JPS5843840Y2 - Amplifier heat dissipation structure - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a heat dissipation structure for an amplifier, which is devised to improve the internal heat dissipation effect of an electrical device such as an audio amplifier.

Conventionally, electric devices such as audio amplifiers use power amplifying transistors and integrated circuits, and have built-in heat sinks for heat dissipation, but because they are located inside the device, the heat dissipation effect is not necessarily sufficient.

In order to enhance this heat dissipation effect, it is conceivable to integrate the top plate and heat sink of both types of amplifiers that are open from the top.
A heat sink having such a shape has the disadvantage of being expensive.

As shown in FIG. 1, the semiconductor 13 on the printed circuit board 14
Apply silicone grease 8 to the upper surface of the heat sink 9 with an inverted cross section attached to it, and form a screw hole.A mounting hole is formed in the top plate 10 of the top plate 10 of the double-sided amplifier 4, which is open at the top. It is conceivable to combine the heat sink 9 with the heat sink 9, but this has the drawback that the screw heads are visible on the top plate, resulting in a loss of elegance in terms of design, and the drawbacks are that additional screw materials and installation man-hours are required.

The present invention was devised to eliminate the above-mentioned drawbacks, and to explain the embodiment shown in the drawings, as shown in FIGS. A taper 3 is formed on one or both sides of the upper tip 2 of the heat sink 1 with an inverted cross section, and a U-shaped upper and lower base are formed on the inside of the upper end of the front chassis of the double-sided amplifier 4 that is open at the top. A top plate 5 in which a top plate mounting hole is provided in the chassis, the tip is inserted between the U-shaped upper and lower bottoms, the rear end is L-shaped, and screw holes are provided in the L-shaped part. A lower bottom 7 of a concave portion with a taper 6 of the same shape is formed on the inner edge so that the heat sink tip 2 is sandwiched and pressure-bonded to the inner surface, and a thermal conductive agent such as silicone grease is applied between the heat sink tip 2 and the inner edge of the lower bottom 7. This is a heat dissipation structure of an amplifier formed by coating and filling 8.

The present invention has the above structure, so the lower part of the heat sink 1 is attached to the lower chassis, the top plate 5 is pushed in from behind the amplifier 4, and the tip is inserted between the U-shaped upper and lower bases. At the same time, the heat sink tip 2 is attached to the inner edge of the inner bottom bottom 7.
The rear end of the L-shape is clamped and pressure-welded, and the L-shaped rear end is screwed to the rear chassis with screws 11.The installation is simple and inexpensive, and there is nothing on the top surface of the thick base, making it a good design. It is also graceful.

Moreover, since the taper at the tip of the heat sink is in pressure contact with the taper at the lower inner edge of the inner surface of the top plate, the heat conduction area becomes wider, the heat radiation of the heat sink increases dramatically, and the heat radiation effect increases significantly.

As shown in FIG. 5, the present invention includes a heat sink having tapers 12 on both sides of the tip.

[Brief explanation of the drawing]

Fig. 1 is a cross-sectional view of the improved heat dissipation effect of the amplifier, Fig. 2 is a cross-sectional view of the heat dissipation structure of the amplifier of the present invention, Fig. 3 is a perspective view of the top plate of the present invention, Fig. 4 is a perspective view of the heat sink of the present invention, and Fig. 5 This is a structural diagram of the top plate and the tip of the heat sink. 1.9 is a heat sink, 2 is a tip, 3, 6.12 is a taper, 4 is an amplifier, 5, 10 is a top plate, 7 is a bottom, 8 is a thermal conductive agent, 11 is a screw, 13 is a semiconductor, 14 is Printed board.

Claims (1)

[Scope of utility model registration request] A taper 3 is formed at the upper tip 2 of the heat sink 1 with an inverted cross section, and a taper 6 of the same shape is formed at the inner edge so that the tip 2 of the heat sink 1 is sandwiched and pressure-welded to the inner surface of the top plate 5 of the upper open type amplifier 4. The heat dissipation structure of the amplifier is formed by shaping the lower base 7 of the four parts, and applying and filling a thermal conductive agent 8 such as silicone grease between the heat sink tip 2 and the inner edge of the lower base 7.