JPS5864100A - Cooling structure for electronic equipment - Google Patents
Cooling structure for electronic equipmentInfo
- Publication number
- JPS5864100A JPS5864100A JP16309781A JP16309781A JPS5864100A JP S5864100 A JPS5864100 A JP S5864100A JP 16309781 A JP16309781 A JP 16309781A JP 16309781 A JP16309781 A JP 16309781A JP S5864100 A JPS5864100 A JP S5864100A
- Authority
- JP
- Japan
- Prior art keywords
- air
- cooling
- cooled
- unit
- cooling structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 26
- 230000007423 decrease Effects 0.000 claims description 2
- 230000020169 heat generation Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】 本発明は電子機器の冷却構造に関する。[Detailed description of the invention] The present invention relates to a cooling structure for electronic equipment.
従来仁の種の冷却構造は、ＪＩ１図に示すようＫ。The cooling structure of conventional kernel seeds is K as shown in Figure JI1.
機器の筐体１内に、発熱するパッケージ実装具ニット（
以下ユニットとする）２，３．４を上下に重ねて実装し
九場合、筐体１の下部に冷却用ファン６を設けて強制的
に空気冷却を行っている。冷却空気は、矢印７で示す如
く下部のユニット４を通過した後、そのｔま隣接した上
方のユニット３に入シ、願次各エニットを通って排出さ
れる。従って、上部に実装されるユニットはど冷却用空
気の流速あるいは流量が減少すると共に、下部に実装さ
れるユニット内から発生する熱の影響によシ著しく冷却
能力が低下する欠点があった。Inside the device housing 1, there is a package mounting tool knit (
In the case where the units 2, 3, and 4 (hereinafter referred to as units) are mounted one on top of the other, a cooling fan 6 is provided at the bottom of the housing 1 to perform forced air cooling. After the cooling air passes through the lower unit 4 as shown by arrow 7, it enters the adjacent upper unit 3 and is discharged through each unit. Therefore, the flow velocity or flow rate of the cooling air in the unit mounted at the top is reduced, and the cooling capacity is significantly reduced due to the influence of heat generated from within the unit mounted at the bottom.
本発明の目的は、被冷却体の側面に断面積の異なる吸、
排気ダクト及び風量調節用ツインを設けることによシ上
記の欠点を解決し、有効な冷却を。The object of the present invention is to provide suction with different cross-sectional areas on the side surface of the object to be cooled.
By providing an exhaust duct and a twin airflow control system, the above drawbacks are resolved and effective cooling is achieved.
もたらし得る電子機器の冷却構造を提供することにある
。The object of the present invention is to provide a cooling structure for electronic equipment that can be used to cool electronic devices.
この目的のために本発明は、電子機器の発熱部を有効に
冷却するため、被冷却体（：Ｌ＝ニットの側面に、被冷
却体へ冷却風を案内する吸気ダクトと被冷却体からの空
気を機器外へ排出する排気ダクトを設け、吸気ダクト側
は、吸気部から被冷却体の連部（冷気取り入れ用ファン
から遠方の位置）に向かってダクトの断面積が減少する
ように形成し１反対に排気ダクト側は、被冷却体から排
気部に向かってダクトの断面積が増大するように形成す
ることにより、各被冷却体（各ユニット）への冷気送風
量（風速）を均等化すると共に、他の被冷却体（ユニッ
ト）からの発熱の影響をなくしたものである。又、各ユ
ニットの冷気導入口に、実装されたパッケージごとの風
量調節用フィンを設け、各フィンの長さ、角度をそれぞ
れ適切に選定することによシ、パッケージの発熱量に応
じた冷気を送れるようにしたものである。To this end, in order to effectively cool the heat generating part of electronic equipment, the present invention has developed an air intake duct that guides cooling air to the object to be cooled and an air intake duct on the side surface of the object to be cooled (L = knit) to guide cooling air to the object to be cooled. An exhaust duct is provided to exhaust air to the outside of the equipment, and the intake duct side is formed so that the cross-sectional area of the duct decreases from the intake section to the continuous section of the cooled object (a position far from the cold air intake fan). 1 On the other hand, the exhaust duct side is formed so that the cross-sectional area of the duct increases from the object to be cooled to the exhaust section, thereby equalizing the amount of cold air (air speed) sent to each object to be cooled (each unit). At the same time, it eliminates the influence of heat generation from other objects (units) to be cooled.Furthermore, the cold air inlet of each unit is provided with fins for adjusting the air volume for each mounted package, and the length of each fin is By appropriately selecting the angle and angle, it is possible to send cool air according to the amount of heat generated by the package.
次に、本発明を、実施例について、図面を参照して詳細
に説明する。Next, the present invention will be described in detail with regard to embodiments with reference to the drawings.
本発明の実施例を示す１８２図において、本発明の冷却
構造は筐体８に実装されるユニツ）９．１０゜１１の片
側面に、吸気部１８よシ上部ユニツ）Ｋ向かうに従って
ダクトの断面積が減少するような吸気ダクト１２と、他
の片側面に、下部工ニットから排気部１９に向かうに従
ってダクトの断面積が増大するような排気ダクト１３を
形成し、さらにユニツ） ９、ＩＩ ０．１１の冷気導
入部に、ユニット内に実装される各パッケージ１４に対
応し九複数個の風量調節用フィ／１６を取シ付けである
。In FIG. 182 showing an embodiment of the present invention, the cooling structure of the present invention has a duct section on one side of the unit 9. 9, II 0 A plurality of nine air volume adjusting fifties 16 corresponding to each package 14 mounted in the unit are attached to the cold air introduction section of .11.
吸気ダクト１２及び排気ダクト１３は、ユニット９．１
．０，１．１の側面に設けるととＫより、互いに他のユ
ニットからの発熱の影響を受けることなく、また、ンク
トの断面積を変化させることにより、各ユニットに対し
て冷却空気の流量と冷却空気温度との関係を適切ならし
め、これＫよって各ユニットを均等に冷却せしめている
。各ユニットの冷気導入部に設けた風量調節フィン１６
は、ユニット内に実装されるパッケージ１４の各発熱量
に見合った風量（風速）を詞１節−し冷却空気を有効に
使用する役目をし、ている。即ち図示のように上方の一
メツケージｔ１ど、そのフィンの長さを長くし冷却空気
の風量を調節している。フィンの角度を各々変えたりし
てもよいことは勿論である。The intake duct 12 and the exhaust duct 13 are connected to the unit 9.1.
．． When installed on the sides of 0 and 1.1, each unit is not affected by heat generation from other units, and by changing the cross-sectional area of the unit, the flow rate of cooling air can be adjusted to each unit. The relationship with the cooling air temperature is made appropriate, thereby allowing each unit to be cooled equally. Air volume adjustment fin 16 provided at the cold air introduction part of each unit
The function is to use the cooling air effectively by setting the air volume (wind speed) commensurate with the amount of heat generated by each package 14 mounted in the unit. That is, as shown in the figure, the length of the fins of the upper mesh cage t1 is increased to adjust the amount of cooling air. Of course, the angles of the fins may be changed.
本発明は、以上に説明したように、被冷却体の側面に断
面積の異なる吸％排気ダクトとユニット内に実装される
パッケージ（被冷却体）ごとの風量調節用フィンを設け
ることにより、電子機器の冷却効率を上ける効果がある
。As explained above, the present invention provides an electronic system by providing an absorption/exhaust duct with a different cross-sectional area on the side surface of the object to be cooled and fins for adjusting the air volume for each package (object to be cooled) mounted in the unit. It has the effect of increasing the cooling efficiency of equipment.
ｔｓ１図は従来の電子機器の冷却構造を示した概略的な
縦断面図、第２図は本発明の実施例に係る電子機器の冷
却構造を示した縦断面図である。
８・・・筐体、
°９％ １０．１１・・・ユニット、
１２・・・吸気ダク）、 １Ｂ・・・排気ダクト、
１４・・・パッケージ、 １５・・・ファシ、１
６・・・風量調節用フィン、
１８・・・吸気部、 １９・・・排気部。
代理人 弁理士 染 川 利 吉
第１図ts1 is a schematic vertical sectional view showing a conventional cooling structure for an electronic device, and FIG. 2 is a vertical sectional view showing a cooling structure for an electronic device according to an embodiment of the present invention. 8... Housing, °9% 10.11... Unit, 12... Intake duct), 1B... Exhaust duct,
14...Package, 15...Fashion, 1
6...Fin for adjusting air volume, 18...Intake part, 19...Exhaust part. Agent Patent Attorney Toshiyoshi Somekawa Figure 1
Claims (1)
トと、被冷却体から空気を機器外へ排出する排気ダクト
とを有する電子機器の冷却構造において、前記吸気ダク
トは吸気′部側から遠方の被冷却体側へ向かって断面積
が減少し、前記排気ダクトは機器の空気排出部側へ向か
って断面積が増大しておシ、かつ、被冷却体の各冷却空
気導入部は風量調節用のフィンを有することを特徴とす
る電子機器の冷却構造。In a cooling structure for an electronic device that includes a cooling fan, an intake duct that guides cooling air to an object to be cooled, and an exhaust duct that exhausts air from the object to be cooled to the outside of the device, the air intake duct is configured to The cross-sectional area of the exhaust duct decreases toward the distant object to be cooled, and the cross-sectional area of the exhaust duct increases toward the air exhaust section of the equipment, and each cooling air introduction section of the object to be cooled is configured to adjust the air volume. A cooling structure for electronic equipment characterized by having fins for use in cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16309781A JPS5864100A (en) | 1981-10-13 | 1981-10-13 | Cooling structure for electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16309781A JPS5864100A (en) | 1981-10-13 | 1981-10-13 | Cooling structure for electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5864100A true JPS5864100A (en) | 1983-04-16 |
Family
ID=15767119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16309781A Pending JPS5864100A (en) | 1981-10-13 | 1981-10-13 | Cooling structure for electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5864100A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032721A (en) * | 2013-08-05 | 2015-02-16 | 株式会社東芝 | Heating element housing device |
-
1981
- 1981-10-13 JP JP16309781A patent/JPS5864100A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015032721A (en) * | 2013-08-05 | 2015-02-16 | 株式会社東芝 | Heating element housing device |
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