JPS5851163A - Multi-nozzle plate for liquid jet and manufacture thereof - Google Patents

Abstract

PURPOSE:To economically manufacture a highly accurate multi-nozzle plate for liquid jet by a method in which plural V-grooves are formed on a single crystal plate by an anisotropic etching, two single crystal plates so treated are joined with each other by facing their V-grooves, and then they are sliced in the orthogonal direction to the V-grooves. CONSTITUTION:A single crystal substrate (e.g., Si semiconductor substrate) is subjected to an anitropic etching treatment for its (100) plane to form a substrate 10 with plural V-grooves, having both wall faces consisting of (111) planes. Then, two substrates thus obtained are joined with each other by facing their V-grooves, and then they are sliced in the orthogonal direction to the V-grooves to form a multi-nozzle plate 20 having a high accuracy.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multi-nozzle plate suitable for use in a liquid ejecting device such as a multi-nozzle inkjet recording device and a method for manufacturing the same. By using directional etching, two substrates with V-grooves formed in this way are bonded with the grooves facing each other, thereby producing a multi-nozzle plate that can be arranged in high density with high productivity. , and can be provided at low cost.

As is well known, in a liquid ejecting device such as a multi-nozzle inkjet recording device, a multi-nozzle plate having a large number of inkjet ejection nozzle holes is used. , a multi-nozzle processing method using chemical etching.

(2), Multi-nozzle processing method using electroforming 1゜(3), Multi-nozzle processing method using micro drill.

etc. have been proposed. However, the method of drilling nozzle holes in a metal plate by chemical etching (1) can only process a metal plate with a thickness comparable to the nozzle diameter, and the mechanical strength of the nozzle plate is insufficient.

(2) The cross section of the nozzle becomes mortar-shaped as shown in FIG. 1, making it difficult to control the nozzle hole diameter.

There are drawbacks such as (2) electroforming processing method,
, the inner wall of the nozzle is loose.

(2) The formed nozzle play 1 still has some electrodeposition distortion as shown in FIG.

■The resulting nozzle play 1 is thin and lacks mechanical strength.

In addition, the microtrill processing method (3) has poor productivity because the nozzle holes are drilled one by one.

■, Microtrill consumption is eliminated, resulting in high cost.

There were other drawbacks.

The present invention has been made to eliminate the drawbacks of the prior art as described above, and will be described in detail below with reference to the drawings.

3 to 5 are process diagrams for explaining an example of the method for manufacturing the multi-nozzle plate 1 according to the present invention. Initially, as shown in FIG. A substrate 10 in which a V-groove is formed is prepared. As this substrate 10,
For example, semiconductors such as Sl and GaAs are used,
This is not necessarily limited to semiconductor materials;
A metal single crystal may also be used. In addition, the formation of the groove is (
By performing anisotropic etching from the (100) plane, a V-shaped groove with good dimensional accuracy, with both wall surfaces surrounded by (111) planes, can be obtained. Since the anisotropic etching technique is well known, a detailed explanation of the process will be omitted here, but as an anisotropic etchant, N
H2(CH2)2NH2, C6H4(O)'')2, H2
A mixed solution of O (APW etching solution) was also added to 0aA
s substrate is NI4. OH,,,,H2O2,H
It is preferable to use a mixture of 2O. Next, the substrate 10 on which the V-shaped grooves have been formed as described above is bonded with the V-grooves facing each other, as shown in FIG. Various bonding methods can be considered, such as a method using an epoxy adhesive or an electrostatic bonding method, but in any case, care must be taken not to crush the groove that is to become the nozzle hole. Next, the substrates bonded as described above are sliced in a direction perpendicular to the V-groove as shown in FIG. 5 to complete the multi-nozzle plate 20. FIG. 6 is an enlarged front view of the multi-nozzle plate 1 manufactured as described above, and the shape of the nozzle hole is such that the angle θ between the (100) plane and the (111) plane is 54 mm. A diamond shape is formed by opposing the V grooves defined by t.

As is clear from the above description, according to the present invention, a multi-nozzle plate 1 that can be arranged in high density and has excellent dimensional accuracy and jet direction accuracy can be provided at a low cost.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of nozzle holes formed in a metal plate by etching, FIG. 2 is a sectional view of electroforming, and FIGS. 3 to 5 are manufacturing steps of a multi-nozzle plate according to the present invention. FIG. 6 is an enlarged front view of the multi-nozzle play 1 according to the present invention. 10... Substrate in which a V groove is formed, 20... Multi-nozzle play-1.

Claims (2)

[Claims] (1) A multi-nozzle plate for a liquid ejecting device, characterized in that two substrates each having a plurality of square grooves are joined with the V grooves facing each other. (2) Form a plurality of grooves on the substrate using anisotropic etching, then bond the substrate with the grooves facing each other, and place the bonded substrate against the V-groove. A method for manufacturing a multi-nozzle plate for a liquid injection device, characterized in that the plate is sliced in a right angle direction.