JPS584936A - Semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To provide a warpage free substrate by a method wherein a very flat glass substrate is provided with a predetermined number of holes, a fine glass fiber containing adhesive agent is applied thereto following a desired pattern, an Si substrate is vacuum adsorbed thereto with the help of the holes, and an active matrix substrate is mounted on the Si substrate after the setting of the adhesive agent. CONSTITUTION:A flat glass substrate 501 substantially thicker than an Si substrate 504 is provided with holes 503 and the surface of the substrate 501 is prescribedly coated after a prescribed pattern with adhesive 502 except the place where the holes are located. The adhesive 502 can be of either organic or inorganic substance and contains fine glass fiber with its diameter from several ten to several hundred micrometers. The holes are used to adsorb the substrate 504 whose surface is then irradiated by ultraviolet rays or heat rays for the setting of the adhesive 502. This results in a warpage free substrate whereupon an active matrix substrate is mounted securely upon the location of adhesive application.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to the mounting of semiconductor integrated circuits on extremely flat substrates. WK relates to a method for planarizing the semiconductor integrated circuit and a structure of the substrate.

It is a large-capacity liquid crystal display designed with an active matrix base 11HLVc engineered by forming MO13 switching transistors and charge retention capacitors on the silicon base and surface, and the active matrix substrate and the upper electrode are made of glass. In order to form a liquid crystal layer between the plate and the plate, it is necessary to maintain a uniform gap of several micrometers.

FIG. 1 shows a cross-sectional WJ diagram of an assembling process for injecting liquid crystal onto a conventional active matrix substrate.

In the figure, 101 is an active matrices substrate and ToO110
2 is a glass plate, 103 is a sealing material and a spacer for controlling the gap between the active matrix substrate and the glass plate, and 104 is a liquid crystal layer having a uniformly machined gear tube in the sealing material. , liquid crystal is injected into the liquid crystal layer from the liquid crystal injection hole 105. Currently, the gap in the liquid crystal layer is extremely thin at #18 to 10 micrometers.
The importance of the display performance of the g-crystal display! This is a significant factor.

In order to maintain the gap uniformly within the liquid crystal display area, it is first necessary that the upper glass plate be flat, and secondly that the active matrix substrate be flat.

*Assignment 1's problem is like a flat glass plate! This problem can be easily solved because there is one on the market that fully satisfies the standard of not more than a few micrometers of unevenness on one surface.

Regarding the second problem, it is ideal that the surface of the silicon substrate is completely flat, but when actually manufacturing the #1 substrate,
Ai may be transformed between process and 0, and 1! @
A silicon substrate delivered to
As a result of measuring the sheet, it was found that it had the same warpage as shown in Figure 2. Figure @2 shows a typical warping pattern, with the field convex upwards.

m is downwardly convex, a and rFI have both the above-mentioned mountain and (g) warp return 1 shape, and warp return p amount S
The variation was large, ranging from a few micrometers to several tens of micrometers, and the warpage at the %50 position was more than 10 micrometers. 41 having a one-sided shape (saddle II) in which the concave and sum directions are orthogonal
11I was established. Next, for example, when a silicon substrate is thermally oxidized at a heat temperature, a Krl film (8 (Osl[)) is formed on the surface of the silicon substrate.

Place the silicon substrate in chamber I! If the oxide film on the back side is removed, the silicon substrate will shrink as shown in Figure 3. Since the curved soot has a coefficient of thermal expansion about an order of magnitude larger than that of the silicon substrate 301tj oxide film 302, the direction of the curve is the sum of the oxide film and the convexity. tt
As an example of &tllL2, Fs, Fi in the process,
Due to the deformation of the oxide film and the diffusion of impurities, a! ; Warm heat sensation II is repeated p and h. At this time, if one scissor substrate is not heated and cooled while maintaining a uniform temperature gK, the group [
[Thermal stress increases. If this stress is large enough, it will cause a hazy deformation of the silicon substrate #'i, and after the process is finished, K
.

0 or more L observed as substrate warpage The cause of warpage fluorination in the sea urchin process ij, roughly K is the thermal expansion coefficient between the silicon substrate and other materials shaped on the skeleton substrate Based on the difference between the two types of deformation and deformation caused by thermal stress, the active matrix substrate Kll has undergone all processes and is completely cured.

A sudden warping occurs, which causes a decrease in yield in the assembly process. It is difficult to suppress the warping of the bar to a few micrometers, and the variation in the gap causes a decrease in the p2 display performance.

The present invention eliminates such drawbacks, and therefore its purpose is to improve the reliability of active matrix substrates.

This is achieved by providing a method for zero correction by making an extremely flat board into a pack play h, and a structure of a skeleton board.

11! A brief explanation of the 0 drawing that explains in detail the example of the envy that is applied to 4 Shame, S Figure and Proverb 6 Figure is as follows, 401
．． 501. @OX is a flat glass substrate with silicon base 1fi#! It is sufficiently thick compared to c.

402.502,603! is inorganic! fi is a mixture of organic adhesive and glass fiber having a uniform diameter, for example, tens of micrometers to hundreds of talons (not necessarily limited to η); The material is cured by irradiation with ultraviolet rays or heat rays or other conditions. 403.503.6031j A hole in the glass substrate. 504 and 604 are active matrix substrates.

605 is resin. # Flat glass substrate surface tit
The adhesive material 402 is printed on the surface of the skeleton glass substrate, as shown in iris 4g1, which has an ideal flat surface (the unevenness is within a few metric meters).The printing pattern of the adhesive material is Close it, but the other patterns have at least 41 holes open, so you have to close them.
The IN4 diagram is an example. The hole is inside the Mukuro printing butter y@
and at least one or more A*j15a#15
The active matrix substrate 504 is placed on top of the 1wc adhesive material, which is the cross section of Figure g4. Then, when a vacuum pot is connected to the hole and the active matrix substrate is vacuum-sealed, the shell substrate is attached to -wKrIk using the glass fiber in the adhesive as a stopper at atmospheric pressure.

Moreover, the adhesive has the above-mentioned properties and cures under a wide range of conditions regardless of the adhesive used. After the adhesive is cured, the process shown in Section 6 is performed with an active matrix substrate.

Fill the space between the flat board and the board by injecting resin through the hole.

With this Wj4, the active matrix AI-board is.

The grasshopper plate is flattened to the ideal planar shape of the glass substrate surface through the glass fiber, and then resin is injected to completely fix it, so that the attape matrix substrate is completely fixed at the end of the process*. Even if the curve is caused by deformation, the plane can be corrected. It's hazy 8-1
It is clear that it is possible to maintain a uniform gap of 0 i chrome meters and to significantly improve the display performance.

In this example, glass 'iI was used as a flat substrate.
&e was applied, but it is not @ゐ, and it is fine if it is a flat substrate that is equal to or even more flat than the glass substrate.

It is a sectional view of the simple *i52#l 111th active mask V-customer board assembly process on the aa plane.

8267A has a large shape as measured by the delivered silicon substrate W# and a large warpage P.

It has a curved shape.

FIG. 4 is an overview of Takaaki Moto's embodiment.

Figures 5 and 6 are cross-sectional views of the embodiment of this bag.

that's all 1 person: Suwa Seikosha Co., Ltd. Agent Patent Attorney Mogami Figure 1 Second eye Figure 3 Figure 4

Claims (1)

[Claims] (1) At least one hole was made on an extremely flat substrate, an adhesive material mixed with glass fiber was printed on the surface of the substrate in an appropriate pattern, and a semiconductor integrated circuit was placed on the pattern. After that, vacuum suction is performed through the hole, and the adhesive is cured and released. 1z Semiconductor collection #lrgl space between the path and the flat board. The semiconductor integrated circuit according to item 1 of the scope of claim 1, characterized in that resin is injected and filled through the hole.