JPS5849029B2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor substrate and an external electrode or a heat sink (hereinafter simply referred to as an "external electrode").

This invention relates to a semiconductor device having a conductive plate between the conductive plate and the conductive plate and preventing the conductive plate from being disengaged from a positioning member for positioning the conductive plate and an external electrode.

FIG. 1 is a longitudinal sectional view of a conventional flat thyristor having a conductive plate between a semiconductor substrate and an external electrode.

In FIG. 1, 1 is an external anode electrode, 2 is a semiconductor substrate,
3 is a thin conductive plate made of molybdenum or the like and disposed between the semiconductor substrate 1 and an external electrode to be described later; 3a is an opening for the conductive plate 3; 4 is an insulating tube; 5 is a coil spring;
is an external cathode electrode, 6a is a concave portion of the external cathode electrode 6, 7 is a mica plate, 8 is a gate lead support, and 9 is a gate lead.

In this case, the positioning of the external cathode electrode 6 and the conductive plate 3 is as follows:
An external salt electrode 6 is connected by a coil spring 5 and a mica plate 7.
The gate lead support 8 is supported from the bottom surface of the recess 6a.
However, since the thickness of the conductive plate 3 is insufficient compared to the vertical movable distance of the conductive plate 3, the conductive plate 3 is moved between the top surface of the external cathode electrode 6 and the gate lead support 8. In some cases, the particles cross over the gap between the gate leads 9 and the semiconductor substrate 2 and enter between the gate lead support 8 and the semiconductor substrate 2, resulting in incomplete contact between the gate leads 9 and the semiconductor substrate 2.

This invention uses a cylindrical elastic body as a positioning member, which is inserted into a recess of an external electrode and whose outer wall is pressed by elastic force to the inner wall of an aperture in a conductive plate. It is an object of the present invention to provide a semiconductor device which eliminates the conventional drawbacks by preventing relative positional deviation between the conductive plate and the external electrode.

The present invention will be explained below with reference to Examples.

FIG. 2 is a longitudinal sectional view of an embodiment in which the present invention is applied to a flat thyristor.

In FIG. 2, 10 is an external anode electrode, 11 is a semiconductor substrate, 12 is a thin conductive plate, 1 and 2a are openings in the conductive plate 12, 13 is an insulating tube, 14 is a cylindrical elastic body, and 15 is a coil spring. , 16 is an external cathode electrode, 16a is a recess of the external cathode electrode 16, 17 is a mica plate, 18 is a gate lead support, and 19 is a gate lead.

When assembling the above flat thyristor, first place the gate lead 19 on the gate lead support 18,
Furthermore, the insulating tube 13 is placed over the gate lead 19.

Next, the cylindrical elastic body 14 is placed in the recess 16a of the external cathode electrode 16.
(An example of the shape is shown in Fig. 4 atb.

), and further coil spring 15, mica plate 17,
Then, the gate lead 19, gate lead support 18, and insulating tube 13, which have been assembled previously, are attached.

Next, the conductive plate 12 is fitted into the cylindrical elastic body 14.

Thereafter, the semiconductor substrate 11 and the external anode electrode 10 are attached and then sealed.

In the semiconductor device manufactured in this manner, the conductive plate 12 and the cylindrical elastic body 14 are tightly integrated by the elastic force of the cylindrical elastic body 14, which tends to expand.
Since the connection between the conductive plate 12 and the cylindrical elastic body 14 does not come off, the conductive plate 12 is connected to the gate lead support 18 and the semiconductor substrate 11.
The contact between the IJ-dead 19 and the semiconductor substrate 11 will not be incomplete.

That is, it is possible to eliminate relative displacement in the lateral direction between the external cathode electrode 16 and the conductive plate 12.

The present invention can be applied not only to the above-mentioned flat thyristors, but also to flat and stator-shaped diodes and thyristors in general.

In the case of a diode, conventionally a coil spring, a mica plate, a gate lead support body, etc., as shown in FIG. 1, were required to position the conductive plate and the external electrode, but according to the present invention,
These parts are not necessary.

All that is needed is a cylindrical elastic body that is integrated with the conductive plate, making it inexpensive and simple in structure.

Further, in the case of a thyristor, the present invention can be similarly applied to cases where the method for extracting the gate lead is not only the method of applying pressure to the gate lead but also the method of directly welding the gate lead to the semiconductor substrate.

FIG. 3 is a longitudinal sectional view of an embodiment in which the present invention is applied to a stud-type thyristor in which a gate IJ is welded to a semiconductor substrate.

In FIG. 3, 20 is a gate lead, 21 is an insulating tube, 22 is a cylindrical elastic body, 23 is a conductive plate, 24 is a semiconductor substrate, 25 is an external anode electrode, and 26 is an external anode electrode.

In this embodiment as well, the conductive plate 23 and the cylindrical elastic body 22 are tightly integrated by the elastic force of the cylindrical elastic body 220, and the conductive plate 22 and the external cloud electrode 26 can be positioned.

As described in detail above, in the semiconductor device according to the present invention, an external electrode (or heat sink) that faces the main surface of a semiconductor substrate and has a recess in the opposing portion is inserted into the recess, and the outer wall and the inner wall of the recess are connected. a positioning cylindrical elastic body having a gap therebetween and a protrusion from the external electrode (or heat radiator) facing the semiconductor; and the semiconductor substrate and the external electrode (or heat radiator) A conductive plate is provided between the conductive plates and has an opening through which the protrusion of the cylindrical elastic body is inserted, and the outer wall of the conductive plate is pressed against the inner wall of the opening by the elastic force of the cylindrical elastic body. Because of this, the connection between the cylindrical elastic body and the conductive plate is reliably maintained, and the positioning of the external electrode (or heat sink) and the conductive plate can be performed with a simple and inexpensive configuration. There is an effect that can be done.

[Brief explanation of the drawing]

Fig. 1 is a longitudinal cross-sectional view of a conventional flat thyristor, Fig. 2 is a longitudinal cross-sectional view of a flat thyristor which is an embodiment of the present invention, and Fig. 3 is a longitudinal cross-sectional view of a stud-type thyristor which is another embodiment of the present invention. The top view and FIGS. 4a and 4b are perspective views illustrating the shape of the elastic body. In the figure, 11.24 is a semiconductor substrate, 12 and 23 are conductive plates, 12a is an opening in the conductive plate 12, 14 and 22 are cylindrical elastic bodies, 16.26 is an external cathode electrode, and 16a is an external salt electrode. There are 16 recesses.

Claims (1)

[Claims] 1. A semiconductor substrate having at least one PN junction, an external electrode (or heat sink) that faces the main surface of the semiconductor substrate and has a recess in the opposing portion, and an external electrode (or heat sink) that is placed in the recess and between the outer wall and the inner wall of the recess. a positioning cylindrical elastic body having a gap and a protrusion from a surface of the external electrode (or heat sink) facing the semiconductor substrate, and between the semiconductor substrate and the external electrode (or heat sink); A semiconductor comprising: a conductive plate disposed in a conductive plate having an opening through which a protrusion of the cylindrical elastic body is inserted, and an outer wall of the conductive plate being crimped to an inner wall of the opening by the elastic force of the cylindrical elastic body; Device.