JPS5847858A - Adhesion of tile using tile adhering base plate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] The present invention allows even amateurs other than mail craftsmen to easily
◎Conventional I* regarding how to apply Tie IWQ
*As for the glue method, Honde Maroto, in Guest Request No. Sho 65-84275, proposed that a large number of oblong plates are arranged and pasted on a wall or the edge of the body. We proposed a tile wall structure consisting of a strip machine with a protruding joint width and thickness, and tiles or ties 7L/unit affixed to the surface of this oblong board. Since the adhesive is applied to a horizontally long board, it is time-consuming to install, and it also has the disadvantage that the adhesion strength of the tiles may vary due to differences in adhesive application time and uneven adhesive application thickness. As another method, it was
No. 11884, a butyl rubber adhesive composition is coated on both sides of a rubber sheet, a large number of tiles are adhesively fixed on the surface 11 at regular joint intervals, a pattern III paper such as IIK paper is attached to the back surface 11, and a release paper is used during construction. This disclosure discloses a tile unit that is peeled off and pasted on the back side "-F" to a building structure, etc., but the pasting work is performed based on a baseline marked on the building structure, and a large number of tile units are attached to the building structure. 04 Difficult to affix accurately along the base line, and the back side of the tile unit is adhesive. It is not possible to construct a wall surface.Furthermore, it is not acceptable to cut a nine-tie V-enit at the joint where the joint is coated with an adhesive, and the processing is cumbersome.The present invention can eliminate these drawbacks. 0 First, a total of 9 x 8xs of the tie V adhesion substrates (hereinafter referred to as substrates) used in the present invention will be described below according to the examples.
To explain the substrate 5 used for pasting the Itiles 1 which are connected to each other, the substrate 5 is the first S2.
As shown in the figure, vertical width J6GCIl, width W180CII
Then, horizontally (horizontal means left and right in Figure 1) on one side of the substrate body 20, two pieces slightly protrude from the substrate main body 2 at intervals of 11, L, J, and o and have a thickness equal to or slightly smaller than the joint width. , a slight ring-shaped O notch step 4 along the upper and lower edges of the board main body 8, and the main board 2 other than the notch step 4 and the band ia8.
The adhesive layer 5 is uniformly applied on one side of the adhesive layer 5, and the release paper 6 covers one side of the substrate main body 20 on the side where the adhesive layer is applied. The gist of the present invention is to use a substrate 1 on one side of the main substrate 2 made of asbestos cement board, plywood, synthetic resin, etc. (after the strip 8, with an adhesive layer 6 provided.The strip @ 8 has a tie 7
L/7 or tile unit) After the bottom or top of l is shaped like a band 8
The eighth section has the role of aligning the horizontal joints by making them contact Km.
As shown in the figure, the height h of the back strip 8 is less than the thickness of the tile 7 or the tile unit l, and it slightly protrudes from the main body of the substrate (2) to the extent that 8 more ground ties can be made. vo@
Equal to the ground width, 1 is better, but tile 7 or tie V unit) l
It is desirable that the width be slightly smaller than one joint width so that it can be easily inserted between the strips. The spacing between the strips 8 shown in FIG. 1 is equal to the size of the tile unit 10, and the other 11 is the size of the tile unit 10.
J is approximately the size of one tile, and 4 is approximately the size of one tile so that it can be inserted between. Other Thailand j%/7
When pasting a single item, the substrate 1 shown in Figure 5.6 is used. The substrate B is different from the strip-shaped substrate with an interval of 80 m, , mi), but is otherwise the same. The interval m2 between the back strips 8 on the board BK is one tile, and m is half the size of one tile so that when the boards B are joined together, the tie A/7 can be inserted into the back strip 8. be. Whether it is i on the board or B,
Tie 7 or tile unit 1 over the joint 8 and cover between the joints 8! ! If a gap occurs, the gap can be covered with water leakage prevention tape 9, which will be described later. The shape of the band-shaped rear 8 is the second one, which is square in cross section as shown in figure s, and the seventh part which is separate from the main board 2.
As shown in the picture! Expansion or as shown in Figure 8, the main body of the substrate 1
It is possible to drill #110 in the hole and fit it into the hole to fix it to the main body of the board.

Adhesive layer 6 is made of buchi A/V-), rubber asphalt V
- The release paper 6, which is made of a v-F or Hofmel type adhesive, has the role of maintaining the adhesive performance of the adhesive layer 6 until the tile is attached. Although only the agent layer 6 may be coated, one bare surface of the substrate main body 8 may be coated as shown in FIG. 2.8.4. Furthermore, the notch step portion 4 is
It is a linear notch along the top and bottom edges of the main board type,
As shown in FIG. 9, it is necessary when fitting a water leak prevention tape 9 to prevent rainwater from entering from the joint 8 between the main substrates 2, but it is not necessarily necessary for the substrate B used in the present invention.

Next, the method of attaching the tile unit (l) using the above-mentioned nine board members will be explained based on FIG. ! are assembled, and the base boards are sequentially attached and fixed to the furring material 11 using fixing tools 12 such as nails or screws. Next, after fitting the water leakage prevention tape 9 into the notch step 4 between the contacting substrates, the lower end or upper end of the tile unit l is brought into contact with the back strip 8, and while peeling off the m-pattern paper 6, the tile unit) 1 is inserted. Adhesive, suppressing and binding to the agent layer 6. Similarly, for board B, as shown in Figure 11, move to tile 7 using the same operation as for board B.
Press and paste in sequence. After suppressing adhesion, perform joint filling in the usual manner.

The following describes the effects of the present invention: - Since a belt-like back is provided on the substrate depending on the size of the tile or tile unit, and the tile or tile unit is brought into contact with the back of the belt, there is no possibility that the tile or tile unit will be misaligned when attached. This allows you to install beautiful tiles with good joints.

It does not require any time, does not stain tiles or floors, and has a uniform adhesive layer! The adhesive strength of the 9 tiles, which is thicker and covered with release paper, will reduce variations in the adhesive strength of the 9 tiles, which is unrelated to the coating time. It is not necessary and you can use ordinary connecting paper, and when pasting Tile Etsu F, its size K
Can be easily cut and processed at glh joints.

[Brief explanation of the drawing]

1 is a plan view of the substrate used in the present invention, FIG. 8 is a sectional view of the substrate in FIG. 1, FIG. 8 is an enlarged sectional view of FIG. -C enlarged sectional view, FIG. 5 is a plan view of the substrate 1 used in the present invention, and FIG. 6 is D of FIG.
-D cross-sectional view, Figures 7 and 8 are cross-sectional views showing other embodiments of the band-forming machine, No. S#flA is a partial cross-sectional view showing a state where the water leakage prevention tape is fitted into the notch step, No. 16, FIG. 11 is a partial cross-sectional view showing the result of bonding to a Tie A/Et or Tie J&/L substrate by the method of the present invention. B... Ii μ bonding substrate, 1... Tie V unit), 2... Substrate main body, 8... Strip machine, 6... Adhesive layer, 6... Release paper , 7... Tile, ll... Furniture material, 12... Fixture Fig. 10 Fig. 11

Claims (1)

[Claims] Substrate main body 0JIr surface Kjl or I
*It is formed in the same way as IKIIs, and is formed uniformly on one side II# of the main board to which the joint width and Oka, etc. or small, medium, and wide strips of several strips are attached, and IJl/ is attached. After attaching and fixing the tile adhesion substrate, which consists of an adhesive layer and a small amount of patterned paper covering the adhesive layer, to the body material using fixing tools such as nails and screws, Or IV
The feature is that the lower end or upper end of O is brought into contact with the strip tape, and while peeling off the 1k paper, the I fork is pressed and adhered to the adhesive layer with the IJ4/work cut, and the joint is filled. Tie bonding method using a board for bonding