JPS584395A - Cutting jig for sheet film - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of cutting and punching holes in a thin film material made of metal, paper, or plastic having a thickness of 100 μm to 2 μm. ,
The purpose of hole punching is to provide a jig that eliminates the occurrence of cracks. In conventional cutting and hole punching, as shown in Figure 1,
Minimize the clearance 3 between punch 1 and die 2 as much as possible/
The thin film 4 was being cut using the JS cutter setting. However, when the thickness of the thin film 4 is 10 μm, for example, even if the clearance 3 is set to 1 μm or less, there is a drawback in that cracks occur.

The present invention solves the above-mentioned conventional drawbacks, and one embodiment thereof will be described below with reference to FIGS. 2 and 3.

6 is a cutting punch made of die steel or similar tool steel, and 6 is an opposing slope die. 7 is the thin film material to be cut, 8 is the sloped surface of the sloped die 6, and 9 is the edge portion of the cutting punch 6 that comes into contact with the sloped surface 8.

In the above configuration, the thin film material 7 is placed between the gradient die 6 and the cutting patch 6, and when pressed from above the cutting punch 5, the thin film material 7 is sandwiched between the edge portion 9 and the gradient surface 8 to form the edge portion. 9 and the inclined surface 8 come into contact, the thin film material 7 is cut into the shape of the cutting batch 5. Therefore, the cutting punch 6 and the gradient die 6 are, as in the conventional example,
There is an advantage that the thin film material 7 is cut without having an extremely small clearance 3, and no hole punching occurs.

The angle 1o of the slope surface 90 is optimally between 25 and 50, and the dimension 11 with respect to the edge portion 9 is 1 of the thickness of the thin film material 7.
The range up to 00x is the area where cutting and punching do not occur. That is, FIG. 4 is obtained by arranging the angle 1o of the sloped surface 9 of the die and the par height after cutting.

In the above embodiment, the slope die 6 has a sloped surface, but the sloped surface may be in a spherical state, and as shown in FIG. If it is less than 25 degrees, the paring height is large, so a structure in which they contact at 25 to 5 degrees is sufficient, and edge wear due to contact between the edge and the die can be solved by keeping the punching and pressing force constant.

As described above, according to the present invention, it is possible to eliminate the cutting and punching process that inevitably occurs during cutting and punching press processing.

[Brief explanation of drawings]

Fig. 1 is a sectional view of a conventional die, Fig. 2 is a sectional view of a die in an embodiment of the present invention, Fig. 3 is an enlarged sectional view of the main part during the same cutting, and Fig. 4 is a paris height and slope angle. It is a relationship diagram. 5 *, **** Cutting punch, 5 @116116+
1 slope die, 8... slope surface, 9 battle-Φ...
Name of ETSU Department 0 agent: Patent attorney Toshio Nakao and one other person Figure 1 @ Figure 3 4!51 Da7s QK Makita

Claims (1)

[Claims] A thin plate film consisting of a cutting punch supported so as to be movable up and down, and a die, the surface of which faces the edge of the cutting punch, having a sloped surface forming an angle of 26 to 5 degrees with respect to the direction of the vertical movement of the punch. Cutting jig 0