JPH08241624A - Semiconductor resin composition for power cable - Google Patents

Semiconductor resin composition for power cable

Info

Publication number
JPH08241624A
JPH08241624A JP4451695A JP4451695A JPH08241624A JP H08241624 A JPH08241624 A JP H08241624A JP 4451695 A JP4451695 A JP 4451695A JP 4451695 A JP4451695 A JP 4451695A JP H08241624 A JPH08241624 A JP H08241624A
Authority
JP
Japan
Prior art keywords
resin composition
carbon black
power cable
semiconductive
sulfur
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4451695A
Other languages
Japanese (ja)
Inventor
Makoto Masuda
誠 増田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP4451695A priority Critical patent/JPH08241624A/en
Publication of JPH08241624A publication Critical patent/JPH08241624A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To provide a power cable capable of restraining the generation of a water-tree in the semiconductive layer of a power cable and having high reliability, by blending conductive carbon black and also specific quantity of sulfur into polyolefine resin in a simiconductive resin composition. CONSTITUTION: A semiconductive resin composition for a power cable is a semiconductive resin composition including polyolefine resin and carbon black, and moreover, contains a sulfur of 1.0-3.0 wt. parts to a polyolefine resin of 100 wt. parts, besides can be blended with the adequate quantity of an additive such as a cross linking agent, or antioxidant and a processing aid. Acetylene black or conductive furnace black etc., can be used as conductive carbon black. In the carbon black, its particle diameter or a material characteristic value such as specific surface area is not limited in particular. Blended quantity in base polymer is also not limited in particular, and is appropriately adjusted by given conductivity and the kind of the conductive carbon black.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電力ケーブルに使用さ
れる半導電性樹脂組成物に関し、特に半導電層からの水
トリ−の発生を抑制して電力ケーブルの信頼性を高める
ことができる半導電性樹脂組成物に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductive resin composition used for power cables, and more particularly, it can suppress the generation of water traces from the semiconductive layer and enhance the reliability of the power cable. It relates to a semiconductive resin composition.

【0002】[0002]

【従来の技術】近年の電力ケーブルの主流である架橋ポ
リエチレン絶縁ケーブルは、絶縁体界面における電界集
中の緩和や部分放電の防止を目的として、図1に示され
るように、ケーブル導体1と絶縁体3との境界面並びに
絶縁体3の外表面に、それぞれ内部半導電層2および外
部半導電層4を設け、外部半導電層4の外表面に銅遮蔽
層5及び更にシース層6を設けることが極めて一般的な
構造となっている。前記内部半導電層2及び外部半導電
層4は、ポリオレフィンをベース樹脂とし、これに導電
性カーボンブラックを適当量配合して半導電化した半導
電性樹脂組成物からなり、電力ケーブルの製造時に絶縁
体3と同時押出成形され、ケーブル導体1上並びに絶縁
体3上に形成される。
2. Description of the Related Art A cross-linked polyethylene insulation cable, which is a mainstream of electric power cables in recent years, has a cable conductor 1 and an insulation body as shown in FIG. 1 for the purpose of relaxing electric field concentration at the insulation body interface and preventing partial discharge. 3, the inner semiconductive layer 2 and the outer semiconductive layer 4 are provided on the boundary surface with the insulating layer 3 and the outer semiconductive layer 4, respectively, and the copper shielding layer 5 and the sheath layer 6 are provided on the outer surface of the outer semiconductive layer 4. Is a very general structure. The inner semiconductive layer 2 and the outer semiconductive layer 4 are made of a semiconductive resin composition in which polyolefin is used as a base resin and conductive carbon black is mixed in an appropriate amount to be semiconductive. It is co-extruded with the insulator 3 and formed on the cable conductor 1 and the insulator 3.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、前記半
導電層は、押出成形後の半導電層表面の突起が起点とな
って内導トリーや外導トリーなどの半導電層トリーが発
生することがある。この水トリーは、電力ケーブルの絶
縁破壊の原因となり、電力ケーブルの信頼性を低下させ
る要因となっている。
However, in the above-mentioned semiconductive layer, a semiconductive layer tree such as an inner conductive tree or an outer conductive tree may be generated from the protrusions on the surface of the semiconductive layer after extrusion molding as starting points. is there. This water tree causes a dielectric breakdown of the power cable and is a factor that reduces the reliability of the power cable.

【0004】本発明は上記の問題に鑑みてなされたもの
であり、半導電層からの水トリ−発生を抑制し、電力ケ
ーブルの信頼性を高める半導電層用樹脂組成物を提供す
ることを目的とする。
The present invention has been made in view of the above problems, and it is an object of the present invention to provide a resin composition for a semiconductive layer which suppresses the generation of water from the semiconductive layer and enhances the reliability of the power cable. To aim.

【0005】[0005]

【課題を解決するための手段】上記本発明の目的は、ポ
リオレフィン樹脂及びカーボンブラックを含む半導電性
樹脂組成物であって、前記ポリオレフィン樹脂100重
量部に対し、硫黄1.0〜3.0重量部を含有すること
を特徴とする電力ケーブルの半導電層用樹脂組成物によ
り達成される。
The above object of the present invention is a semiconductive resin composition containing a polyolefin resin and carbon black, wherein 1.0 to 3.0% of sulfur is added to 100 parts by weight of the polyolefin resin. This is achieved by a resin composition for a semiconductive layer of a power cable, which is characterized by containing parts by weight.

【0006】以下、本発明を更に詳細に説明する。本発
明の半導電性樹脂組成物のベースポリマーとなるポリオ
レフィン樹脂は、従来より電力ケーブルに使用されるポ
リオレフィン樹脂を使用できる。例えば、ポリエチレ
ン、あるいはエチレン−酢酸ビニルコポリマー、エチレ
ン−エチルアクリレートコポリマー等のエチレン系共重
合体を挙げることができる。特に、エチレン−酢酸ビニ
ルコポリマーが好ましい。また、前記ポリオレフィン樹
脂と相溶性を有する樹脂とのブレンドポリマーでも構わ
ない。これらポリオレフィン樹脂の分子量も特に限定さ
れるものではなく、従来より電力ケーブルとして使用さ
れるポリオレフィン樹脂の分子量の範囲で構わない。
The present invention will be described in more detail below. The polyolefin resin used as the base polymer of the semiconductive resin composition of the present invention may be a polyolefin resin conventionally used for power cables. For example, polyethylene or ethylene-based copolymers such as ethylene-vinyl acetate copolymer and ethylene-ethyl acrylate copolymer can be mentioned. In particular, ethylene-vinyl acetate copolymer is preferable. Further, it may be a blend polymer of a resin having compatibility with the polyolefin resin. The molecular weight of these polyolefin resins is not particularly limited, and may be in the range of the molecular weight of polyolefin resins conventionally used for electric power cables.

【0007】本発明の半導電性樹脂組成物は、前記ベー
スポリマーに適当量の導電性カーボンブラックを配合し
て所定の導電性を付与してなる。導電性カーボンブラッ
クの種類は特に限定されるものではなく、通常用いられ
ているアセチレンブラックや導電性ファーネスブラック
等を使用できる。また、これら導電性カーボンブラック
は、その粒径や比表面積等の物性値も特に制限されな
い。更に、ベースポリマー中の配合量も特に限定され
ず、付与する導電率並びに前記導電性カーボンブラック
の種類により適宜調整される。
The semiconductive resin composition of the present invention is prepared by adding a proper amount of conductive carbon black to the base polymer to impart a predetermined conductivity. The type of conductive carbon black is not particularly limited, and commonly used acetylene black, conductive furnace black or the like can be used. In addition, physical properties such as particle size and specific surface area of these conductive carbon blacks are not particularly limited. Further, the blending amount in the base polymer is not particularly limited, and is appropriately adjusted depending on the conductivity to be imparted and the kind of the conductive carbon black.

【0008】本発明の半導電性樹脂組成物は、更に前記
ポリオレフィン樹脂100重量部に対して1.0〜3.
0重量部の硫黄を配合することを特徴とする。ここで、
硫黄の添加量が3.0重量部を超える場合には、成形時
に硫黄のブルーミングが起こり、外観を損なうため好ま
しくない。一方、1.0重量部より少ない場合には、水
トリー発生の抑制に充分な効果を得ることができない。
また、硫黄は粉末状で導電性カーボンブラックとともに
ベースポリマーに添加、混練される。
The semiconductive resin composition of the present invention further comprises 1.0-3.
It is characterized by containing 0 part by weight of sulfur. here,
If the amount of sulfur added exceeds 3.0 parts by weight, blooming of sulfur will occur during molding and the appearance will be impaired, such being undesirable. On the other hand, if the amount is less than 1.0 part by weight, it is not possible to obtain a sufficient effect for suppressing the generation of water trees.
Further, sulfur is powdery and is added and kneaded to the base polymer together with the conductive carbon black.

【0009】本発明の半導電層樹脂組成物は、上記した
ポリオレフィン樹脂、導電性カーボンブラックおよび硫
黄を必須成分とするものであるが、本発明の効果を損な
わない程度に他の添加物を加えることもできる。例え
ば、架橋剤や酸化防止剤、加工助剤等を適量配合するこ
ともできる。
The semiconductive layer resin composition of the present invention contains the above-mentioned polyolefin resin, conductive carbon black and sulfur as essential components, but other additives are added to the extent that the effects of the present invention are not impaired. You can also For example, a suitable amount of a crosslinking agent, an antioxidant, a processing aid, etc. can be added.

【0010】[0010]

【実施例】本発明に係る電力ケーブル用半導電性樹脂組
成物に関して、実施例並びに比較例をもとにより詳細に
説明するが、本発明はこれらに限定されるものではな
い。 〔実施例1〜2および比較例1〜2〕表1に示される割
合(重量部)でエチレン−酢酸ビニル共重合体、導電性
カーボンブラック、硫黄、架橋剤及び酸化防止剤を混合
し、半導電性樹脂組成物を調製した。そして、前記半導
電性樹脂組成物を用いてディスク状シートサンプルを作
製し、実験的に高周波加速浸水課電試験に供した。即
ち、この半導電性樹脂組成物及び絶縁体としての架橋剤
を添加した低密度ポリエチレンを別々に加熱プレスによ
り予備成形し、次に両者を合わせて175℃、20分で
プレスし、架橋成形した。これをディスク状に切り抜き
サンプルとした。ただし、絶縁体の厚さは1mmとし、
半導電層の絶縁体との界面は耐水サンドぺーパーにて粗
面処理した。次に半導電層側を1モル/リットルのNa
Cl水溶液に浸し、高周波加速試験装置を用いて電圧
6.9kV、周波数1000Hzにて250時間課電し
た。課電後のサンプルをミクロトームにて300μmの
厚さに切削しクリスタルバイオレッドで染色後、光学顕
微鏡で半導電層から発生した長さが30μm以上の水ト
リーについてその長さと個数を記録した。
EXAMPLES The semiconductive resin composition for a power cable according to the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto. [Examples 1 and 2 and Comparative Examples 1 and 2] Ethylene-vinyl acetate copolymer, conductive carbon black, sulfur, a cross-linking agent and an antioxidant were mixed in the proportions (parts by weight) shown in Table 1 to give a semi-finished product. A conductive resin composition was prepared. Then, a disk-shaped sheet sample was prepared using the semiconductive resin composition, and was experimentally subjected to a high frequency accelerated water immersion voltage application test. That is, this semiconductive resin composition and low-density polyethylene to which a cross-linking agent as an insulator was added were separately preformed by hot pressing, and then both were combined and pressed at 175 ° C. for 20 minutes for cross-linking molding. . This was cut into a disk shape to obtain a sample. However, the thickness of the insulator is 1 mm,
The interface between the semiconductive layer and the insulator was roughened with a waterproof sandpaper. Next, 1 mol / liter of Na is applied to the semiconductive layer side.
It was immersed in a Cl aqueous solution and charged with a voltage of 6.9 kV and a frequency of 1000 Hz for 250 hours using a high frequency acceleration tester. The sample after charging was cut to a thickness of 300 μm with a microtome and stained with crystal violet, and the length and number of the water tree generated from the semiconductive layer of 30 μm or more were recorded by an optical microscope.

【0011】[0011]

【表1】 [Table 1]

【0012】表1から明らかなように、本発明の特定量
硫黄を添加した半導電性樹脂組成物を用いて作成したデ
ィスク状シートサンプルによる実験から、硫黄の添加量
が本発明の特定量以外であったり、全く添加しないもの
を用いた場合に比較して半導電層からの水トリー発生が
抑制されていることが判る。
As is clear from Table 1, from the experiment using the disk-shaped sheet sample prepared by using the semiconductive resin composition of the present invention to which the specific amount of sulfur was added, the addition amount of sulfur was other than the specific amount of the present invention. It can be seen that the generation of water trees from the semiconductive layer is suppressed as compared with the case of using no addition at all.

【0013】[0013]

【発明の効果】以上説明したように、本発明の半導電性
樹脂組成物は、ポリオレフィン樹脂に導電性カーボンブ
ラックとともに特定量の硫黄を配合したことにより、水
トリーの発生が抑制される。従って、本発明の半導電性
樹脂組成物を使用することにより、信頼性の高い電力ケ
ーブルを製造することができる。
As described above, the semiconductive resin composition of the present invention suppresses the generation of water trees by blending the polyolefin resin with the conductive carbon black and a specific amount of sulfur. Therefore, a highly reliable power cable can be manufactured by using the semiconductive resin composition of the present invention.

【図面の簡単な説明】[Brief description of drawings]

【図1】電力ケーブルの代表的な構成例を示す要部断面
図である。
FIG. 1 is a cross-sectional view of essential parts showing a typical configuration example of a power cable.

【符号の説明】[Explanation of symbols]

1 導体 2 内部半導電層 3 絶縁体 4 外部半導電層 5 銅遮蔽層 6 シース 1 conductor 2 inner semiconductive layer 3 insulator 4 outer semiconductive layer 5 copper shielding layer 6 sheath

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ポリオレフィン樹脂及びカーボンブラッ
クを含む半導電性樹脂組成物であって、前記ポリオレフ
ィン樹脂100重量部に対し、硫黄1.0〜3.0重量
部を含有することを特徴とする電力ケーブル用半導電性
樹脂組成物。
1. A semiconducting resin composition containing a polyolefin resin and carbon black, which contains 1.0 to 3.0 parts by weight of sulfur with respect to 100 parts by weight of the polyolefin resin. Semi-conductive resin composition for cables.
【請求項2】 上記ポリオレフィン樹脂がポリエチレン
又はエチレン系共重合体樹脂であることを特徴とする請
求項1記載の電力ケーブル用半導電性樹脂組成物。
2. The semiconductive resin composition for a power cable according to claim 1, wherein the polyolefin resin is polyethylene or an ethylene copolymer resin.
JP4451695A 1995-03-03 1995-03-03 Semiconductor resin composition for power cable Pending JPH08241624A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4451695A JPH08241624A (en) 1995-03-03 1995-03-03 Semiconductor resin composition for power cable

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4451695A JPH08241624A (en) 1995-03-03 1995-03-03 Semiconductor resin composition for power cable

Publications (1)

Publication Number Publication Date
JPH08241624A true JPH08241624A (en) 1996-09-17

Family

ID=12693720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4451695A Pending JPH08241624A (en) 1995-03-03 1995-03-03 Semiconductor resin composition for power cable

Country Status (1)

Country Link
JP (1) JPH08241624A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100530139B1 (en) * 2002-10-31 2005-11-21 한국전력공사 Supersmooth semiconductive resin composition and power cable using the same
CN107742548A (en) * 2010-11-03 2018-02-27 博瑞立斯有限公司 A kind of polymer composition and the power cable comprising polymer composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100530139B1 (en) * 2002-10-31 2005-11-21 한국전력공사 Supersmooth semiconductive resin composition and power cable using the same
CN107742548A (en) * 2010-11-03 2018-02-27 博瑞立斯有限公司 A kind of polymer composition and the power cable comprising polymer composition
CN107742548B (en) * 2010-11-03 2021-08-20 博瑞立斯有限公司 Polymer composition and power cable containing same

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