JPS5864021A - Manufacturing device for continuously film - Google Patents

Abstract

PURPOSE:To enhance the availability factor of a film manufacturing device by a method wherein a film forming speed measuring means is made to operate at every set number of sheet of substrates according to a measuring time instruction means, a control signal generating means and a shutter. CONSTITUTION:When a film is to be manufactured on a substrate 9 of the first sheet, a shutter 10 is made to perform opening action according to a switching signal e, and because a film forming speed measuring means 6 functions, a film manufacturing material is adhered to the substrate from a film manufacturing means 5, while a measured value of film forming speed is sent to a control signal generating means 7, a control signal b is sent to an electric power source 8 according to the compared value of the measured value and a set value, electric power c is sent out, and is controlled as to coincide with the set value. After the thin film is formed on the substrate 9, the shutter 10 is operated to close according to the switching signal (e), and the film forming speed measuring means 6 is covered with the shutter 10. Every time when the substrate is conveyed out from a gate valve 3, a measuring time instruction means 11 perform counting, and the counted value thereof is sent to a setting device to be compared with the set value, and when the number of sheets reached the set value, a measurement instruction signal (d) is outputted to send out the switching signal (e), and after the shutter 10 is made to perform opening operation again for the prescribed hours, the film forming speed measuring means 6 is covered again.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a continuous film forming apparatus for forming a thin film on a single substrate of a thin film functional element such as a wire, IC, or FAX.

An example of the prior art closest to the present invention is shown in FIG.

The conventional film forming apparatus shown in this figure includes a processing chamber 1, an r-topal f2 for carrying in substrates, and a dart pulp 3 for carrying substrates, which are provided on one side wall and the other side wall of the carcass processing chamber 1. A film forming means 5 installed at a position opposite to the film forming position in the processing chamber 1, and a substrate conveying means 4 arranged inside the processing chamber 1.
, a film forming rate measuring means 6 , a control signal generating means 7 disposed outside the processing chamber 1 , and a power source 8 .

In the film forming apparatus, the inside of the processing chamber 1 is kept in a vacuum, and a substrate 9 to be processed is placed on the transport means 4 through the y-topulp 2. The substrate 9 is transported to a film forming position within the substrate 9, and the film forming material (not shown) that jumps out from the film forming means 5 is attached to the substrate 9.

During this film forming process, the film forming rate is measured by the film forming rate measuring means 6, and the measured value a is sent to the control signal generating means 7. The measured value 1 of the film forming speed that is sent is compared with the set value, and based on the comparison value, a control signal is sent from the control signal generating means 7 to the power source 8, and then, based on the control signal bK, the power source 8 controls the film forming speed. If the film forming speed and set value match the film means 5,
Electric power C is applied so that a film forming material is supplied from the film forming means 5 onto the substrate 9, and a thin film is formed.

The substrate on which the thin film is formed is transported by the transport means 4,
It is taken out through the Dart Palzo 3 for carrying out the substrate and sent to the next process.

``A crystal resonator type sensor is generally used as the film forming rate measuring means 6. This crystal oscillator sensor utilizes the property that the resonant frequency of the oscillator changes depending on the thickness of the film attached to the oscillator, and once the thickness of the film attached to the oscillator reaches a certain value, measurement becomes impossible. Unfortunately, the vibrator needs to be replaced. The number of times this vibrator can be measured is extremely small, and the film is formed by facing the film forming means 5 one by one.
In the single sheet manufacturing method, the vibrator must be replaced more frequently.

Furthermore, although the processing chamber 1 is kept in a vacuum, it usually takes a long time, several hours, to return the processing chamber 1 to the original vacuum after the processing chamber 1 is brought to atmospheric pressure in order to replace the vibrator.

Therefore, when continuously forming films using a conventional single-layer film forming apparatus, there is a disadvantage that the down time of the apparatus due to the replacement of the vibrator is long, and the operation rate of the film forming apparatus is significantly reduced. It is difficult to realize the quality of the vacuum in the processing chamber 1 with good reproducibility, and as a result, the quality of the film, which is sensitively affected by the quality of the vacuum, is affected, resulting in a reduction in product yield. - In the patch processing method, which is different from the above-mentioned film forming apparatus, in which a large number of substrates are stored in a processing chamber at once and film formed, rounding and film forming means that increase the number of times the vibrator is used are used. The distance from the oscillator to the oscillator is made larger than the distance from the film forming means to the substrate. For this reason, the amount of film-forming material that adheres to the vibrator is smaller than the amount of film-forming material that adheres to the substrate, which reduces the measurement accuracy of the film-forming rate and ultimately reduces the product yield. there were.

SUMMARY OF THE INVENTION An object of the present invention is to provide a continuous film forming apparatus which can eliminate the drawbacks of the prior art, improve the operating rate of the film forming apparatus, and improve the yield of products.

A feature of the present invention is that a shutter is disposed between the film forming means and the film forming rate measuring means provided inside the processing chamber, and a measurement timing command means is installed outside the processing chamber, and the measurement timing command means is controlled. It was configured such that it was connected to a signal generating means and sent an opening/closing signal to the shutter through the control signal generating means after a set number of films were deposited (KTot), and with this configuration, all of the above objectives could be achieved. be.

Hereinafter, the present invention will be explained based on the drawings.

FIG. 2 shows an embodiment of the present invention, in which a processing chamber 1,
y-topalzo 2 for carrying in substrates and r++ for carrying out substrates provided on one side wall and the other side wall, 4 Rude 3,
A transport means 4 disposed within the processing chamber 1, a film forming means 5 mounted at a position opposite to the film forming position within the processing chamber 1, and a film forming means disposed at approximately the same level as the film forming position within the processing chamber 1. Membrane speed measuring means 6, control signal generating means 7 installed outside the processing chamber 1. A power source 8 connected thereto is provided.

The inside of the processing chamber 1 is kept in vacuum, and the substrate 9 to which a thin film is to be attached and formed is passed through the r-topulp 2 into the processing chamber 1.
The film-forming material supplied from the film-forming means 5 is deposited on the substrate 9 at this position.

During the film forming process, the film forming speed is measured by the film forming speed measuring means 6, and the measured value 1 is sent to the control signal generating means 7. The control signal generating means 7 compares the measured value 1 with a set value, and sends a control signal to the power source 8 based on this comparison value.

Next, power C is applied from the power supply 8 to the film forming means 5 so that the film forming speed reaches the set value, and the film forming material is supplied from the film forming means 5 in response to the electric power e4C, and a thin film is formed on the substrate 9. is attached and formed.

A substrate on which a thin film of a predetermined thickness is formed is transferred to the conveying means 4? -) The pulp is transported in the direction of the r-to pulp 3, taken out from the r-to pulp 3, and sent to the primary process.
In a film forming apparatus such as the above, a shutter 10 is disposed between the film forming means 5 and the film forming rate measuring means 6, and a measurement timing command means 11 is installed outside the processing chamber 1. The shutter 10 is characterized in that it is connected to send a measurement instruction signal d to the control signal generating means 7, and the shutter 10 is connected so as to operate upon receiving an opening/closing signal from the control signal generating means 7.

The measurement timing command means 11 includes a sheet number setting device, a counter, and a comparator, and sets an arbitrary number of sheets with the sheet number setting device, and inserts the set value into the comparator. When one substrate on which a thin film has been formed is carried out from the dirt pulp 3 for use, it is counted and sent to a comparator, and the comparator compares the set value with the number of substrates carried out. When the number of printed boards reaches the set value,
The shutter 10 is configured to send a measurement instruction signal d to the control signal generation means 7. The shutter 10 is opened/closed based on the measurement instruction signal d sent from the measurement timing instruction means 11. The continuous film forming apparatus of the above embodiment operates as follows.

When forming a film on the first substrate 9,
Opening/closing signal from control signal generating means 7/Yoshishita shutter 1
0 is opened so that the film forming rate measuring means 6 functions.

Next, a film-forming material is supplied from the film-forming means 5 onto the substrate 9, and the film-forming material is deposited thereon, and the film-forming speed is measured by the film-forming speed measuring means 6, and the measured value is controlled as described above. The control signal generating means 7 compares the measured value and the set value, and based on the comparison value, the control signal generating means 7 sends a signal to the signal generating means 7.
A control signal is sent from the power supply 8 to the power supply 8, and based on the control signal, power is sent to the film forming means 5, and the film forming speed is controlled so as to match the set value.

After a certain period of time has elapsed, that is, after a thin film has been applied to at least one substrate 9, an opening/closing signal is sent from the control signal generating means 7, the shutter shutter 10 is closed, and the film forming rate measuring means 6 is activated. Shutter 10 to prevent film material from adhering.
covered by

Next, each time the substrate on which the thin film has been formed is carried out from the r-) pulp 3 for carrying out the substrate, it is counted by the counter of the measurement timing command means 11, and the counted value l is sent to the setting device. The gate pulse f3 is compared with the set value.
When the number of substrates carried out from the board reaches the set value, the measurement instruction signal d is sent from the measurement timing command means 11 to the control signal generation means 7, and as described above, the control signal generation means 7 issues an opening/closing signal to the shutter 10. is sent, the shutter 10 is opened again for a certain period of time, the film forming rate measuring means 6 is activated, and after the certain period of time has elapsed, the shutter 10 is closed and the film forming rate measuring means 6 is covered again.

The above operation is repeated for each set number of substrates 9, and the film formation rate is measured each time.

Therefore, the film forming rate measuring means 6 is, for example, a (material) sheet, etc.
Since the substrate 9 is opened and operated during the film forming process for a set number of substrates, and is covered by the shutter 10 when not in operation, the number of substrates 9 processed until the film forming rate measuring means 6 needs to be replaced can be dramatically reduced. can be increased to

Note that the other configurations are the same as those described with respect to FIG. 1.

Further, in the above embodiment, a case where feedback control is applied to the electric power so that the film forming rate is constant has been explained, but this is not limited to this, and a time control type K that controls the film forming time can also be applied. 〇The present invention has the above-described configuration 1, in which the film forming rate measuring means is activated for each set number of substrates by the cooperation of the measurement timing command means, the control signal generating means, and the shutter,
Since the shutter covers the film forming material to prevent it from adhering when it is not in operation, the number of substrates to be processed before the film forming rate measuring means needs to be replaced can be greatly increased, resulting in a reduction in the operation rate of the film forming equipment. In addition to significantly improving the effect, the quality of vacuum can be maintained stably by reducing the number of times the process chamber changes from vacuum to atmospheric pressure.

In addition, since the film-forming rate measuring means can be placed at approximately the same level as the film-forming position on the substrate, measurement accuracy is improved, and the yield of products can also be improved.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a conventional film forming apparatus, and FIG. 2 is a block diagram showing an embodiment of the apparatus of the present invention. DESCRIPTION OF SYMBOLS 1... Processing chamber, 4... Substrate film forming means, 5... Film forming means, 6... Film forming rate measuring means, 7... Control signal generator stage, 8... Power supply, 9... Board% 10...
Shutter, 11...Measurement timing command means, a...Measurement value of film formation rate, b...Control signal of power supply, C...Electric power, d...Measurement instruction signal,...Shutter open/close signal. Agent Patent Attorney Seikyo AkimotoFigure 1Figure 2

Claims (1)

[Claims] The substrates are sequentially carried into a processing chamber kept in a vacuum, and a film forming means connected to a power source supplies and deposits a film forming material onto the substrate, and a film forming rate measuring means is used to form a film. The speed is measured, the measured value is sent to a control signal generating means, and the film forming speed is controlled by sending a control signal from the control signal generating means to the power source based on the measured film forming speed, so that a thin film is formed. In a film forming apparatus of the type in which substrates are removed one after another from a processing chamber, a shutter is disposed between a film forming means and a film forming rate measuring means provided in the processing chamber, and a measurement timing command means is provided outside the processing chamber. , the measurement timing command means is connected to the control signal generation means, and an open/close signal is sent to the shutter through the control signal generation means after a set number of films have been formed. Device.