JPS5867094A - Electronic part inserting machine - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electronic component inserter, and more particularly to a 5-electronic component inserter that embeds electronic components consisting of a main body and a plurality of lead wires extending in the same direction on a printed circuit board at high density.

Conventionally, the general configuration of electronic component insertion machines is to grasp the electronic components transferred from outside the machine with the claws of the head of the gripping device, and then cut the lead wires.

A device was used in which the lead wires were cut to an appropriate length by a device and inserted into the insertion holes of a printed circuit board that was held at a predetermined position by a positioning device, with the tips of the lead wires aligned with each other. With this insertion machine, when the claws of the gripping device's head are grasping and inserting electronic components, there is no possibility that the claws of the head of the gripping device may be obstructed by the previous component that is already implanted in the adjacent position, or conversely damage the previous component. In order to avoid this, the spacing between the parts on the printed circuit board must be larger than the external dimensions of the component body, taking into account the projected external dimensions of the head claws while gripping the components. This hinders the high density of printed circuit boards, and when it is absolutely necessary to insert electronic components at a high density, automatic insertion is impossible, resulting in extremely low productivity.

The purpose of the present invention is to eliminate the above-mentioned drawbacks, to enable high-density insertion of electronic components, and to reduce costs and improve usability due to miniaturization of printed circuit boards/boards. In order to achieve this, the present invention uses electronic.

Paying attention to the flexibility of the lead wire of the component, place the main body of the implanted component 1° adjacent to the planned implantation location.

It is characterized by providing a means for pushing the head claw away to secure an action space for the head claw. 181, (bl, (cl) are general views showing various examples of electronic components before being supplied to the insertion machine. The component 1 consists of a main body 1a and two rods 1i11b extending from the main body in the same direction.

The tip portions of the two lead wires 1b are fixed at a predetermined interval. This tape 3 has electronic parts.

While stored in a storage case or the like, it also serves to connect a plurality of electronic components at approximately equal intervals, and feed holes 4 are punched out. The electronic component 1 is pulled out from a storage case or the like using a tape, and after being cut into pieces one by one while still taped, the electronic component 1 is supplied to an insertion machine on a conveying pallet.

FIG. 2 is a perspective view showing an example of an electronic component insertion machine suitable for carrying out the present invention. In the figure (h), the electronic component insertion machine is composed of a gripping device A, a cutting device B1, a measuring device C, a positioning device, a driving device E, and a means for pushing out the preceding component F, and the above-mentioned conveying pallet (G) is attached. The gripping device A has a head part A1 and an index part A! (tokara-seishi, spatula)
” Part A * if 4 m head units) a, b.

The head units C and d are arranged in a spiral shape, and each head unit a, b, c, and d moves to four index positions: a supply position, a cutting position, a measurement position, and an insertion position by receiving the drive from the index section A2. Each moves sequentially in a rotational manner. First, the head unit I/'i receives the electronic component 1 in the state shown in FIG. 1 from the transport pallet G at the supply position, holds the main body 1ak with its head claws, and moves it to the next cutting position.

A cutting device B is disposed corresponding to this cutting position, and cuts the two lead wires of the electronic component held by the head unit K into different lengths. The cut lead wire ends and tape pieces are discarded here. The bed unit further rotates to the measurement position, and the measuring device C arranged corresponding to this measurement position measures the tips of the lead wires cut to different lengths to determine their positional relationship to the printed circuit board. calculate. Since the printed circuit board is usually implanted with electronic components on a workbench below the gripping device, the insertion position to which the head unit finally moves is a downward position midway below each index position. The positioning device positions the predetermined insertion hole 5 of the printed circuit board 4 on the workbench at the planned implantation position based on the information from the measuring device C. The drive device EFi drives various operations of each part of the gripping device while holding the gripping device A on the workbench. The preceding component pushing means F waits for insertion in the indexed position.

attached close to the location.

Hereinafter, the electronic component implantation work of the gripping device will be explained in more detail with reference to the drawings. Figure 5 (al s (bl s (cl)
Figure 1 is an overview diagram showing a state in which the electronic component shown has its lead wires cut into different lengths by a cutting device. In this state, the electronic component is attached to the head. After the K is grasped and measured at the measurement position, it is moved to the insertion position.
, (di are partially enlarged views sequentially showing an example of the electronic component implantation work according to the present invention. In the figures, a head unit aFi has a pair of claws a1 at the tip, and the electronic component 10 main body 11 is mounted with these claws. A predetermined insertion hole 5 of the printed circuit board 4 is positioned directly below the lead wire 1b of the electronic component 1, but since the distance between the electronic components is only the outer dimension of the component body, if the gripping device or the 11, the head claw a1 may come into contact with the main body portion of the adjacent preceding component 60 which has already been implanted.In order to prevent this, means F for pushing the preceding component away is provided. il
K As shown, the first component pushing means is cylinder 7.
, rod8. Consists of step 9. The trap is arranged so that the tip 9 at the tip of the rod 8, which is supported by a foot 11 attached to the cylinder 7'#'i frame 10 and expands and contracts along the axis, pushes away the main body of the preceding part 60. It is set up. FIG. 4 (bl K) Displaced electrons as shown.

Leads a of component 6 are flexible and bend toward the opposite side of the chip. Next, as shown in Figure 4 [el], the rod 8 is compressed by the operation of the cylinder 7, and the tip 9 is separated from the leading part 6v, but the lead 1lI6bFi of the leading part 6 springs back slightly, or the head The main body 61ij remains in the pushed-off position, leaving a sufficient space for the action of the claw a1. Therefore, the drive device E lowers the gripping device F, and as shown in FIG. Since it has a smooth taper, the smoothness is even more certain.Figure 5 (a1%tbl
s (cl describes in more detail an example of the procedure for inserting the lead wire into the printed circuit board.

FIG. Busy, printed circuit board 4
is positioned by the positioning device, which first inserts the first insertion hole 5 into the electronic component 1 by the measuring device.
matches the planned implantation position detected for the tip of the longer lead wire 1b.

I'm letting you do it. Then, the drive device lowers the gripping device, and as a first insertion operation, the tip of the longer lead wire 1b is inserted into the first insertion hole 5 as shown in FIG. 5ial. Subsequently, the four positioning devices move the printed circuit board 4, and place the second insertion hole slw at the planned implantation position detected by the measuring device relative to the tip of the shorter lead @1b' of the electronic component 1. Fine-tune to match.

Then, the drive device further lowers the gripping device, and the second
As the insertion operation, the tip of the shorter lead wire 1b' is also inserted into the second insertion hole 51, as shown in FIG. 5fbl. Insertion edge, FIG.
The tip of ' is fixed by a bending means (not shown) or the like, and the driving device opens the head claw to release the electronic component and raises the gripping device. This completes one cycle of the electronic component implantation work, and the head unit moves back to the supply position and is busy receiving new tape-attached electronic components. A similar cycle is repeated by the four head units and their sequential operation.

The control device manages the jitance of everything. In addition.

In this embodiment, the number of head units) Fi is four, but of course the number is not limited, and the number of indexing positions can be varied by increasing the number of standby positions.

As described above, according to the present invention, by equipping the electronic component insertion machine with a means for pushing out the preceding components, it is possible to automatically insert even high-density printed circuit boards without damaging adjacent components. It is possible to improve productivity in terms of both cost reduction due to miniaturization of circuit boards and high-speed automation of mounting work for various printed circuit boards.

[Brief explanation of drawings]

Fig. 1 is an overview diagram showing various examples of electronic components. Fig. 2 is a perspective view showing an example of an electronic component insertion machine suitable for carrying out the present invention. Fig. 5 is an overview diagram showing various examples of electronic components. 4 is a partial enlarged view sequentially showing two sides of the electronic component implantation work according to the present invention, and FIG. 5 is a schematic side view showing an example of the procedure for inserting the lead wire into the printed circuit board. It is. 1...Electronic component 1a...Body 1b...Lead wire 2...Tape 3...Spread hole 4...Printed circuit board 5...Insertion hole 6...Preceding component 7...・Cylinder 8... Rondo 9... Chip 10... Frame 11... Foot A-, gripping device B... Cutting device C... Measuring device D... Positioning device E... Drive Device F...Meaning for pushing away the preceding parts G...Transportation pallet AI...Head part A! ...Index part a1b%c, d-...Head unit a1...Head claw holder (α) (Fishing (C)) F2
m 3rd Prisoner ((L) 0) CC) 4th Entrance

Claims (1)

[Scope of Claims] A gripping device that grips and uses a head claw to grip the main body portion of an electronic component consisting of a main body and a plurality of lead wires that move in the same direction;
A cutting device that cuts the lead wires of the electronic part into different lengths, a measuring device that detects the position of the tip of the lead wire, and an electronic part of the printed circuit board based on the information of the detected position. Move the printed circuit board to match the planned planting location. a positioning device that moves, a drive device that drives the insertion operation of the gripping device that implants the electronic component on the printed circuit board and the opening and closing operation of the head claw, and a control device that collectively manages the sequence of each of the above devices. Electronic component insertion machine sniffer, equipped with. When inserting the gripping device into the planned position for implanting the electronic components on the printed circuit board, the electronic components that have already been implanted are pressed and bent at adjacent positions on the same board to secure a movement space for the head claws of the gripping device 1. An electronic component insertion machine characterized in that it is equipped with a means for pushing away components in the order in which they are placed.