JPS5844635Y2 - electronic equipment housing - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a casing for an electronic device that serves as a case for an electronic device and at the same time functions as a heat dissipation function for heat-generating components.

There is a structure in which a heat pipe is formed on the wall of the casing of an electronic device such as an audio amplifier to dissipate heat from heat-generating components, and has been filed as Japanese Patent Application No. 144,774.

In the case of a loose electronic device, the heat pipe formed on the wall excluding the front panel surface and bottom surface of the device is, for example, the first heat pipe.
As shown by the broken line in the figure, the part of the base of the housing 1 where the heating element 5 is connected is the lower end and extends upwardly,
The structure continued to the center of the top surface of the casing 1.

Therefore, in order to prevent the heat pipe from clogging at the corner between the side surface and the top surface of the casing 1, it was necessary to form this corner into a curved shape.

This has resulted in disadvantages such as complicating the manufacturing process of the housing of such electronic equipment and limiting its shape, thereby narrowing the scope of application to electronic equipment.

The present invention provides a casing for an electronic device that is equipped with a heat dissipation means using a heat pipe, which can be easily bent between the side and top surfaces, and can radiate heat through the entire wall surface. The purpose is to

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 2 shows an embodiment of the present invention, and this figure particularly shows the side wall surface and top surface of the casing of the electronic device according to the present invention.

This casing 1 is made of, for example, roll-bonded aluminum plates, and a part of its side wall surface 2 is provided with a heating element mounting surface 4 for mounting a heating element such as a back transistor.

A lattice-shaped first closed circuit 6 is provided on almost the entire surface of the side wall surface 2 excluding the heating element mounting surface 4, thereby forming a first heat pipe.

The space inside the first closed circuit 6 is filled with a predetermined working fluid, and this working fluid vaporizes in the lower part of the first closed circuit 6 and condenses in the upper part of the closed circuit 6. By repeating this process, the heat generated in the heating element coupled to the heating element mounting surface 4 is quickly transferred to the entire side wall surface 2.

In the case 1 of this electronic device, an independent second closed circuit 7 is provided on the top surface 3 thereof.

Like the first closed circuit 6, this second closed circuit 7 is filled with a predetermined working fluid to form a second heat pipe, and the heat transferred from the side wall surface 2 is transferred to the upper surface 3. It has the function of transmitting data to the central part of the

The first closed circuit 6 and the second closed circuit 7 described above are provided independently from each other, but the lower end of the second closed circuit 7, that is, the heat receiving part, is close to the upper end of the first closed circuit 6, that is, the heat radiating part. Therefore, the thermal resistance in the area between the two is small, and the heat dissipation capacity is almost the same as that of a heat pipe that is continuously installed on the side and top surfaces of a conventional electronic device case. Obtainable.

Especially in the case of the electronic device casing according to the present invention, as mentioned above,
The first closed circuit 6 and the second closed circuit 7 that constitute the heat pipe are independent, and by bending the part between them at an acute angle, the shape can be made into the same shape as a normal casing. , which has the advantage of being easy to manufacture.

In addition, in order to operate the second closed circuit 7 formed on the top surface 3 as a gravity heat pipe, the heat receiving part of the second closed circuit 7 must be placed below the heat radiating part. The upper surface 3 is given a slight inclination.

Further, FIG. 3 shows a second embodiment of the present invention, in which the upper surface 3 of the casing 1 has a planar shape inclined to one side, and a single second embodiment is provided on the upper surface 3. A closed circuit 7 is provided.

The lower end of this closed circuit 7 is located near the upper end of the first closed circuit 6 formed on one side wall surface 2, and the heat generated in the heating element is transmitted by the first closed circuit 6. It is possible to release heat to the outside at the upper surface 3.

In the above embodiment, the first closed circuit 6 is provided on the side wall surface of the casing 1, but the heating element mounting surface 4 and the heat pipe for directly receiving heat from the heating element and transmitting it to each part are shown. The first closed circuit constituting the circuit can also be provided on the back surface of the housing 1.

In this case, the second closed circuit that continues to the first closed circuit is formed inside the upper surface of the housing 1, which slopes from the front end to the rear end and is continuous to the back of the housing. It turns out.

In addition, in the case of the electronic device according to the present invention, as shown in the above embodiment, the first closed circuit 6 and the second closed circuit 7 are provided on the side wall surface 2 and the top surface 3. It is also possible to provide a ventilation hole 8 in the portion, and fins can also be formed on a predetermined surface.

When the electronic device casing according to the present invention is used, there is no need to provide a block-shaped heat sink or the like to dissipate heat from elements such as back transistors as in the past, and the internal space of the electronic device is not occupied by the heat sink. There is no.

Therefore, this invention not only contributes to the miniaturization of electronic devices, but also
Since the entire surface of the casing has excellent heat dissipation, it can be expected to improve the performance and reliability of electronic devices.

In addition to these points, it is easier to process and has a simpler structure than conventional electronic device housings with heat pipes, and there is less difference in shape from regular housings, so it can be used for various electronic devices. It has the advantage that it can be implemented as a device casing, and electronic devices using this casing can be easily handled.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an example of a conventional electronic device casing, FIG. 2 is a perspective view of an embodiment of an electronic device casing according to the present invention, and FIG. 3 is a perspective view showing another embodiment of the present invention. FIG. Explanation of symbols of main parts 1... Housing, 2...
...Side wall surface, 3...Top surface, 4...Heating element mounting surface, 5...Heating element, 6...
・First closed circuit, 7...Second closed circuit.

Claims (1)

[Scope of utility model registration request] A casing of an electronic device including a heat generating element, wherein an upright wall surface of the casing is provided with a heat generating element mounting surface for the heat generating element at a base portion thereof, and a predetermined area other than the heat generating element mounting surface. A first heat pipe consisting of a first closed circuit holding a working fluid is provided, and one end is disposed adjacent to the upper end of the first closed circuit on the upper surface of the housing. A casing for an electronic device, characterized in that a second heat pipe is provided which is connected to a second closed circuit that holds a predetermined working fluid.