JPS5848957A - Semiconductor output circuit - Google Patents

Semiconductor output circuit

Info

Publication number
JPS5848957A
JPS5848957A JP57152728A JP15272882A JPS5848957A JP S5848957 A JPS5848957 A JP S5848957A JP 57152728 A JP57152728 A JP 57152728A JP 15272882 A JP15272882 A JP 15272882A JP S5848957 A JPS5848957 A JP S5848957A
Authority
JP
Japan
Prior art keywords
transistor
output terminal
circuit
output circuit
resistor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57152728A
Other languages
Japanese (ja)
Other versions
JPS6051273B2 (en
Inventor
Toshiaki Masuhara
増原 利明
Osamu Minato
湊 修
Toshio Sasaki
敏夫 佐々木
Yoshio Sakai
芳男 酒井
Kiyobumi Uchibori
内堀 清文
Norimasa Yasui
安井 徳政
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57152728A priority Critical patent/JPS6051273B2/en
Publication of JPS5848957A publication Critical patent/JPS5848957A/en
Publication of JPS6051273B2 publication Critical patent/JPS6051273B2/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/085Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only
    • H01L27/088Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate
    • H01L27/092Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind including field-effect components only the components being field-effect transistors with insulated gate complementary MIS field-effect transistors
    • H01L27/0921Means for preventing a bipolar, e.g. thyristor, action between the different transistor regions, e.g. Latchup prevention

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Bipolar Integrated Circuits (AREA)
  • Electronic Switches (AREA)
  • Logic Circuits (AREA)

Abstract

PURPOSE:To obtain the output circuit in which latch-up is difficult to be generated to an external surge by forming the semiconductor output circuit consisting of a CMOS.IC by an NPN bipolar transistor and an NMOS transistor shaped onto one semiconductor substrate. CONSTITUTION:The NPN bipolar transistor 60 and the NMOS transistor 61 are formed to one semiconductor substrate. The circuit is constituted in this manner, the collector 46 of the transistor 60 is connected to line voltage Vcc, an emitter is connected to an output terminal 62 through an Al layer 48, a polycrystal Si resistor 49 and an Al electrode 50, and the drain of the NMOS transistor 61 and a source through an Al electrode 56 are connected between the output terminal 62 and a ground Vss. Signals from an internal circuit 101 formed to the substrate are supplied to the base 47 of the transistor 60 and the gate 54 of the transistor 61, shaped and amplified, and outputted from the terminal 62.

Description

【発明の詳細な説明】 従来、第1図′に示したCMO8集積回路構造において
s p型ウェル21(18;ウェルバイアス用高濃度層
)を用いたnMO8)ランリスク(ドレイン15、ゲー
ト16、ソース17)に寄生するnpnバイポーラトラ
ンジスタ28と9MOsトランジスタ(ドレイン14、
ゲート13、ソース12)ζこ寄生するpnpトランジ
スタ1はpnpn型のサイリスクを構成する。このとき
、出力段を形成するnMO8MOSトランジスタ/イン
4、ゲート34、ソース5、ウェル19、ウェルバイア
ス用高濃度層6,3)およびバイポーラトランジスタ(
ベース20、エミッタ8、ベース取す出し高濃度層7,
9)の出力端子36に■サージが加えられたとき、寄生
ダイオード37、トランジスタ38を通してnpn)ラ
ンリスク28のベースが■にバイアスされs  pnp
nサイリスタがオン状態となった。このオン状態はラッ
チアップ状態と云われ、大きな電流が素子に流れるため
避けねばならない。才た、6サージを36に加えたとキ
、トランジスtり2を通じてトランジスタ1のベースが
負電圧にバイパスされ、同様ラッチアップ状態となる。
DETAILED DESCRIPTION OF THE INVENTION Conventionally, in the CMO8 integrated circuit structure shown in FIG. An npn bipolar transistor 28 parasitic to the source 17) and a 9MOS transistor (drain 14,
The parasitic pnp transistor 1 (gate 13, source 12) constitutes a pnpn type transistor. At this time, the nMO8MOS transistor/in 4, gate 34, source 5, well 19, well bias high concentration layer 6, 3) forming the output stage and the bipolar transistor (
Base 20, emitter 8, base extraction high concentration layer 7,
When a surge is applied to the output terminal 36 of 9), the base of the npn) run risk 28 is biased to s pnp through the parasitic diode 37 and transistor 38.
The n thyristor was turned on. This on state is called a latch-up state, and must be avoided because a large current flows through the element. When 6 surges are added to 36, the base of transistor 1 is bypassed to a negative voltage through transistor 2, resulting in a latch-up condition as well.

本発明は、従来、のCMO8集積回路の欠点を改善し、
外部サージに対してラッチアップを生じにくい出力回路
を提供するにある。
The present invention improves the drawbacks of the conventional CMO8 integrated circuit,
An object of the present invention is to provide an output circuit that is less likely to cause latch-up due to external surges.

以下、本発明の骨子を第2図により説明する。The gist of the present invention will be explained below with reference to FIG.

第2図において60のnpnバイポーラトランジスタは
、n型Si基板39中に形成したn+型層40.45に
A/を極46から5■を印加して動作し、そのエミッタ
n+型層43はAj層48を通して多結晶Si層49の
抵抗およびA/電極50を介しnMOsトランジスタ6
1のドレインn+型層52に接続される。52はまた出
力端子62とも接続される。またnpnバイポーラトラ
ンジスタのベースp型層42には、低抵抗p+型層41
.44より取り出されたA/電極47が内部回路101
に接続され、信号が供給される。また、nMOSトラン
ジスタのゲート電極54にも同様に内部回路101より
信号が供給せられる。
In FIG. 2, the npn bipolar transistor 60 is operated by applying 5 cm of A/ from the pole 46 to the n+ type layer 40.45 formed in the n type Si substrate 39, and the emitter n+ type layer 43 is Resistance of polycrystalline Si layer 49 through layer 48 and nMOS transistor 6 through A/electrode 50
1 drain is connected to the n+ type layer 52. 52 is also connected to an output terminal 62. Furthermore, the base p-type layer 42 of the npn bipolar transistor includes a low resistance p+ type layer 41.
.. A/electrode 47 taken out from 44 is internal circuit 101
The signal is supplied to the Further, a signal is similarly supplied from the internal circuit 101 to the gate electrode 54 of the nMOS transistor.

第2図において、52はnMO8)ランジスタロ1を形
成するp型ウェル、51..57はウェルバイアス用p
+型層、55はnMO8)ランリスタのソースn+型層
、56.58はA/’[極である。
In FIG. 2, 52 is a p-type well forming nMO8) transistor 1; 51. .. 57 is p for well bias
+ type layer, 55 is nMO8) source n+ type layer of run lister, 56.58 is A/'[pole.

第3図は、本実施例の回路を、従来の回路(第2図にお
いて抵抗49のない回路)と比較したものであるが、R
=0の場合、約100■のサージ電圧でラッチアップが
起こるのに対し、本発明の適用により300V以上と3
倍の高いサージ電圧まで許容できるようになった。
FIG. 3 compares the circuit of this embodiment with a conventional circuit (a circuit without the resistor 49 in FIG. 2).
= 0, latch-up occurs at a surge voltage of about 100V, but by applying the present invention, latch-up occurs at a surge voltage of about 300V or more.
It can now tolerate surge voltages that are twice as high.

なお、本実施例において抵抗体ζこは高いサージ電圧′
が加わるため、抵抗体を拡散層など基板内部つくること
は好適でなく、5i02表面上に形成することが望まし
い。たとえば、ゲートに用いる多結晶Si層を用いれば
所望の目的に合致した抵抗層が形成できるが、本発明は
この他、如何なる抵抗体にも適用できることは云うまで
もない。
Note that in this embodiment, the resistor ζ has a high surge voltage
Therefore, it is not suitable to form the resistor inside the substrate, such as in a diffusion layer, and it is preferable to form it on the surface of 5i02. For example, if a polycrystalline Si layer used for the gate is used, a resistive layer meeting the desired purpose can be formed, but it goes without saying that the present invention can be applied to any other resistor.

抵抗の値については、出力端子の高レベル電圧を高くす
る必要上、また、出力端の負荷容量を高速に充電する必
要上から100Ω以下が望ましい。
The value of the resistance is desirably 100Ω or less in view of the need to increase the high level voltage at the output terminal and the need to charge the load capacitance at the output terminal at high speed.

例えば、TTLレベルの出力振巾すなわち出力高レベル
VOR>2.4Vを実現するには、バイポーラの電圧降
下0.5vを考慮すると、抵抗による損失を2V以下と
せねばならないので100ΩのときIOHは20mA許
容できる。
For example, in order to achieve a TTL level output amplitude, that is, an output high level VOR>2.4V, considering the bipolar voltage drop of 0.5V, the loss due to resistance must be 2V or less, so when the resistance is 100Ω, IOH is 20mA. acceptable.

以上、バイポーラトランジスタを出力段に用いる例につ
いて説明したが、第4図の如(、nMOsトランジスタ
63,65、第5図の如く、9MOsトランジスタ69
.27を用いる出力段においても抵抗64.70を用い
る全く同様の手段で出力端子66.71よりのサージ電
圧に刻するラッチアップの防止ができることが判明して
いる。
The example in which bipolar transistors are used in the output stage has been described above.
.. It has been found that latch-up caused by the surge voltage from the output terminal 66.71 can also be prevented in the output stage using the resistor 64.70 by the same means using the resistor 64.70.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のCMO8集積回路の内部回路部および出
力回路部の素子構造を示す断面図であり、第2図(5)
は本発明の一実施例の素子偽造を示す断面図、諏2図(
H)は本発明の一実施例の回路図、第3図は本発明の効
果を示す特性図、第4図、第5図は本発明の他の実施例
を示す回路図である。 46・・・・・・・・npnバイポーラトランジスタの
コレクタ電極、47・・・・・・・・・npnバイポー
ラトランジスタのベース電極、49・・・・・・・・・
多結晶シリコン抵抗、54・・・・・・・・・nblO
sトランンスタのゲート電極、hO・・・・・・・・・
・・・npnバイポーラトランジスタ、61・・・・・
・・・・・・nMO8)ランリスタ、62・・・・・曲
出力端子。 代理人 弁理士 薄田利幸 肩  2  図 (A) 9 (f3ジ A? 第  、lffi 第 4121 AI 第 5 月 1 第1頁の続き 0発 明 者 内堀情交 0発 明 者 安井徳政 小平市上水本町1450番地株式会 社日立製作所武蔵工場内
Figure 1 is a cross-sectional view showing the element structure of the internal circuit section and output circuit section of a conventional CMO8 integrated circuit, and Figure 2 (5)
is a cross-sectional view showing element forgery according to an embodiment of the present invention, and Figure 2 (
H) is a circuit diagram of one embodiment of the present invention, FIG. 3 is a characteristic diagram showing the effects of the present invention, and FIGS. 4 and 5 are circuit diagrams showing other embodiments of the present invention. 46...... Collector electrode of npn bipolar transistor, 47... Base electrode of npn bipolar transistor, 49...
Polycrystalline silicon resistor, 54......nblO
Gate electrode of s transistor, hO...
...npn bipolar transistor, 61...
...... nMO8) Run lister, 62... Song output terminal. Agent Patent Attorney Toshiyuki Usuda 2 Figure (A) 9 (f3 The A? No. 4121 AI May 1 Continuation of page 1 0 Inventor Jikou Uchibori 0 Inventor Norimasa Yasui Josui, Kodaira City 1450 Honmachi Musashi Factory, Hitachi, Ltd.

Claims (1)

【特許請求の範囲】[Claims] 1、バイポーラトランジスタのコレクタが電源電圧Vc
cに接続され、エミ、りが抵抗Rをへて出力端子に接続
され、出力端子と接地間にMOSトランジスタのドレイ
ンとソースが接続され、バイポーラトランジスタのベー
スとMOSトランジスタのゲートに他の内部回路より信
号が供給され、その信号を整形増巾して出力端子に供給
する半導体出力回路。
1. The collector of the bipolar transistor is connected to the power supply voltage Vc.
C, the emitter and the resistor are connected to the output terminal through a resistor R, the drain and source of the MOS transistor are connected between the output terminal and ground, and other internal circuits are connected to the base of the bipolar transistor and the gate of the MOS transistor. A semiconductor output circuit that is supplied with a signal, shapes and amplifies the signal, and supplies it to an output terminal.
JP57152728A 1982-09-03 1982-09-03 semiconductor output circuit Expired JPS6051273B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57152728A JPS6051273B2 (en) 1982-09-03 1982-09-03 semiconductor output circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57152728A JPS6051273B2 (en) 1982-09-03 1982-09-03 semiconductor output circuit

Publications (2)

Publication Number Publication Date
JPS5848957A true JPS5848957A (en) 1983-03-23
JPS6051273B2 JPS6051273B2 (en) 1985-11-13

Family

ID=15546853

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57152728A Expired JPS6051273B2 (en) 1982-09-03 1982-09-03 semiconductor output circuit

Country Status (1)

Country Link
JP (1) JPS6051273B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607226A (en) * 1983-06-27 1985-01-16 Hitachi Ltd Signal output circuit
JPS61152459A (en) * 1984-12-26 1986-07-11 Matsushita Electric Ind Co Ltd Printing head driving circuit
KR101104313B1 (en) * 2009-06-15 2012-01-11 동아공업 주식회사 Gasket for exhaust pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607226A (en) * 1983-06-27 1985-01-16 Hitachi Ltd Signal output circuit
JPS61152459A (en) * 1984-12-26 1986-07-11 Matsushita Electric Ind Co Ltd Printing head driving circuit
KR101104313B1 (en) * 2009-06-15 2012-01-11 동아공업 주식회사 Gasket for exhaust pipe

Also Published As

Publication number Publication date
JPS6051273B2 (en) 1985-11-13

Similar Documents

Publication Publication Date Title
US5811857A (en) Silicon-on-insulator body-coupled gated diode for electrostatic discharge (ESD) and analog applications
JP3246807B2 (en) Semiconductor integrated circuit device
US6215135B1 (en) Integrated circuit provided with ESD protection means
US6549061B2 (en) Electrostatic discharge power clamp circuit
US4390890A (en) Saturation-limited bipolar transistor device
JPS5848960A (en) Semiconductor device
KR920003012B1 (en) Bidirection control rectificatton semiconductor devices
JPH0521344B2 (en)
JPS5848957A (en) Semiconductor output circuit
JPH044755B2 (en)
US6255713B1 (en) Current source using merged vertical bipolar transistor based on gate induced gate leakage current
JPH04139758A (en) Semiconductor device and its manufacture
JPS5944782B2 (en) semiconductor integrated circuit
US4050031A (en) Circuit and structure having high input impedance and DC return
JPS6141247Y2 (en)
JPS61115349A (en) Semiconductor integrated circuit device
JP2671304B2 (en) Logic circuit
JPH05129530A (en) Semiconductor integrated circuit
JP2576758B2 (en) Semiconductor element
JP2690201B2 (en) Semiconductor integrated circuit
JP2833913B2 (en) Bipolar integrated circuit device
JPH04330773A (en) Semiconductor device
JPH05160349A (en) Semiconductor device having input protective circuit
JP3117260B2 (en) Semiconductor integrated circuit
JP2971666B2 (en) Semiconductor circuit