JPS5851162A - Preparation of multinozzle plate for liquid jet device - Google Patents
Preparation of multinozzle plate for liquid jet deviceInfo
- Publication number
- JPS5851162A JPS5851162A JP14982881A JP14982881A JPS5851162A JP S5851162 A JPS5851162 A JP S5851162A JP 14982881 A JP14982881 A JP 14982881A JP 14982881 A JP14982881 A JP 14982881A JP S5851162 A JPS5851162 A JP S5851162A
- Authority
- JP
- Japan
- Prior art keywords
- grooves
- substrate
- base plate
- nozzle
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000005530 etching Methods 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 239000002131 composite material Substances 0.000 abstract 1
- 239000013078 crystal Substances 0.000 abstract 1
- 238000003672 processing method Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 3
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000005323 electroforming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 239000005297 pyrex Substances 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000007499 fusion processing Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、マルチノズルインクジェット記録装置等の液
体噴射装置において使用するのに好適なマルチノズルプ
レー１・及びその製造方法に係り、特に、一方の面に沙
数本の溝が平行に形成された基板と、別の平担な基板と
を用い、両基板を前記溝を内側にして接合した後、この
接合された基板を前記溝方向に対して直角方向にスライ
スしてマルチノズルプレートを製造するようにし、もっ
て、高密度配列可能なマルチノズルプレートを生産性よ
く、かつ、安価ｌζ提供できるようにしたものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a multi-nozzle play 1 suitable for use in a liquid ejecting device such as a multi-nozzle inkjet recording device, and a method for manufacturing the same. A substrate on which parallel grooves are formed and another flat substrate are bonded together with the grooves inside, and then the bonded substrates are sliced in a direction perpendicular to the direction of the grooves. In this way, a multi-nozzle plate can be manufactured with high productivity, and a multi-nozzle plate that can be arranged at high density can be provided at low cost.
マルチノズルインクジェット記録装置等の液体噴射装置
においては、周知のように、多数個のインクジェット噴
射ノズル孔を有するマルチノズルプレートが使用される
が、このマルチノズルプレートの製造方法として、従来
より、
（１）、化学エツチング゛によるマルチノズル加工法。As is well known, in a liquid ejecting device such as a multi-nozzle inkjet recording device, a multi-nozzle plate having a large number of inkjet ejection nozzle holes is used. ), multi-nozzle processing method using chemical etching.
（２） 、エレク１゛ロフオーミンクによるマルチノズ
ル加工法。(2) Multi-nozzle machining method using Elec 1-Rofomink.
（３）、マイクロドリルによるマルチノズル加工法。(3) Multi-nozzle processing method using micro drill.
等が提案されている。しかし、
（１）の化学エツチングによって金属板にノズル孔をあ
ける方法は、
■、ノズル径と同程度の厚さの金属板にしか加工できす
、ノズルプレー１・の機械的強度が不足すする。etc. have been proposed. However, the method (1) of making nozzle holes in a metal plate by chemical etching can only process a metal plate with a thickness comparable to the nozzle diameter, and the mechanical strength of the nozzle plate 1 is insufficient. .
■、ノズル断面が第１図に示すように摺鉢状になり、ノ
ズル孔径のコントロールが難かしい。(2) The cross section of the nozzle becomes mortar-shaped as shown in FIG. 1, making it difficult to control the nozzle hole diameter.
等の欠点があり、
（２）のエレクトロフォーミングによる加工方法は、■
、ノズル内壁かざらざらしている。There are disadvantages such as (2) electroforming processing method,
The inner wall of the nozzle is rough.
■、できたノズルプレートに、第２図に示すように電着
歪が残っている。(2) The resulting nozzle plate still has some electrodeposition distortion, as shown in Figure 2.
■、できたノズルプレートは薄状で、機械的強度がない
。■The resulting nozzle plate is thin and lacks mechanical strength.
等の欠点があり、また、
（３）のマイクロドリルによる加工方法は、■、ノズル
孔を１個ずつあけていくため、生産性が悪い。In addition, the processing method using a microdrill (3) has the following drawbacks: (1) Productivity is poor because the nozzle holes are drilled one by one.
■、マイクロドリルの消耗が激しく、コスト高になる。■The micro drill wears out rapidly, resulting in high costs.
等の欠点があった。There were other drawbacks.
本発明は、上述のごとき従来技術の欠点を解消するため
になされたもので、以下、図面を参照しながら詳細に説
５明する。The present invention has been made to eliminate the drawbacks of the prior art as described above, and will be described in detail below with reference to the drawings.
第２図乃至第５図は、本発明によるマルチノズルプレー
ト製造方法の一実施例を説明するための工程図で、最初
に、第３図に示すように、一方の面に複数本の溝が平行
に形成された基板１０と、別の平担な基板２０を準備す
るが、溝を形成する基板として、Ｓｉ、 ＧａＡｓ
等の半導体基板を用いれば、半導体プロセスで利用され
る異方性エツチングの技術を用いて多数個の溝を容易に
得ることができる。なお、異方性エツチングの技術は周
知であるので、ここでは詳しい工程は省略するが、異方
性エッチャントとしては、Ｓ］ 基板に対してはＮＨ２
（ＣＨ２）２ＮＨ２、Ｃ６Ｈ１（ＯＢ）２、Ｈ２Ｃの混
液（ＡＰＷエツチンク液）を、また、ＧａＡｓ 基板
に対してはＮＨ４ＯＨ’、 Ｈ２Ｏ２、Ｈ２Ｃの混液を
用いればよい。また、平担な基板２０としては、溝基板
１０ 古熱膨張系数が等しいものが好ましく、溝基板１
０として半導体基板を用いた場合、パイレックスガラス
（コーニング社）のようなものが望ましい。2 to 5 are process diagrams for explaining one embodiment of the multi-nozzle plate manufacturing method according to the present invention. First, as shown in FIG. 3, a plurality of grooves are formed on one surface. A substrate 10 formed in parallel and another flat substrate 20 are prepared, and Si, GaAs are used as the substrates on which the grooves are formed.
By using a semiconductor substrate such as the above, a large number of grooves can be easily obtained using anisotropic etching techniques used in semiconductor processes. Since the anisotropic etching technique is well known, the detailed process will be omitted here, but the anisotropic etchant is S] NH2 for the substrate.
A mixed solution (APW etching solution) of (CH2)2NH2, C6H1(OB)2, and H2C may be used, and for a GaAs substrate, a mixed solution of NH4OH', H2O2, and H2C may be used. Further, as the flat substrate 20, it is preferable that the groove substrate 10 has the same paleothermal expansion coefficient, and the groove substrate 1
When a semiconductor substrate is used as the substrate, a material such as Pyrex glass (Corning Corporation) is preferable.
上述のごとくして準備された基板損と２０は第４図番こ
示すように溝を内側にして接合される。接合方法として
は、エポキシ系の接着剤を利用したり、カラスの融着、
静電接合等が考えられるが、いずれにせよ、最後にノス
ル孔となるべき溝をつぶさないようにする注意する必要
がある。接合が終了した基板３０は、第４図に示すよう
に、１枚１枚ノズルプレート４０としてスライスされて
完成される。The substrate 20 prepared as described above is bonded with the groove facing inside as shown in Figure 4. Bonding methods include using epoxy adhesive, glass fusing,
Electrostatic bonding or the like may be considered, but in any case, care must be taken not to crush the groove that is to become the nostle hole. The bonded substrate 30 is sliced one by one into nozzle plates 40, as shown in FIG. 4, to complete the process.
以上に、本発明の一実施について説明したが、本発明は
、上記実施例に限定されるものではなく、例えば、基板
材料として、Ｓ］、ＧａＡ３、パイレックスガラス等を
挙げたが、何もこれらに限定されるものではなく、また
、溝加工法も異方性エツチングに限定されるものではな
く、他のエツチング方法或いは機械的な切削加工でもよ
く、更に、溝形状も図示のＶ字形の溝に限定されるもの
でないことは容易に理解できよう（ただし、■溝加工方
法として、半導体基板の異方性エツチングを利用すると
、ノズル径精度、噴射方向精度に優れたノズルプレート
を得ることができる）。Although one embodiment of the present invention has been described above, the present invention is not limited to the above-mentioned embodiments. For example, S], GaA3, Pyrex glass, etc. have been mentioned as the substrate material. Furthermore, the groove processing method is not limited to anisotropic etching, but may be other etching methods or mechanical cutting.Furthermore, the groove shape may be the V-shaped groove shown in the figure. It is easy to understand that the method is not limited to (however, by using anisotropic etching of the semiconductor substrate as the groove processing method, it is possible to obtain a nozzle plate with excellent nozzle diameter accuracy and jet direction accuracy. ).
以上の説明から明らかなように、本発明によると、高密
度配列可能なノズルプレー１・を安価に提供することが
できる。As is clear from the above description, according to the present invention, a nozzle plate 1 that can be arranged in high density can be provided at low cost.
第１図は、金属板にエツチングによってノズル孔を形成
した場合の断面図、第２図は、エレクトロフォーミング
によってノズル孔を形成した場合の断面図、第３図乃至
第５図は、本発明によるノズルプレート製造方法の各工
程を示す斜視図である。
１０・・・溝基板、２０・・・子基板、３０・・・接合
基板、４０・・ノズルプレー１・。FIG. 1 is a cross-sectional view of the nozzle hole formed in a metal plate by etching, FIG. 2 is a cross-sectional view of the nozzle hole formed by electroforming, and FIGS. It is a perspective view showing each process of a nozzle plate manufacturing method. DESCRIPTION OF SYMBOLS 10... Groove board, 20... Child board, 30... Bonding board, 40... Nozzle play 1.
Claims (2)
基板き、別の平担な基板とを鳴し、両基板が前記溝を内
側にして接合されていることを特徴とする液体噴射装置
のマルチノズルプレート。(1) A substrate having a plurality of grooves formed in parallel on one surface is joined to another flat substrate, and both substrates are bonded with the grooves inside. Multi-nozzle plate for liquid injection equipment.
と、別の平担な基板とを準備し、両基板を前記溝を内側
にして接合し、次いで、この接合された基板を前記溝に
対して直角方向にスライスしてマルチノズルプレートを
製造するようにしたことを特徴とする液体噴射装置のマ
ルチノスルプレート製造方法。(2) Prepare a substrate with multiple grooves formed in parallel on one surface and another flat substrate, and bond both substrates with the grooves inside, and then A method for manufacturing a multi-nozzle plate for a liquid ejecting device, characterized in that the multi-nozzle plate is manufactured by slicing a substrate in a direction perpendicular to the groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14982881A JPS5851162A (en) | 1981-09-21 | 1981-09-21 | Preparation of multinozzle plate for liquid jet device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14982881A JPS5851162A (en) | 1981-09-21 | 1981-09-21 | Preparation of multinozzle plate for liquid jet device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5851162A true JPS5851162A (en) | 1983-03-25 |
Family
ID=15483562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14982881A Pending JPS5851162A (en) | 1981-09-21 | 1981-09-21 | Preparation of multinozzle plate for liquid jet device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5851162A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5347713A (en) * | 1991-10-22 | 1994-09-20 | Canon Kabushiki Kaisha | Method for manufacturing ink jet head |
| US8402654B2 (en) * | 2006-12-28 | 2013-03-26 | Brother Kogyo Kabushiki Kaisha | Method for cutting off nozzle plate and method for manufacturing nozzle plate |
-
1981
- 1981-09-21 JP JP14982881A patent/JPS5851162A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5347713A (en) * | 1991-10-22 | 1994-09-20 | Canon Kabushiki Kaisha | Method for manufacturing ink jet head |
| US8402654B2 (en) * | 2006-12-28 | 2013-03-26 | Brother Kogyo Kabushiki Kaisha | Method for cutting off nozzle plate and method for manufacturing nozzle plate |
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