JPS5855699A - Heat accumulating medium - Google Patents

Abstract

PURPOSE:To obtain a heat accumulating medium that can be used repeatedly for a long time, by manufacturing the same by encapsulating a heat accumulating material in micro-capsules of an organic high-molecular material or an inorganic material. CONSTITUTION:In forming micro-capsules, a heat accumulating material is encapsulated in hollow fibers of polyamide, polyimide, glass or the like. Or otherwise, the heat accumulating material is formed into grains and an organic high-molecular substance is coated over the surface of the grains after the high- molecular substance is changed into liquid by melting and subsequent curing, or otherwise applied in the form of a film. Heat resisting performance of the micro- capsules is enhanced by subjecting them to after-treatment of cross-linking by use of heat, radioactive rays or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a heat storage material. Specifically, the present invention relates to a heat storage device that efficiently stores and radiates heat at the same time as storing various types of thermal energy, and that can be used repeatedly over many cycles. More specifically, the present invention relates to an improved heat storage material characterized in that the heat storage material is encapsulated in microcapsules using an organic polymeric material or an inorganic material.

Heat storage materials include those that utilize sensible heat such as general water%/13% stone, those that utilize phase changes (passion) such as melting and solidification, and those that utilize thermochemical changes such as dehydration and water absorption. It can be classified into things such as things to do.

In the prior art, a heat storage device (shell tube type, capsule type) in which a relatively large volume of heat storage material is placed in a capsule is used. In the latent heat utilization type, the volume change during phase change is relatively large, causing damage to heat exchanger tubes, etc. It is also very difficult to replace these heat transfer tubes (shell tube type). Furthermore, the capsule type has drawbacks such as the large container that houses the capsule, the need for printing pressure, and the fact that the deterioration of the heat storage phase within the capsule is unknown. An object of the present invention is to provide a heat storage material that eliminates such drawbacks and can withstand repeated use over a long period of time.

This object is achieved by the heat storage material of the present invention, which uses common heat storage materials and encapsulates them in microcapsules. The term "microcapsule" as used herein simply means that it is much smaller (outer diameter of about 10 mm or less) compared to the currently used capsules (45 wφ x 10 mL).

As the microcapsule forming material, an organic polymer 1 such as polyamide, polyimide, etc. or an inorganic material 1 such as glass, ceramics, etc. may be selected depending on the operating temperature of the heat storage material.

Methods for forming microcapsules include encapsulating the heat storage material in hollow fibers such as polyamide, polyimide, glass, etc., making the heat storage material into particles, melting and solidifying the organic polymer material on the surface, applying it as a solution, or winding it as a film. There is a method of completely improving heat resistance through soaking and post-treatment. An effective method for improving heat resistance is to perform cross-linking using heat, radiation, etc. Other effective methods include vapor-depositing a metal or the like, and forming a heat-resistant thin film on the particle surface of the heat storage material by generating plasma in an atmosphere containing a low-molecular-weight compound. Organic polymer materials often form transparent films, which also has the advantage of allowing observation of the deterioration status of the heat storage material.

This is because the heat storage material of the present invention is in the form of microcapsules.

It is easy to fill the container, and it can be easily replaced when necessary. In addition, the microforce is large, and depending on the capsule forming material, either gas or liquid can be used as the heating medium in most cases. Since the capsule-forming film is very thin, delays in heat conduction do not pose much of a problem. Also, if you look at the internal deterioration situation...
Tomodekikuzu.

Capsule-forming materials can be selected from a wide range5 and have a wide range of applications, and the size of the capsule is small, so they can be used widely from small scale to large scale, that is, from consumer to industrial use.

For heat storage materials that undergo phase changes such as melting and solidification,
The capsule-forming coating should be relatively strong.

It is necessary to ensure that the shape of the capsule does not change even when melted. In other words, it is important to select the material for the capsule depending on the type of heat storage material, and it is important to use hollow fibers and devise the structure of the device. It is effective to use glass or the like with high strength.

Claims (1)

[Claims] 1) A heat storage material comprising a heat storage material sealed in microcapsules. 2) The heat storage material according to item 1, wherein the microcapsules are an organic polymer material.