JPS5850576A - Display - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a nice play device using a light emitting diode (IJD), and particularly to a display device having a structure in which several LEDs are mounted.

In a display device that displays numbers or figures by arranging a large number of LEDs in a matrix and sending selective electrical signals to the LEDs, it is safe to devise a connection method and structure between the LEDs and the wiring body. The most common conventional connection method is to connect the cathode wiring body and anode wiring body with
For all 1g pass boards, first place an IJD pellet on the cathode shaft with conductive paste! 1m, then I, E
Electrical contact and anode on D-bellet! ! 11↓This is a method of connecting the 11. But miserably using a large number of IJDs? This is a cross-sectional view of a display device that has a more convenient connection method and an 11-rate structure. In FIG. 1, 1 is an insulating substrate, 3 is a cathode wiring body formed on the substrate, and 4 is an insulating substrate.
On the cathode wiring body 1 - LED pellets fixed with conductive paste 5, each LED pellet with insulating material
The anode wiring body 7 was buried so that the t-plane of B'a 6 was flat, and the anode wiring body 7 was formed on the surface.

In this case, the border side fat 6 is formed using thermoplastic resin (for example, polyfluoroethylene propylene),
A common method is to apply pressure so that the resin tajfki becomes half 114 mm from the surface. However, in the display device with this structure, the treetop 31m above the Ll pellet
The step of providing a hole 8 for electrically connecting the +-LED 3° 4 and the anode wiring 7 is required, and this hole B s
The upper layer anode 61 wire body 7
One shaft with 0-stage cut-off was a major obstacle in the manufacturing process.In the manufacturing method of the display device, which was applied for in the FC special consideration No. 127181/1981, such problems ≦Niz. To briefly describe this method, first, the upper surface of the LED pellets attached to the substrate is covered with a sheet.

Next, resin 11, such as epoxy, is filled into the gap between the substrate and the sheet and hardened. Furthermore, the sheet is peeled off and a wiring body is applied to connect the electrodes on the surface 42 of the IJD bellet. By applying this method, not only was the anode wiring body formed on the surface less likely to be cut, but also one plug could be shortened to a large f@. However, in recent years, a substrate has appeared on which a large display device K can be assembled by horizontally connecting units each having a certain number of th hydrogen atoms.

Figure 2 shows the patent application filed in 1989-789 using this unit.
In the display gray device No. 38 [1 = This indicates a method that does not use the described wire bonding, the input/output provided on the back surface of the board 1 is Terminal 2 becomes a fault, and these phase C
2.The jigs and equipment used were also shoddy, leading to redness and redness. Historically, when this substrate was used, short-circuit defects 9 often occurred at the end of the upper anode wiring body 7 because it was difficult to uniformly process the entire periphery of the substrate in the photo-etching process.

Akira Honji's purpose was to solve the above-mentioned conventional intertone point, and by devising the structure of the display device, the manufacturing process could be greatly simplified. The present invention provides a display device in which defects in the wiring body can be eliminated even in the case where a unit-based board provided with terminals is used.

That is, insulating resin and the second powder were applied to the spacing between the LED pellets arranged on the first wiring body at predetermined intervals, and the surface was the same as that of the LED pellets. (bifurcated &-11 and second wiring body and IJD)
The conventional problem was solved by constructing the pellet with an M3 wiring body connecting the pole on the upper surface of the pellet.

Embodiments of the present invention will be described in detail below with reference to FIGS. 3 to 9.

The third example is Kenmei's basic structure, which is a sub-substantive examination diagram, and Figures 4 (a) to (e) are process diagrams showing an example of the two steps taken to obtain the structure. .

First, as shown in FIG. 4(a), gold paste is printed on an alumina ceramic substrate 10 and fired at 500 to 900°C to a thickness of approximately 10 μm and a width of approximately 400 μm.
(D @ form several first wiring bodies 20 ・Next, in this first part, approximately 4
Form a conductive paste such as silver paste 40 with a diameter of 00 μm and a diameter of 50 μm, and place LED pellets 30 of 300 μm each vertically, laminated, and in a pan on top of it, rubbing it lightly (after placing it twice and then approx. By performing heat treatment at 150° C. for 2 hours, it is fixed on the wiring body 20 of @1 of the substrate 10. Next, as shown in FIG.
1 on the sheet support 51 made of polyimide resin of μm.
Silicone thread adhesive 52 with a thickness of approximately 20 μm
The second wiring body 60 is formed by applying copper foil to the sticky layer sheet 50 formed by integrating the above, and then forming the copper foil into a stamp by photo-etching. N is provided. The thickness of the copper plate of this second arrangement 6 body determines the thickness, for example, 30 μm, and the shape of the button is set so that it corresponds to the part without the LED pellet 30 placed on the substrate 10. 1 Make it with a width of 100 to 5002 m 1, then this sticky shield) 50 Yasushi & 10 LE
Contact the D pellet 30 at position b1, and apply the adhesive 52 to L.
It is adhered to and attached to the surface of the ED pellet 30. Then the fourth
As shown in Figure (c), the base 1 is integrated with the sticky sheet 50.
Turn it upside down and place an insulating resin in the gap between the drying sheet 50 and the substrate 10. For example, apply epoxy 70 and fill it up from hair #I: + armpit d2. After filling with epoxy 70, heat at 120°C for 5 hours, and heat at 150°C for 10 hours.
This epoxy 70 is made similar to epoxy 70 by performing heat treatment for 0 hours. As shown in Figure 4 (d) of this tack, attach the adhesive sheet 50 to P;
Once completed, the PL mark of the embossed box 70, which is unified by the height of the LED bezel 30, and the second wiring body 60 embedded in this embossed 70 are formed. Next, as shown in FIG. 4 (θ), the upper surface electrode (
(not shown) and fI! In order to continue, the third wiring body 8 is coated with a conductive paste such as silver paste using a screen printing method.
form 0. After this, by performing heat treatment at approximately 150° C. for 2 hours, a display gray device as shown in FIG. 3 can be completed.

5(a)+(b) and FIG. 6 show other embodiments of the structure of the present invention. In FIG. 5(a), for example, a lead frame having a thickness of approximately 100 μm and plated with KOV 11 gold is adhered to an adhesive sheet 53 and cut off at A-A' and B-B' indicated by broken lines. 1 C1 New adhesive sheet 50 as shown in Figure 5 (b) of the second basket
Then, a button of the second wiring body 61 is formed. The process of making this shell is carried out in the steps shown in FIGS. 4(a) to (θ). Also, as shown in FIG. Nice play equipment can be completed by applying the process.

FIGS. 7, 8, and 9 show modified configurations of the present invention. First, in Fig. 7, the second wiring body 63
a and 63b are arranged to sandwich the IJD pellet 30, and a third wiring body 80 connects the 'I4L pole of the LED pellet 30 and the second wiring bodies 63a and 63b. Therefore, the second wiring body 63a.

The shape of 63b is similar to the arrangement of the LED pellets 30, and a simplified button arrangement can be made.

On the other hand, the display device iI! If the wood density is to be reduced, the wiring width of this second wiring body is made narrower.''
It is conceivable to increase the thickness of this second wiring body to lower the resistance value in case the board is to be increased in size or the board becomes even larger. FIG. 8 shows a structure devised under these conditions, in which a lead frame with a thickness of 250 μm was used for the second wiring body 64. However, the first wiring body 20 with a thickness of about 10 μm on the substrate 10 and the LED pellet 30 with a thickness of about 300 μm are fixed.
#Since the silver paste 40 to be held protrudes and swells by a height of 5 to 200 μm, the second wiring body 64 comes into contact with the Ml wiring body. Therefore, if a concave portion corresponding to the bulge vm of the sword paste is provided in the 2<7) km body 64 of this lead frame, contact defects can be prevented and the resistance value can be reduced. The result is a display device with a less than clear image.

#+49 Figure For example, red Ll! is attached to the first wiring body 20 on the Fi base 10! ID pellet 31 and green Ll! ! D Beret 32
This is an example of a 4J construction in which the present invention is applied in a case where 11 cables are constructed by arranging 2 pairs of electrically separated second wiring bodies. 65 and 66 and LED
A second wiring body 65ij made of a lead frame, for example, is made by connecting pellets 31 and 32, and is composed of a resin 70 surface of 1 m, a convex part that comes out, and a concave part that is inserted into the resin 70 with braze. Therefore, the third wiring body 82 from the L[) pellet 32 can be connected to the convex part of the second wiring body 66 by straddling the four parts of the second wiring body 650, so that the complication 17 is avoided. By applying the structure of the present invention as described above, it becomes possible to greatly shorten the manufacturing process of display devices, leading to a reduction in price. . Furthermore, the narrow axis properties and display clarity of the display device are also improved. The reason for this is that the processing of the second wiring body is done in the assembly process on the board and only needs to be assembled at the final stage, which improves the manufacturing process. The second wiring body can be easily formed using screen printing, mask vapor deposition, etc., without using the photolithography process that was previously required.Also, the thickness and shape of the second wiring body can be devised. This has the effect of improving the sharpness of pixels, such as aftr+=.

[Brief explanation of the drawing]

FIGS. 1 and 2 are sectional views and partial perspective views illustrating the structure and problems of a conventional display device. Figure 3 shows a partial body shell showing the basic structure of the present invention.1. Figures 4 and 5 a) to (e) are process cross-sectional views of one embodiment of manufacturing the process shown in Figure 3, Figures 5 and 6 are views showing variations of the manufacturing process in Figure 4, and Figure 7 9 are partial perspective views showing other embodiments of the present invention. io ---------- Sand, 20 ------- First wiring body, 30.31.32 ---- LED pellet, 40 ----
------- Quadriconductive paste, 50, 51.52--Ikkeishoku sheet, 60, 61.62.63a, 63b, 64.65.
66 = second wiring body, 70
- Onmei insulating resin, wiring body of 80.81.82-1-^3. Agent Patent Attorney Rule Yusuke Dot and 1 other person, 1 Figure 2 Figure 3 Figure 4 Figure 5 Figure 6 Figure 3? Figure 7 Figure 8 Figure 3D Buddha Figure 9

Claims (1)

[Claims] On the first wiring body on the board - two arrays of ridged LEs
The space between the D pellet and the IIEE LED pellet and its surroundings is filled with an insulating material Ii4 filled with a sieve equivalent to the surface of the IJD pellet, and at least a portion of the surface of the IJD pellet is filled with a sieve having a sieve size equivalent to that of the IJD pellet. is the same height as the surface of the LED pellet. 3. A display device comprising the wiring body of No. 3.