JPS5857930A - Temperature controlling unit of injection molding machine - Google Patents

Temperature controlling unit of injection molding machine

Info

Publication number
JPS5857930A
JPS5857930A JP15608881A JP15608881A JPS5857930A JP S5857930 A JPS5857930 A JP S5857930A JP 15608881 A JP15608881 A JP 15608881A JP 15608881 A JP15608881 A JP 15608881A JP S5857930 A JPS5857930 A JP S5857930A
Authority
JP
Japan
Prior art keywords
temperature
resin
heater
pressure
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15608881A
Other languages
Japanese (ja)
Inventor
Tomoyuki Akashi
友行 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP15608881A priority Critical patent/JPS5857930A/en
Publication of JPS5857930A publication Critical patent/JPS5857930A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • B29C45/78Measuring, controlling or regulating of temperature

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To keep the temperature of resin at the time of injection precisely at a desired value in the titled temperature controlling device for controlling a heater by a detected resin temperature by controlling temperature change factors too due to the performance of a movable part. CONSTITUTION:Resin 14 taken from a hopper 11 into a cylinder 12 is heated and melted in a heater and a screw 16 is moved by a driving source 18 toward the left to inject resin 14 into a mold 17. In above-mensioned unit, resin temperature T detected by a temperature detector 15 and the pressure P detected by a pressure detector 20 when the resin is injected are transmitted to an arithmetic unit 30 (marks 27, 28 show amplifiers) to obtain a correction quantity epsilon indicated by the formula (x is a set temperature; K1, K2 are constants; DELTAT indicates the increment part of resin temperature parallel to pressure P). Then, this epsilon is transmitted to a heater driving circuit 31 to correct the operational quanity to the heater 13. Using injection speed V, injection quantity D, number N of revolution of the screw, etc. along with the pressure P injected as mentioned above, the precision of temperature control can be lifted.

Description

【発明の詳細な説明】 一般に,射出成形機はシリンダー内に充填された樹脂を
ヒータによシ加熱溶融し,この溶融された樹脂をスクリ
ューを用いて金型内に押し出すことによって,所定形状
の製品を成形している。このような射出成形機を用いて
,一定品質の製品を再現性よく製作するためには,融解
された樹脂の温度を一定に保つ必要がある。この目的の
ために。
[Detailed description of the invention] In general, an injection molding machine heats and melts resin filled in a cylinder using a heater, and extrudes the molten resin into a mold using a screw to form a predetermined shape. Molding the product. In order to manufacture products of constant quality with good reproducibility using such injection molding machines, it is necessary to maintain the temperature of the molten resin at a constant level. For this purpose.

従来,ヒータによって加熱されたシリンダー又は樹脂の
温度を温度検出器により検出し,検出された温度と設定
された温度とを比較して,両者の偏差が少なくなるよう
に制御する温度制御装置が射出成形機に取シ付けられて
いる。
Conventionally, a temperature control device detects the temperature of the cylinder or resin heated by a heater with a temperature sensor, compares the detected temperature with a set temperature, and controls the temperature so that the deviation between the two is reduced. It is attached to the molding machine.

本発明者の観察によれば,シリンダー又は樹脂の温度は
射出の際の圧力,射出速度,射出量,あるいはスクリー
ーの回転速度等,射出時における動的な因子に依存して
微妙に変化し,射出が繰り返されている間に,これら動
的な因子による温度変化が無視できなくなる程大きくな
ることが確認された。
According to the observations of the present inventor, the temperature of the cylinder or resin changes slightly depending on dynamic factors during injection, such as the pressure during injection, injection speed, injection amount, or rotational speed of the screen. It was confirmed that during repeated injections, temperature changes due to these dynamic factors became so large that they could no longer be ignored.

上述した従来の温度制御装置は射出時における動的な因
子による温度変化を温度制御に反映していない。したが
って、従来の温度制御装置を備えた射出成形機は製品の
バラツキを避けることができず、したがって、製品の品
質に対するより厳しい要求には応えられない。更に、従
来の温度制御装置は成形条件を変更した場合環、温度の
安定化に時間がかかるという欠点もある。
The conventional temperature control device described above does not reflect temperature changes due to dynamic factors during injection into temperature control. Therefore, injection molding machines equipped with conventional temperature control devices cannot avoid product variations, and therefore cannot meet more stringent requirements for product quality. Furthermore, conventional temperature control devices also have the disadvantage that it takes time to stabilize the temperature when the molding conditions are changed.

本発明の目的は射出時における温度変化をも考慮して高
精度に温度を制御でき、したがって、製品のバラツキを
少なくできる射出成形機の温度制御装置を提供すること
である。
SUMMARY OF THE INVENTION An object of the present invention is to provide a temperature control device for an injection molding machine that can control temperature with high precision, taking into account temperature changes during injection, and can therefore reduce product variations.

本発明の他の目的は成形条件を変化したときにも、温度
を迅速に安定化できる射出成形機の温度制御装置を提供
することである。
Another object of the present invention is to provide a temperature control device for an injection molding machine that can quickly stabilize the temperature even when molding conditions are changed.

本発明によれば、温度検出器により温度を検出し、検出
された温度によってヒータ部を制御する射出成形機の温
度制御装置において、射出成形機の可動部の動作の際に
動的に変化する因子1例えば、圧力、射出速度、可動部
の位置、可動部の回転数等を検出する検出素子と、検出
素子で検出された因子と温度検出器からの温度との関係
から。
According to the present invention, in a temperature control device for an injection molding machine that detects temperature with a temperature detector and controls a heater section based on the detected temperature, the temperature changes dynamically when a movable section of the injection molding machine operates. Factor 1: For example, from a detection element that detects pressure, injection speed, position of the movable part, rotation speed of the movable part, etc., and the relationship between the factors detected by the detection element and the temperature from the temperature detector.

ヒータ部の操作量を可動部の動作中に実時間的に演算し
、補正する実時間演算装置とを備えた射出成形機の温度
制御装置が得られる。
A temperature control device for an injection molding machine is obtained, which includes a real-time calculation device that calculates and corrects the operation amount of the heater portion in real time during the operation of the movable portion.

以下1図面を参照して説明する。This will be explained below with reference to one drawing.

第1図を参照すると1本発明を適用できる射出成形機は
樹脂を格納しておくホラA?−11と、とのホラ/”−
11からの樹脂が充填されるシリンダー12とを備えて
いる。このシリンダー12にはヒータ13が取り付けら
れており、ヒータ13は後述するヒータ駆動回路からの
操作量に応じて加熱されている。シリンダー12内に充
填された樹脂14はヒータ13で加熱され、融解されて
いる。
Referring to FIG. 1, an injection molding machine to which the present invention can be applied has a hole A for storing resin. -11 and the hora/”-
The cylinder 12 is filled with resin from 11. A heater 13 is attached to this cylinder 12, and the heater 13 is heated according to the amount of operation from a heater drive circuit, which will be described later. The resin 14 filled in the cylinder 12 is heated by the heater 13 and melted.

シリンダー12の温度又はシリンダー12内の樹11旨
14の温度Tは温度検出器15で検出され、第2図を参
照して説明する温度制御装置に送出される。
The temperature of the cylinder 12 or the temperature T of the tree 11 or 14 inside the cylinder 12 is detected by a temperature sensor 15 and sent to a temperature control device which will be explained with reference to FIG.

シリンダー内の樹脂14は射出時に、可動部を構成する
スクリュー16によって、金型17内に押し出され、金
型17内で成形される。スクリー−16はスクリュー駆
動源18により、射出時。
During injection, the resin 14 in the cylinder is extruded into a mold 17 by a screw 16 constituting a movable part, and is molded within the mold 17. The screw 16 is driven by a screw drive source 18 during injection.

図の左方向に駆動される。また、スクリー−16の回転
にともなって樹脂14が計量され、一定量の樹脂が金型
内に注入される。
It is driven to the left in the figure. Further, as the screen 16 rotates, the resin 14 is measured, and a certain amount of the resin is injected into the mold.

この実施例では、温度検出器15だけでなく。In this embodiment, not only the temperature sensor 15.

射出の際の圧力Pを検出するための圧力検出器20がス
クリュー駆動用シリンダー21に設けられている。圧力
検出器20で検出された圧力Pは射出動作時における動
的な因子として、温度制御装置に送出されている。更に
、射出動作時における動的な因子として、スクリーー位
置り、射出速度Vあるいはスクリューの回転数N等を検
出するために、スクリュー位置検出器24.射出速度検
出器25、及びスクリュー回転数検出器26等が設けら
れてもよい。尚、スクリュー位置検出器24の位置から
射出址を検出することも可能である。
A pressure detector 20 for detecting the pressure P during injection is provided in the screw driving cylinder 21. The pressure P detected by the pressure detector 20 is sent to the temperature control device as a dynamic factor during the injection operation. Furthermore, a screw position detector 24. An injection speed detector 25, a screw rotation speed detector 26, etc. may be provided. Incidentally, it is also possible to detect the injection site from the position of the screw position detector 24.

第2図を参照すると9本発明の一実施例に係る温度制御
装置は温度検出器15からの温度Tを受ける温度用アン
f27.圧力検出器20からの圧力Pを受ける圧力用ア
ンプ28.これらアンプから与えられる温度T及び圧力
Pとを実時間的に処iするマイクロプロセッサ等の演算
装置30及びこの演算装置の処理結果をヒータ13に操
作量の形で送出するヒータ駆動回路31とを有している
Referring to FIG. 2, a temperature control device according to an embodiment of the present invention includes a temperature control panel f27. Pressure amplifier 28 that receives pressure P from pressure detector 20. A computing device 30 such as a microprocessor that processes the temperature T and pressure P given from these amplifiers in real time, and a heater drive circuit 31 that sends the processing results of this computing device to the heater 13 in the form of manipulated variables. have.

ヒータ駆動回路31の出力によって、ヒータ13は射出
時に動的に変化する圧力をも考慮して制御される。
The heater 13 is controlled by the output of the heater drive circuit 31, taking into consideration dynamically changing pressure during injection.

第3図を参照すると、射IB過程の圧力Pと温度(特に
、樹脂温)Tとの関係が示されている。図からも明らか
な通り、スクリー−16の前進によって圧力がPoにな
ると、温度Tは設定温度からΔToだけ上昇している。
Referring to FIG. 3, the relationship between pressure P and temperature (especially resin temperature) T during the injection IB process is shown. As is clear from the figure, when the pressure reaches Po due to the advance of the scree 16, the temperature T increases by ΔTo from the set temperature.

言い換えれば、射出過程での圧力に比例して樹脂温度は
上昇し、このため。
In other words, the resin temperature increases in proportion to the pressure during the injection process, and therefore.

射出過程中、設定温度を維持できなくなることがわかる
It can be seen that the set temperature cannot be maintained during the injection process.

第2図に示した演算装置は圧力Pと樹脂温度Tの変化(
ΔT)とを考慮して、圧力Pをあられす圧力検出器20
からの信号に応じて、温度変化(ΔT)を計算し、ヒー
タ13への操作量を補正する。この補正には1例えば1
次のような補正式を用いることができる。
The calculation device shown in Fig. 2 changes the pressure P and resin temperature T (
A pressure detector 20 detects the pressure P by considering ΔT).
The temperature change (ΔT) is calculated in accordance with the signal from the heater 13, and the operation amount to the heater 13 is corrected. For example, 1 is required for this correction.
The following correction formula can be used.

ε= x −KI T  K2ΔT(1)(但し、εは
偏差、又は設定温度+ Kl + K2は定数である) 第4図を参照すΣと、第(1)式の演算を行なう演算装
置30は温度検出器15からの温度Tに定数Kl f乗
算する乗算器(K1)と、圧力検出器20からの圧力P
から得られた温度変化(ΔT)に定数に2を乗算する乗
算器(K2)とを有している。設定温度Xは減算器に与
えられ、減算器では、設定温度Xから各乗算器からの出
力値KI T h K2ΔTを減算し、偏差εを求める
。演算された偏差εはヒータ駆動回路31を介して、ヒ
ータ13へ操作量として供給される。
ε= x −KIT K2ΔT (1) (where ε is the deviation, or set temperature + Kl + K2 is a constant) Refer to FIG. is a multiplier (K1) that multiplies the temperature T from the temperature sensor 15 by a constant Kl f, and the pressure P from the pressure sensor 20.
It has a multiplier (K2) that multiplies the temperature change (ΔT) obtained from the constant by 2. The set temperature X is given to a subtracter, and the subtracter subtracts the output value KI T h K2ΔT from each multiplier from the set temperature X to obtain the deviation ε. The calculated deviation ε is supplied to the heater 13 as a manipulated variable via the heater drive circuit 31.

また、射出前に設定した圧力Po を用いて1.第3図
の関係にしたがって、温度変化ΔTo、’を予測し。
In addition, 1. using the pressure Po set before injection. Predict the temperature change ΔTo,' according to the relationship shown in FIG.

射出動作に対して遅れることなく、ヒータ13への操作
量を決定することも可能である。この場合。
It is also possible to determine the amount of operation to the heater 13 without delaying the injection operation. in this case.

例えば1次式を使用できる。For example, a linear expression can be used.

ε=z−KITK2(ΔT−Δ’rO)   (2)(
2)式において、(ΔT−ΔTo)の項は設定値と検出
値との偏差を補正するための補正項である。
ε=z−KITK2(ΔT−Δ′rO) (2)(
In equation 2), the term (ΔT−ΔTo) is a correction term for correcting the deviation between the set value and the detected value.

第2図〜第4図の実施例では圧力と温度変化との関係に
ついてのみ説明したが2本発明者の実験によれば、射出
速度Vと樹脂温度の・変化ΔTについても第3図のよう
な比例関係が認められた。したがって、射出速度Vと樹
脂温度の変化ΔTとの関係を利用することによっても、
ヒータ13の操作量を補正することができる。
In the embodiments shown in FIGS. 2 to 4, only the relationship between pressure and temperature change was explained, but according to the experiments of the inventor, the injection speed V and the change ΔT in resin temperature are also as shown in FIG. A proportional relationship was observed. Therefore, by using the relationship between the injection speed V and the change in resin temperature ΔT,
The operation amount of the heater 13 can be corrected.

第5図を参照すると2本発明の他の実施例に係る温度制
御装置は温度T及び圧力Pのほかに、射出速度V、射出
量(スクIJ、−位置)D、′及びスクリュー回転数N
をも、射出時の動的な因子として考慮し、これら因子間
の関係から温度変化ΔTを計算する。この実施例に、各
検出器からアナログ信号の形で供給される各因子をディ
ジタル信号に変換するA/b変換器33を備え、各ディ
ジタル信号はマイクロプロセッサで構成されるディジタ
ル任意関数発生装置34に与えられる。ことで。
Referring to FIG. 5, the temperature control device according to another embodiment of the present invention controls, in addition to temperature T and pressure P, injection speed V, injection amount (screw IJ, -position) D,' and screw rotation speed N.
are also considered as dynamic factors during injection, and the temperature change ΔT is calculated from the relationship between these factors. This embodiment includes an A/b converter 33 that converts each factor supplied in the form of an analog signal from each detector into a digital signal, and each digital signal is generated by a digital arbitrary function generator 34 configured with a microprocessor. given to. By the way.

この発生装置で発生される関数は各因子間の関係から実
験的に求めたものを使用できる。このディジタル任意関
数発生装置34は上述した関数に基いて計算された温度
変化ΔTを温度検出値Tと共に、ディジタル信号の形で
D/A変換器35に送出する。D/A変換器35でアナ
ログ信号に変換された温度検出値T及び温度変化ΔTは
それぞれ増幅:咎36及び37を介して加算器38に与
えられる。
The function generated by this generator can be determined experimentally from the relationship between each factor. This digital arbitrary function generator 34 sends the temperature change ΔT calculated based on the above-mentioned function together with the detected temperature value T to the D/A converter 35 in the form of a digital signal. The temperature detection value T and temperature change ΔT converted into analog signals by the D/A converter 35 are provided to an adder 38 via amplification circuits 36 and 37, respectively.

加算器38は第(1)式にしたがって、設定温度Xと画
壇幅器からの出力を演算し、偏差εをヒータ駆動回路3
1に供給する。ヒータ駆動口ji31は偏差εをヒータ
操作量としてヒータ13に送出する。
The adder 38 calculates the set temperature
Supply to 1. The heater drive port ji31 sends the deviation ε to the heater 13 as a heater operation amount.

上述した実施例は射出過程の温度制御についてのみ説明
したが1本発明は計量過程における温度側(財)にも同
様に適用できる。ここで、計量過程は金型に射出すべき
樹脂量を一定にするために、射出工程に先立ってスクリ
ー−16を回転しながら。
Although the above-mentioned embodiment described only the temperature control in the injection process, the present invention can be similarly applied to the temperature side (goods) in the metering process. Here, the measuring process is performed while rotating the screen 16 prior to the injection process in order to maintain a constant amount of resin to be injected into the mold.

シリンダー12の先端部において計量する工程である。This is a step of measuring at the tip of the cylinder 12.

このような計量工程の際、スクリーーの回転数、圧力、
及び樹脂量の値により、樹脂の融解熱、剪断発熱量が異
な9.これらが樹脂温度の変動となってあられれる。こ
の計量工程での温度変動は射出工程にも影響を及ぼし、
最終的な製品の品質を左右する。したがって、この計量
工程中における回転数、圧力、樹1]& 量の検出値を
参照して。
During this weighing process, the number of rotations of the screen, pressure,
and 9. The heat of fusion and shear calorific value of the resin vary depending on the value of the resin amount. These appear as fluctuations in resin temperature. Temperature fluctuations during this metering process also affect the injection process,
Affects the quality of the final product. Therefore, with reference to the detected values of rotation speed, pressure, and quantity during this measuring process.

温度制御を行なうことは極めて有効である。この場合に
おける回転数等はスクリューの可動に伴なって変化する
因子であることは言うまでも々い。
Temperature control is extremely effective. Needless to say, the number of rotations and the like in this case are factors that change as the screw moves.

以上述べたように1本発明によれば、射出成形機の温度
制御の際に、温度だけでなく、温度以外の因子をも参照
して温度制御を実時間的に行なう温度制御装置が得られ
る。したがって1本発明は可動部が停止している場合だ
けでなく、可動部が何等かの動作を行なっている間でも
、温度制御可能でちり、高品質、高精度のプラスチック
製品を成形できる。
As described above, according to the present invention, it is possible to obtain a temperature control device that performs temperature control in real time by referring not only to temperature but also to factors other than temperature when controlling the temperature of an injection molding machine. . Therefore, according to the present invention, the temperature can be controlled not only when the movable part is stopped, but also while the movable part is performing some operation, and it is possible to mold plastic products of high quality and precision without dust.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明に使用される射出成形機を示す概略図、
第2図は本発明の一実施例に係る温度制御装置を示すブ
ロック図、第3図は樹脂温度の圧力依存性を示す図、第
4図は第2図に示された演算装置を具体的に説明するた
めの図、及び第5図は本発明の他の実施例に係る温度制
御装置を示すブロック図である。 記号の説明 11:ホッパー、12ニジリンダ−113:ヒータ、1
4:樹脂、15:温度検出器、16:スクリュー、17
:金型、18ニスクリユー駆動源20:圧力検出器、2
1:駆動用シリンダー。 24:スクIJ、−位置検出器、25:射出速度検出器
、26:スクリユー回転数検出器、 27 、28:ア
ンゾ、30:演算装置、31:ヒータ駆動回路+’ 3
3 : A/ll変換器、34:ディノタル任意関数発
生器、 35 : D/A変換器、36.37:増幅器
、38:加算器。
FIG. 1 is a schematic diagram showing an injection molding machine used in the present invention,
FIG. 2 is a block diagram showing a temperature control device according to an embodiment of the present invention, FIG. 3 is a diagram showing the pressure dependence of resin temperature, and FIG. 4 shows a concrete example of the calculation device shown in FIG. and FIG. 5 are block diagrams showing a temperature control device according to another embodiment of the present invention. Explanation of symbols 11: Hopper, 12 Niji cylinder - 113: Heater, 1
4: Resin, 15: Temperature detector, 16: Screw, 17
: Mold, 18 Niscrew drive source 20: Pressure detector, 2
1: Drive cylinder. 24: Screw IJ, -position detector, 25: Injection speed detector, 26: Screw rotation speed detector, 27, 28: Anzo, 30: Arithmetic device, 31: Heater drive circuit +' 3
3: A/ll converter, 34: Dinotal arbitrary function generator, 35: D/A converter, 36.37: Amplifier, 38: Adder.

Claims (1)

【特許請求の範囲】 ■、 樹脂を加熱するヒータ部と、該ヒータ部によって
加熱された樹脂を押し出すために動作する可動部とを備
えた射出成形機に使用され、前記ヒータ部の加熱による
温度を温度検出器を用いて検出し、検゛出された温度に
したがって前記ヒータ部を制御する温度制御装置におい
て、前記可動部の動作の際に変化する温度以外の因子を
検出する素う 子と、該素子によって検出された因子と前記検出された
温度との関係から、前記ヒータ部の温度を前記可動部の
動作中に、実時間的に補正する実時間演算装置とを有す
ることを特徴とする射出成形機の温度制御装置。
[Claims] (1) Used in an injection molding machine equipped with a heater section that heats resin and a movable section that operates to extrude the resin heated by the heater section, the temperature caused by the heating of the heater section The temperature control device detects the temperature using a temperature detector and controls the heater section according to the detected temperature, and the temperature control device detects a factor other than the temperature that changes during operation of the movable section. , further comprising a real-time calculation device that corrects the temperature of the heater section in real time while the movable section is operating, based on the relationship between the factor detected by the element and the detected temperature. Temperature control device for injection molding machines.
JP15608881A 1981-10-02 1981-10-02 Temperature controlling unit of injection molding machine Pending JPS5857930A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15608881A JPS5857930A (en) 1981-10-02 1981-10-02 Temperature controlling unit of injection molding machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15608881A JPS5857930A (en) 1981-10-02 1981-10-02 Temperature controlling unit of injection molding machine

Publications (1)

Publication Number Publication Date
JPS5857930A true JPS5857930A (en) 1983-04-06

Family

ID=15620035

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15608881A Pending JPS5857930A (en) 1981-10-02 1981-10-02 Temperature controlling unit of injection molding machine

Country Status (1)

Country Link
JP (1) JPS5857930A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157823A (en) * 1984-01-27 1985-08-19 Sumitomo Heavy Ind Ltd Accurate temperature controlling device for injection molding machine
JP2015164782A (en) * 2014-03-03 2015-09-17 宇部興産機械株式会社 Method for controlling heating barrel temperature of injection molding machine

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023457A (en) * 1973-06-30 1975-03-13
JPS52124061A (en) * 1976-04-12 1977-10-18 Sumitomo Heavy Industries System for controlling injection molding machine

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5023457A (en) * 1973-06-30 1975-03-13
JPS52124061A (en) * 1976-04-12 1977-10-18 Sumitomo Heavy Industries System for controlling injection molding machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60157823A (en) * 1984-01-27 1985-08-19 Sumitomo Heavy Ind Ltd Accurate temperature controlling device for injection molding machine
JP2015164782A (en) * 2014-03-03 2015-09-17 宇部興産機械株式会社 Method for controlling heating barrel temperature of injection molding machine

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