JPS5851288B2 - Cooling device for electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the structure of a cooling device for electronic equipment such as information processing equipment and electronic exchanges.

2. Description of the Related Art Electronic devices such as information processing devices and switchboards typically use fans to cool heat generating parts.

In conventional equipment, multiple electronic circuit packages with electronic components mounted on printed circuit boards are mounted on a motherboard, and fans are installed at the bottom and/or top of the electronic circuit packages to cool them by forcing air. was.

However, the fan's inlet and outlet were almost exposed, and the noise from the fan was directly emitted outside the housing, resulting in considerable noise.

As electronic circuits have become faster and more dense in recent years, the amount of heat generated has increased, forcing the use of larger fans and increasing noise levels.

Furthermore, as the density of electronic circuits increases, the number of units built into a housing increases, creating spaces between each unit.

Not all of the hot air discharged from electronic devices, that is, cooled parts, is discharged from the discharge port; some of the warm air remains in the space between the units mentioned above, and the warm air is guided to the intake port. Sometimes.

If the cooling fan is rotating at the intake port, the hot air that has remained in that space may be re-inhaled, which has the disadvantage of lowering the cooling efficiency.

The present invention provides a highly efficient cooling device that reduces the area where the suction side or exhaust side of the fan is exposed outside the housing, reduces the noise of the fan that exits outside the housing, and reduces air leakage due to the sealed structure.

In other words, an air intake duct or an air intake duct with a sealed air introduction line to the cooled part, or an exhaust duct with a sealed air discharge path from the cooled part to the discharge port, and a fan installed in the duct. This prevents the fan noise from directly exiting the device and prevents warm air from being re-inhaled.

The configuration of the present invention includes an air intake port, a cooled part (for example, an electronic device), an intake duct that seals an air introduction path from the air intake port to the cooled part, and an air discharge from the cooled part. It is characterized in that it includes an exhaust duct whose air introduction path to the outlet is sealed, and a cooling fan is provided in at least one of the intake duct and the exhaust duct.

Next, an embodiment of the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show a cooling structure in which propeller fans are provided on both sides of an electronic circuit package.

A plurality of electronic circuit packages 2 carrying a large number of electronic components 1 are horizontally inserted into connectors 4 attached to a motherboard 3.

An intake duct 1 for passing cold air and an exhaust duct 8 for passing cooled hot air are provided on both sides of the electronic circuit package 2, and a fan 5 and a fan 6 are built in the duct to suck in cold air and exhaust hot air.

In this structure, air is supplied through the intake hole 10 at the bottom of the housing 9.
The air is sucked in, passes through the air intake duct, reaches the fan 5, and is blown out into the electronic circuit package 2 by the fan 5.

After cooling the electronic circuit package 2, the warm air is sucked in by the fan 6, passes through the exhaust duct 8, and is discharged from the housing 9 through the exhaust hole 11 of the housing 9.

Therefore, according to this structure, noise can be reduced by attenuating noise as it passes through the duct, and by reducing the cross-sectional area of the duct where sound escapes to the outside of the housing compared to conventional devices.

Furthermore, noise can be further reduced by applying sound absorbing material to the inner walls of the intake duct 7 and the exhaust duct 8, and by bending the ducts at right angles.

In addition, when multiple units as shown in Figures 1 and 2 are mounted in a housing, there is a risk that the warm air that cooled the electronic circuit package will be re-inhaled into the fan's intake port if there is no intake duct or exhaust duct. However, by providing an intake duct and an exhaust duct as in this structure, it is possible to prevent hot air from being re-inhaled.

FIG. 3 is a perspective view showing another embodiment in which a line flow fan is mounted next to an electronic package.

Referring to FIG. 3, an air duct 20 is installed in a large number of electronic packages 2 mounted on a motherboard, a line flow fan 21 is attached to the side, and an intake/exhaust duct cover 24 is provided with a partition plate 24' to separate intake and exhaust air. is installed parallel to the surface of the air duct 20.

The space surrounded by the air duct 20, the intake/exhaust duct cover 24, and the duct end 25 constitutes an intake duct, and similarly, the space surrounded by the air duct 20, the intake/exhaust duct cover 24, and the duct end 25 constitutes an exhaust duct.

In this structure, as shown by the air flow indicated by the arrow in FIG. 3, air is taken in from below the device through an intake duct, is drawn into the line flow fan 21, and is discharged into the electronic package 2.

After cooling the electronic package 2, the hot air is exhausted to the top of the device through an exhaust duct.

In the other embodiment shown in FIG. 3 as well, similar to the embodiment shown in FIG. 1, the effects of reducing the noise of the device and preventing re-inhalation of exhaust gas can be obtained.

In addition, the intake duct and exhaust duct are integrated and simple, reducing costs.

As explained above, the present invention provides an intake duct and an exhaust duct,
By installing a fan within the duct, noise is reduced and there is an effect of preventing hot air from being re-inhaled.

[Brief explanation of the drawing]

FIG. 1 is a plan view of an embodiment using a propeller fan. FIG. 2 is a front view thereof, and FIG. 3 is another embodiment using a line flow fan. 1...Electronic components, 2...Electronic circuit package, 3...Motherboard, 4...
Connector, 5, 6...Fan, 7...
Intake duct, 8... Exhaust duct, 9...
・Housing, 10... Intake hole, 11... Exhaust hole, 20... Air duct, 21...
Line flow fan, 24'...Partition plate, 24
...Intake/exhaust duct cover 25...Duct end.

Claims (1)

[Scope of Claims] 1. A forced air cooling device for electronic equipment, comprising: an air intake port; a part to be cooled; an air intake duct in which an air introduction path from the air intake port to the part to be cooled is sealed; A cooling device for an electronic device, comprising: an exhaust duct in which an air introduction path from the part to be cooled to an air outlet is sealed, and a cooling fan is provided in at least one of the intake duct and the exhaust duct. .