JPS5846507A - Semiconductive polyolefin composition - Google Patents

Semiconductive polyolefin composition

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Publication number
JPS5846507A
JPS5846507A JP14322481A JP14322481A JPS5846507A JP S5846507 A JPS5846507 A JP S5846507A JP 14322481 A JP14322481 A JP 14322481A JP 14322481 A JP14322481 A JP 14322481A JP S5846507 A JPS5846507 A JP S5846507A
Authority
JP
Japan
Prior art keywords
insulator
copper
weight
semiconductive
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14322481A
Other languages
Japanese (ja)
Inventor
椎名 利雄
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP14322481A priority Critical patent/JPS5846507A/en
Publication of JPS5846507A publication Critical patent/JPS5846507A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)
  • Conductive Materials (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 含む。)絶縁ケーブルの半導電層などの銅のような金属
と接触する個所に用いられる半導電性ポリオレフィン組
成物の改良に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Including. ) This invention relates to improvements in semiconducting polyolefin compositions used in areas that come into contact with metals such as copper, such as semiconducting layers of insulated cables.

ポリオレフィン、例えば、ポリエチレン、架橋ポリオレ
フィン、エチレンプローレンゴムを絶縁体とする高電圧
用クー4°ルにおいては、半導゛成層としてエチレン−
酢酸ビニルコポリマ、エチレンーエチルアクリレートコ
ポリマ、エチレンプローピレンゴムあるいはこれらの混
合物などを母体とし、これにカーボンブラックを添加し
て導電性を付与したものが使用されている。
In high-voltage coolers using polyolefins such as polyethylene, crosslinked polyolefins, and ethylene proprene rubber as insulators, ethylene-prone rubber is used as a semiconductor layer.
The base material used is vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene propylene rubber, or a mixture thereof, to which carbon black is added to impart conductivity.

ところが、銅導体あるいは銅テープと直接接触する場合
は、水蒸気架橋のような製造工程中または使用中に侵入
する水分によって銅が変色したり、ひどい場合には腐食
することがある。特に導電性を付与するために添加する
カーボンプレツクは吸湿しやすく、カーボンブラックを
添加しないものにくらべてこの傾向が著しい。そのため
、ベンゾトリアゾールのような化合物を被覆する方法が
採用されているが、工程がふえて高価なものとなる。
However, when in direct contact with copper conductors or copper tapes, moisture that enters during manufacturing processes such as steam crosslinking or during use can cause the copper to discolor or, in severe cases, corrode. In particular, carbon plectrum added to impart electrical conductivity tends to absorb moisture, and this tendency is more pronounced than in those to which no carbon black is added. Therefore, a method of coating with a compound such as benzotriazole has been adopted, but this increases the number of steps and is expensive.

ま几、汎用の銅害防止剤を半導電性コンパウンドに添加
する方法もあるが、一般に高融点であるため分散しにく
いという欠点がある。
There is also a method of adding a general-purpose copper damage inhibitor to a semiconductive compound, but it has the disadvantage that it is difficult to disperse because it generally has a high melting point.

本発明は上記に鑑みてなされたもので、その目的とする
ところは、接触している銅などの金属を変色させたり、
絶縁体へ移行して絶縁体を汚染して電気的特性を悪化さ
せることがない半導電性ポリオレフィン組成物を提供す
ることにある。
The present invention has been made in view of the above, and its purpose is to discolor metals such as copper that are in contact with them,
An object of the present invention is to provide a semiconductive polyolefin composition that does not migrate to an insulator, contaminate the insulator, and deteriorate electrical characteristics.

本発明の特徴は、エチレン系ポリマを母体とする半導電
性コンパウンドにビスフェノールAとエピクロルヒドリ
ンとより合成したエポキシ当量280以下の液状エポキ
シ樹脂を0.1〜5重量部添加した半導電性ポリオレフ
ィン組成物とした点にある。
The present invention is characterized by a semiconductive polyolefin composition in which 0.1 to 5 parts by weight of a liquid epoxy resin synthesized from bisphenol A and epichlorohydrin and having an epoxy equivalent of 280 or less is added to a semiconductive compound having an ethylene polymer as a base material. The point is that

エチレン系ポリマを母体とする半導電性コンパウンドに
4.4′−チオビス(6−ターンヤリブチル−m−クレ
ゾール)、2.2’−チオジエチルビス−[:3−(3
,5−ジ−ターシャリブチル−4−ヒドロキシフェニル
)−プロピオネート〕、°ベンダエリヌリチルーテトラ
キヌ(3−(3,5”ジ−ターシャリブチル−4−ヒド
ロキシフェニル)プロピオネート〕のようなフェノール
系や含硫黄フェノール系の酸化防止剤を添化しても接触
した銅の′変色防止には何等効果示”ない。またンこれ
らにジステアリルチオージグロビオネートのようなチオ
エーテルを併用しても同様であった。一方、ポリ−2,
2,4−)ジメチル1,2−ジヒドロキノリンのような
アミン系酸化防止剤を添化すると、銅変色防止効果を示
す”が、絶縁体へ移行して絶縁体を汚染するとともに浸
水課電による破壊電圧を低下させることが確認された。
4.4'-thiobis(6-ternyabutyl-m-cresol), 2.2'-thiodiethylbis-[:3-(3
, 5-di-tert-butyl-4-hydroxyphenyl)-propionate], °bendaerinurity-tetraquine (3-(3,5" di-tert-butyl-4-hydroxyphenyl) propionate) Even if sulfur-based or sulfur-containing phenolic antioxidants are added, they have no effect on preventing discoloration of copper that comes into contact with it.Additionally, even if these are combined with thioethers such as distearylthiodiglobionate, On the other hand, poly-2,
When an amine-based antioxidant such as 2,4-) dimethyl 1,2-dihydroquinoline is added, the anti-discoloration effect of copper is transferred to the insulator, contaminating the insulator, and causing damage due to flooding due to charging. It was confirmed that the breakdown voltage was reduced.

これらに対して、エポキシ当量280以下のエポキシ樹
脂、例えば、2,2−ビス(4−ヒドロキシフェニル)
プロパンのエピクロルヒドリンまたは2−メチルエピク
ロルヒドリンによるジグリシジルエーテル化変性物(商
品名:エピコート828(シェル化学) 、 Mark
g P −17(アデカ・アーガス化学))を添化する
と、銅変色防止効果を示すとともに絶縁体へ移行して絶
縁体を汚染することがなくなることが実験的に明確にな
ったO なお、エポキシ当量280以下のエポキシ樹脂は液状で
あり、これを用いると混合物中に均一に分散するが、エ
ポキシ当量280以上では固体になるため、分散が不均
一になる。また、液状であると、計量などの取扱上有利
である。そこで本発明においては、エポキシ当量280
以下の液状エポキシ樹脂に限定した。また、液状エポキ
シ樹脂の添加量を5重量部以上とすると、半導電性コン
パウンドの物性に影響し、また、0.1重量部以下では
上記した効果が少なくなるので、添加量を6.1〜5重
量部と限定した。これにより、銅変色防止効果、絶縁体
汚染防止効果を生じ、かつ、浸水課電後の破壊電圧の低
下が少なくなることが確認された。
In contrast, epoxy resins with an epoxy equivalent of 280 or less, such as 2,2-bis(4-hydroxyphenyl)
Diglycidyl etherification product of propane with epichlorohydrin or 2-methylepichlorohydrin (trade name: Epicote 828 (Shell Chemical), Mark
It has been experimentally clarified that adding P-17 (Adeka Argus Chemical)) exhibits the effect of preventing copper discoloration and does not migrate to the insulator and contaminate the insulator. An epoxy resin with an equivalent weight of 280 or less is liquid and will be uniformly dispersed in the mixture when used, but an epoxy resin with an epoxy equivalent weight of 280 or more will become solid and will not be uniformly dispersed. In addition, the liquid state is advantageous in terms of handling such as measurement. Therefore, in the present invention, the epoxy equivalent is 280
The following liquid epoxy resins were used. Furthermore, if the amount of liquid epoxy resin added is 5 parts by weight or more, it will affect the physical properties of the semiconductive compound, and if it is less than 0.1 part by weight, the above-mentioned effects will be reduced. The amount was limited to 5 parts by weight. It was confirmed that this produced an effect of preventing copper discoloration and an effect of preventing insulator contamination, and also reduced the drop in breakdown voltage after electrification due to water immersion.

さらに酸化防止剤、滑剤、加硫助剤などを添加しても銅
変色防止効果は十分維持される。しかし、絶縁体への移
行により絶縁体を汚染して電気的特性を低下させること
があるので、それの選択については十分注意する必要が
ある。
Furthermore, even if an antioxidant, a lubricant, a vulcanization aid, etc. are added, the effect of preventing copper discoloration is sufficiently maintained. However, the transition to the insulator may contaminate the insulator and degrade its electrical characteristics, so care must be taken in selecting it.

以下本発明の実施例と参考例について説明する。Examples and reference examples of the present invention will be described below.

実施例1゜ エチレン−酢酸ビニルコポリマ(VA==、19%、M
I=15 ’)I 00重量部に対して、アセチレンブ
ラック70重量部、4,4′−チオビス−(6−ターシ
ャリブチル−m−クレゾール)0.3重量部、ジクミル
パーオキサイド20重量部を添化し、さらにエピコート
828を2.0重量部添加した。
Example 1 Ethylene-vinyl acetate copolymer (VA==, 19%, M
I=15') I00 parts by weight, 70 parts by weight of acetylene black, 0.3 parts by weight of 4,4'-thiobis-(6-tert-butyl-m-cresol), 20 parts by weight of dicumyl peroxide. was added, and 2.0 parts by weight of Epicoat 828 was added.

実施例2゜ エチレンーエチルアクリレートコポリマ(EA量=18
%、MI=20)100重量部に対して、実施例1°と
同様、アセチレンブラック、酸化防止剤、架橋剤をそれ
ぞれ同量添加し、さらにMarkEP−17を1.0重
量部添加した。
Example 2゜Ethylene-ethyl acrylate copolymer (EA amount = 18
%, MI=20), same amounts of acetylene black, antioxidant, and crosslinking agent were added as in Example 1, and 1.0 part by weight of Mark EP-17 was added.

参考例1゜ へ実施例1においてエピコート828の添加を除いた。Reference example 1゜ In Example 1, the addition of Epicote 828 was excluded.

参考例2゜ 実施例2VcおいてMarkEP−1の添加を除いた。Reference example 2゜ In Example 2Vc, addition of MarkEP-1 was excluded.

次に上記した実施例1.2、参考例1.2に示した半導
電性組成物についての試験方法と試験結果について説明
する。
Next, the test methods and test results for the semiconductive compositions shown in Example 1.2 and Reference Example 1.2 will be explained.

(1]  銅変色試験 半導電性組成物の厚さ約2閣の未架橋シート間に銅線を
はさみ、架橋剤の分解温度以下の温度で再成形した後、
1’3Kt/dの水蒸気中で15分間架橋した後、室温
で30日間放置し、この段階で銅の変色状態を観察した
(1) Copper discoloration test A copper wire was sandwiched between uncrosslinked sheets of a semiconductive composition about 2 cm thick, and after being remolded at a temperature below the decomposition temperature of the crosslinking agent,
After crosslinking in water vapor of 1'3 Kt/d for 15 minutes, it was left to stand at room temperature for 30 days, and at this stage the state of discoloration of the copper was observed.

(2)絶縁体への移行による絶縁体汚染試験半導電性組
成物のシートと架橋ポリエチレン絶縁体シートとを重ね
合せて両者が密着するように荷重をかけ、90°Cの恒
温槽内に2週間放置し、絶縁体汚染の有無を観察した。
(2) Insulator contamination test due to migration to insulator A sheet of semiconductive composition and a cross-linked polyethylene insulator sheet are placed one on top of the other, a load is applied so that they are in close contact with each other, and the mixture is placed in a constant temperature bath at 90°C for 2 hours. After leaving it for a week, the presence or absence of insulator contamination was observed.

(3)  浸水課電後の破壊電圧残率試験各半導電性組
成物で半導電層を形成しり6.6蒔ケーブル(銅導体1
20−1半導電層厚さ1団、架橋ポリエチレン絶縁体厚
さ5.5 mm )を試作し、架橋は水蒸気を用いて行
い、これを90℃の水中でACloKvを印加し、30
日後に課電を・止めて破壊電圧を測定し、初期値に対す
る残率(%)を求めた。
(3) Breakdown voltage residual rate test after submergence voltage application Forming a semiconducting layer with each semiconducting composition
20-1 semiconducting layer thickness: 1 group, crosslinked polyethylene insulator thickness: 5.5 mm) was prototyped, crosslinking was performed using water vapor, and ACloKv was applied in water at 90°C.
After several days, the voltage application was stopped, the breakdown voltage was measured, and the residual ratio (%) with respect to the initial value was determined.

第1表は上記試験における試験結果である。Table 1 shows the test results in the above test.

第    1    表 第1表に示すように、実施例1.2に示す半導電性組成
物を用いであるものは、銅変色、絶縁体の汚染がなく、
シたがって、銅を腐食させた、す、絶縁体の電気的特性
を、悪化させることがない。
Table 1 As shown in Table 1, those using the semiconductive composition shown in Example 1.2 had no copper discoloration and no contamination of the insulator.
Therefore, the electrical characteristics of the insulator will not be deteriorated by corroding the copper.

ま几、浸水課電後の破壊電圧残率が100%近くであり
、破壊電圧の低下が微少である。これに対して参考例1
.2に示す半導電性組成物を用いであるものけ、銅変色
、破壊型残率が不満足な結果になっている。
The breakdown voltage residual rate after flooding is nearly 100%, and the drop in breakdown voltage is minimal. On the other hand, reference example 1
.. When the semiconductive composition shown in No. 2 was used, the results were unsatisfactory in terms of discoloration, copper discoloration, and residual percentage of broken mold.

なお、本発明の実施例によれば上記した試験結果が得ら
れるのは、エポキシ樹脂には有機酸を捕捉する作用があ
り、蒸気架橋時のEVA、EEAから発生する酢酸、ア
クリル酸などの有機酸を捕捉し、また、架橋剤の分解残
査は酸性物質であるがこれも捕捉するからであると考え
られる。
According to the examples of the present invention, the above test results are obtained because epoxy resin has the effect of capturing organic acids, and organic acids such as acetic acid and acrylic acid generated from EVA and EEA during steam crosslinking are This is thought to be because it traps acids and also traps the decomposition residue of the crosslinking agent, which is an acidic substance.

なお、上記した(2) 、 (3)の試験では架橋ポリ
エチレン絶縁体を用いであるが、エチレン−酢酸ビニル
コポリマ、エチレン−エチルアクリレ−vポリ  □△ マ エチレンプロピレンゴムなどの絶縁体を用いたケー
ブルの場合でも同様の効果が得られる。
Although cross-linked polyethylene insulators were used in the tests (2) and (3) above, cables using insulators such as ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate-v polyethylene propylene rubber, etc. A similar effect can be obtained in the case of

また、ポリエチレンなどの架橋しないポリオレフィン絶
縁ケーブルの場合にも同様の効果力;ある。
A similar effect can also be found in the case of non-crosslinked polyolefin insulated cables such as polyethylene.

以上層間したように、本発明によれば、接触している銅
などの金属を変色させたり、絶縁体へ移行して絶縁体を
汚染して電気的特性を悪化させることがないという効果
がある。
As described above, the present invention has the effect of not discoloring metals such as copper that are in contact with the layer, or migrating to the insulator, contaminating the insulator, and deteriorating the electrical characteristics. .

Claims (1)

【特許請求の範囲】[Claims] エチレン系ポリマを母体とする半導電性コンパウンドに
ビスフェノールAとエピクロルヒドリンとより合成した
エポキシ当量280以下の液状工;l−シ樹MiO,1
〜5重量部添加してなることを特徴とする半導体性ポリ
オレフィン組成物。
A liquid material with an epoxy equivalent of 280 or less synthesized from bisphenol A and epichlorohydrin in a semiconductive compound based on ethylene polymer;
A semiconducting polyolefin composition, characterized in that the composition contains up to 5 parts by weight.
JP14322481A 1981-09-11 1981-09-11 Semiconductive polyolefin composition Pending JPS5846507A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14322481A JPS5846507A (en) 1981-09-11 1981-09-11 Semiconductive polyolefin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14322481A JPS5846507A (en) 1981-09-11 1981-09-11 Semiconductive polyolefin composition

Publications (1)

Publication Number Publication Date
JPS5846507A true JPS5846507A (en) 1983-03-18

Family

ID=15333774

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14322481A Pending JPS5846507A (en) 1981-09-11 1981-09-11 Semiconductive polyolefin composition

Country Status (1)

Country Link
JP (1) JPS5846507A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63297440A (en) * 1987-05-29 1988-12-05 Tokai Carbon Co Ltd Polyethylene polymer composition

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132709A (en) * 1980-02-15 1981-10-17 Showa Electric Wire & Cable Co Power cable

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56132709A (en) * 1980-02-15 1981-10-17 Showa Electric Wire & Cable Co Power cable

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63297440A (en) * 1987-05-29 1988-12-05 Tokai Carbon Co Ltd Polyethylene polymer composition

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