大し、高密度化
に対応することができなくなってきた。Although it is possible to transmit signals at low levels, on the other hand, power consumption per unit volume increases due to higher density, and current capacity of power supply lines and power supply fluctuations are becoming problems. In other words, power lines are now required to be shorter and more compact, and to be able to supply large currents. For this reason, the drawbacks of the conventional circuit described above are exacerbated, and the
- Due to the local large current flowing near the power input of S and 9, the size of Spars 8 and 9 becomes larger and larger, and the proportion of the buspars 8 and 9 in the mounting volume increases, resulting in high density It has become impossible to respond to the changes.
本発明の目的は、上述の従来の欠点を解決し、局部的な
大電流のために配線を大にすることなく、かつ電源配線
長をよシ短くした電子機器の高密度実装構造を提供する
ことＫある。An object of the present invention is to solve the above-mentioned conventional drawbacks, and to provide a high-density packaging structure for electronic equipment in which the length of the power supply wiring is shortened without increasing the wiring size due to localized large currents. There is a thing called K.
本発明の実装構造は、集積−路パッケージを複数個搭載
しえプリント回路基板の端辺の長さ方向に形成された受
電用コンタクト部と、上記受電用コンタクト部のはぼ全
長にわたって接触し電流を供給する給電用コネクタを含
む電源モジュールと、複数個の前記プリン）Ｉ回路基板
間を接続するバックボード基板を含み複数個の前記プ９
ｙ、）回路基板および複数個の前記電源モジュールを
収容実装するケージユニットとを備えたこと管ｑ＃黴と
する。In the mounting structure of the present invention, a plurality of integrated circuit packages are mounted, and the power receiving contact portion formed in the length direction of the edge of the printed circuit board is in contact with the power receiving contact portion over almost the entire length of the printed circuit board, and the power receiving contact portion is in contact with the power receiving contact portion over the entire length of the printed circuit board. A power supply module including a power supply connector for supplying a
y,) a circuit board and a cage unit that accommodates and mounts a plurality of the power supply modules;
次に、本発明について１図面を参照して詳細に説明する
。Next, the present invention will be explained in detail with reference to one drawing.
第２図は、本発明の一実施例を示す一部破さい斜視図で
ある。すなわち、集積回路パッケージ１を複数個搭載し
たプリント回路基板２の上側端辺と下側端辺のはぼ全長
にわたって受電用コンタクト部Ａが形成されている。プ
リント回路基板′２￥ｒケージユニット１６の筐体背部
のバックボード基板３に設けたコネクタに嵌着したとき
、上記受電用コンタク）ＩＳＡは、該基板２０図中上下
に配された電源モジュール１３の給電用コネクタ１２と
接続可能である。給電用コネクタ１２は、第３図に示す
ように１対の接続用バネ１４ 、 ｌ ４’を内蔵し、
該接続用バネ１４ 、１４’はカム１５によって押開さ
れている。従って、プリント回路基板２の増透の両面に
形成された一対の導体片からなる受電用コンタクト部Ａ
が接続用バネ１４ 、１４’に妨害されることなくプリ
ント回路基板２に一挿入することができる。プリント回
路基板２の挿入後カム１５を回転することにより、第４
図に示すように接続用バネ１４ 、１４’は自身の有す
る付勢力により受電用コンタクト部Ａを押圧し接触する
。受電用コンタクト部人け、プリント回路基板２の端辺
の両面に°独立して設けられ電気的に絶縁されているか
ら、接続用バネ１４ 、１４’から異種の電源を供給す
ることが可能である。また、受電用コンタクト部Ａｔ−
ｊ、プリント回路基板２の端辺の捻ぼ全長にわ念って形
成され、随所において基板２の内部配線層に接続されて
いて、受電および給電は受電用コンタクト部Ａの全長に
よって均一になされるから、局部的な大電流が流れない
という効果がある。また電源モジュール１３はプリント
（ロ）略基板２の直上および直下に配置されているから
電源ラインの接続長が短かい。すなわち、電源ライン抵
抗等による電圧降下が小さく電源ライン配線およびコネ
クタ等の容量を小とすることができる。FIG. 2 is a partially cutaway perspective view showing one embodiment of the present invention. That is, the power receiving contact portion A is formed over almost the entire length of the upper end side and the lower end side of the printed circuit board 2 on which a plurality of integrated circuit packages 1 are mounted. When the printed circuit board '2\r is fitted into the connector provided on the backboard board 3 at the back of the case of the cage unit 16, the power receiving contact (ISA) connects to the power supply module 13 arranged above and below the board 20 in the figure. It can be connected to the power supply connector 12 of. The power supply connector 12 incorporates a pair of connection springs 14 and l4' as shown in FIG.
The connection springs 14, 14' are pushed open by a cam 15. Therefore, the power receiving contact portion A consists of a pair of conductor pieces formed on both sides of the transparent part of the printed circuit board 2.
can be inserted into the printed circuit board 2 without being hindered by the connecting springs 14, 14'. By rotating the cam 15 after inserting the printed circuit board 2, the fourth
As shown in the figure, the connection springs 14 and 14' press and contact the power receiving contact portion A with their own biasing force. Since the power receiving contacts are independently provided on both sides of the edge of the printed circuit board 2 and are electrically insulated, it is possible to supply different types of power from the connection springs 14 and 14'. be. In addition, the power receiving contact part At-
j. The twist on the edge of the printed circuit board 2 is carefully formed over the entire length, and is connected to the internal wiring layer of the board 2 at various places, and power reception and power supply are uniformly performed over the entire length of the power reception contact part A. This has the effect of preventing large local currents from flowing. Furthermore, since the power supply module 13 is disposed directly above and directly below the printed circuit board 2, the connection length of the power supply line is short. That is, the voltage drop due to power line resistance and the like is small, and the capacity of power line wiring, connectors, etc. can be made small.
従って、プネクタ等の実装体積に占める割合を小とし、
全体として高密度実装管可能とする効果がある。Therefore, the proportion of the mounting volume of connectors etc. should be small,
Overall, this has the effect of allowing high-density mounting of tubes.
上記実施例では、電源モジュール１３をプリント回路基
板２の上下２段に実装する構成であるが、プリント回路
基板２の消費電力が小さい場合は、上下いずれか一方の
電源モジュールは必要でない。In the embodiment described above, the power supply module 13 is mounted in two stages, the upper and lower stages of the printed circuit board 2, but if the power consumption of the printed circuit board 2 is small, the power supply module on either the upper or lower side is not necessary.
唖た、電源モジュール１３の上下にプリント回路基板２
ｔ−配設し、１つの電源モジュールで２個のプリント回
路基板に電力を供給することも可能である。また、１個
の電源モジュールに複数個の給電用コネクタ１２を設け
て複数個のプリント回路基板に電力を供給することもで
きる。なお、コンタクト部Ａは、端辺全長にわたら表い
でも良く、また長さ方向に分割してもよい。要するに、
プリント回路基板の端片に長さ方向に受電用コンタクト
部を形成し、できるだけ近接した電源モジュー均等に受
電できるように構成すればよい、上記構成により、小量
の接続導体で大電流の電源供給を可能とし、かつ高密度
実装が可能となるという効果がある。There are printed circuit boards 2 above and below the power supply module 13.
It is also possible to supply power to two printed circuit boards with a single power supply module. Furthermore, a single power supply module can be provided with a plurality of power supply connectors 12 to supply power to a plurality of printed circuit boards. Note that the contact portion A may be exposed over the entire length of the end side, or may be divided in the length direction. in short,
All that is required is to form power receiving contacts in the length direction on the end pieces of the printed circuit board so that power can be received evenly from power supply modules located as close as possible.With the above configuration, a large current can be supplied with a small amount of connecting conductor. This has the effect of enabling high-density packaging.
第１図は従来の電子機器実装構造の一例を示す一部破さ
い斜視図、第２図は本発明の一実施例を示す一部破さい
斜視図、第３図は上記実施例における受電用コンタクト
部と給電用コネクタの一例を示す側面図、第４図は上記
受電角コンタクト部と給電用コネクタが接続され良状態
を示す側面図である。
図において、１・・・集積回路パッケージ、２・・・プ
リント回路基板、３・・・バックボード基板、４・・・
論ノ
理胞路ユニット、５・・・電源回路ユニット、６・・・
ケーブル、７〜９・・・バスバー、１０・・・ｔｊ４Ｙ
、１２・・・給電用コネクタ、１３・・・電源モジュー
ル、１４・・・接続用バネ、１５・・・カム、１６・・
・ケージユニｙト、Ａ・・・受電用コンタクト部。
代理人弁理士 住 １）俊 宗
第１図
第２図
第３１Fig. 1 is a partially broken perspective view showing an example of a conventional electronic device mounting structure, Fig. 2 is a partially broken perspective view showing an embodiment of the present invention, and Fig. 3 is a power receiving device in the above embodiment. FIG. 4 is a side view showing an example of the contact portion and the power feeding connector, and FIG. 4 is a side view showing the power receiving angle contact portion and the power feeding connector being connected and in good condition. In the figure, 1... integrated circuit package, 2... printed circuit board, 3... backboard board, 4...
Theory and logic unit, 5... Power supply circuit unit, 6...
Cable, 7-9...Bus bar, 10...tj4Y
, 12... Power supply connector, 13... Power supply module, 14... Connection spring, 15... Cam, 16...
・Cage unit, A...Contact part for receiving power. Representative Patent Attorney Sumi 1) Toshi So Figure 1 Figure 2 Figure 31
Claims (1)
ト−路基板の端辺の長さ方向に形成された受電用＝ンタ
クト部と、上記受電用コンタクト部のはぼ全長にわたっ
て接触し電流を供給する給電用コネクタを含む電源モジ
ュールと、複数個の前記プリント−路基板間を接続する
バックボード基板を含み複数個の前記プリント回路°基
板および複数個Ｏ前記電源モジエールを収容実装するケ
ージユニットとを備えた仁とを特徴とする電子機器の高
密度実装構造。 （２、特許請求の範囲第１項記載の電子機器の高密度実
装構造にシいて、前記プリント基板の端辺に形成された
受電用コンタクト部はプリント回路基板端辺の両面に絶
縁して形成され、前記電源モジュールの給電用コネクタ
は一対の接続用バネを内蔵し、該ｌ対の接続用バネを押
開するカムを回転させたとき上記１対の接続バネが前記
プリント回路基板端辺の両面に形成された受電用コンタ
クト部を押圧する向きに付勢されていることを特徴とす
るもの。(1) A power receiving contact portion formed in the length direction of the edge of a printed circuit board on which multiple integrated circuit packages are mounted, and a power feeding contact portion that contacts over the entire length of the power receiving contact portion and supplies current. and a cage unit that houses and mounts a plurality of the printed circuit boards and a plurality of the power supply modules, including a backboard board for connecting the plurality of printed circuit boards and the circuit boards. A high-density mounting structure for electronic devices characterized by (2. According to the high-density mounting structure of the electronic device as set forth in claim 1, the power receiving contact portion formed on the edge of the printed circuit board is insulated and formed on both sides of the edge of the printed circuit board. The power supply connector of the power supply module incorporates a pair of connection springs, and when a cam that pushes open the pair of connection springs is rotated, the pair of connection springs are connected to the edge of the printed circuit board. It is characterized by being biased in a direction that presses the power receiving contact portions formed on both sides.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16790681A JPS5870598A (en) | 1981-10-22 | 1981-10-22 | High density mounting structure for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16790681A JPS5870598A (en) | 1981-10-22 | 1981-10-22 | High density mounting structure for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5870598A true JPS5870598A (en) | 1983-04-27 |
Family
ID=15858237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16790681A Pending JPS5870598A (en) | 1981-10-22 | 1981-10-22 | High density mounting structure for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5870598A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150699A (en) * | 1984-01-18 | 1985-08-08 | 富士フアコム制御株式会社 | Electric connecting mechanism of electronic device |
| JP2009514210A (en) * | 2005-10-26 | 2009-04-02 | テレフオンアクチーボラゲット エル エム エリクソン（パブル） | Flexible substrate contact means for contacting the outer edge of a printed circuit board |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558314U (en) * | 1978-06-30 | 1980-01-19 | ||
| JPS5655738A (en) * | 1979-09-25 | 1981-05-16 | Siemens Ag | Contact spring |
-
1981
- 1981-10-22 JP JP16790681A patent/JPS5870598A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS558314U (en) * | 1978-06-30 | 1980-01-19 | ||
| JPS5655738A (en) * | 1979-09-25 | 1981-05-16 | Siemens Ag | Contact spring |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60150699A (en) * | 1984-01-18 | 1985-08-08 | 富士フアコム制御株式会社 | Electric connecting mechanism of electronic device |
| JP2009514210A (en) * | 2005-10-26 | 2009-04-02 | テレフオンアクチーボラゲット エル エム エリクソン（パブル） | Flexible substrate contact means for contacting the outer edge of a printed circuit board |
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