JPS584255A - Charged-beam optical mirror tube - Google Patents

Charged-beam optical mirror tube

Info

Publication number
JPS584255A
JPS584255A JP56101449A JP10144981A JPS584255A JP S584255 A JPS584255 A JP S584255A JP 56101449 A JP56101449 A JP 56101449A JP 10144981 A JP10144981 A JP 10144981A JP S584255 A JPS584255 A JP S584255A
Authority
JP
Japan
Prior art keywords
deflection
center
charged
lens
image
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56101449A
Other languages
Japanese (ja)
Inventor
Tadahiro Takigawa
忠宏 滝川
Kanji Wada
和田 寛次
Mamoru Nakasuji
護 中筋
Shunichi Sano
俊一 佐野
Izumi Kasahara
笠原 泉
Kazuo Tsuji
和夫 辻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Shibaura Machine Co Ltd
Original Assignee
Toshiba Corp
Toshiba Machine Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Toshiba Machine Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56101449A priority Critical patent/JPS584255A/en
Publication of JPS584255A publication Critical patent/JPS584255A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/04Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/147Arrangements for directing or deflecting the discharge along a desired path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Electron Beam Exposure (AREA)

Abstract

PURPOSE:To provide a charged-beam optical mirror tube which can perform planking, shaping and the like of a charged beam effectively without any need of a lens or the like used for imaging a cross-over image at the deflection center of the deflectors. CONSTITUTION:A first cross-over image (Q1) is formed above a capacitor lens 31 by means of an electron gun, a capacitor lens or the like, and is imaged on a planking aperture mask 32 by means of the lens 31. A first and a second deflecting plate 33 and 34 used for planking are provided, respectively, over and under the aperture mask 32. In addition, the deflection center of the deflecting plates 33 and 34 is made to correspond to the constant position of the center of a second cross-over image (Q2). Owing to the above constitution, since the deflection center of an electron beam deflected with the plates 33 and 34 always corresponds to the constant center of the second cross-over image (Q2), any such inconvenience that the beam moves over a sample surface 33 during the planking is prevented. Besides, any lens used for forming a cross-over image at the deflection center of the plates 33 and 34 becomes unnecessary.

Description

【発明の詳細な説明】 本発明は、電子ビーム露光懐置中イオンビーム露光装置
等の荷電V−ム装置に用いられる荷電ビーム光学鏡筒O
改良に関すゐ。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a charged beam optical lens barrel O used in a charged beam device such as an ion beam exposure device during electron beam exposure.
Regarding improvements.

近時、半導体り、ハヤマスク基板等O試料に微細Aター
ンを形成す為ものとして電子V−ム露光装置が−a畜れ
ているが、ζO装置に用いられ為電子V−ム党学鏡曽一
番うては、そのデテンキyダ機構およびV−ム整廖機構
に以下に述べ為如龜岡慝が番やえ。
Recently, electron beam exposure equipment has become popular for forming fine A-turns on O specimens such as semiconductor and mask substrates. Most importantly, the detente mechanism and V-mechanism mechanism are explained below.

第1■はtラン中y1機箇を備えた従*O電子V−ム党
学鏡曽を示す概略構成■で参る。図中1は;ンデンナレ
ンオ、2はデツンキyダ用偏向板、Jaデツンキンダ層
アΔ−チャマスク、4は対物レンズ、lは試料間である
。ζO場金、レンズIKよ)偏肉@jo偏崗中心にり■
スオ+ 、t @ pを形成している。し九がって、ツ
ツンキング時には偏崗板jKよ珈電子C−ムを図中破−
で示すように偏向すれば、クースオーバー儂Pを移動さ
せるしとなく、すなわち試料11ij上で?−ムO$動
を俸うことなくそ0強度を絨少1せゐことがで11為。
The first part (2) is a schematic configuration (2) showing a sub-*O electronic V-m party school with one machine in the T run. In the figure, 1 is an optical axis, 2 is a deflection plate for the detuning sensor, a Δ-aperture mask for the detuning layer, 4 is an objective lens, and 1 is a space between samples. ζO place money, lens IK) uneven thickness @jo uneven thickness center ■
Suo + , t @ p is formed. Therefore, when tsutsuking, the polarizing plate jK and the electronic C-m are destroyed in the diagram.
If it is deflected as shown in , it is possible to move Kusuover's P, that is, on the sample 11ij? - It is possible to reduce the strength by a little less without increasing the amount of movement.

第意閣はぜ一^**機能を備え九従来O電子ビーム光学
鏡曽を示す概略榔威閣である。図中Iは第1mンテンナ
レンオ、rは第1v−ム整形層アノ−チャマスク、1は
第2コンテ:/ナレンズ、9はビーム整形用偏向板、1
−は嬉2f−ム整形用アΔ−チャマスタ、11は館3コ
ンデンナレンズ、12はV−ム位置決め用偏向板、IJ
は対物レンズ、14は試料面であ為。また、デ、〜P4
はそれぞれ第1乃至第40タワスオ−d像を示している
。ζO場合、レンズ#、#によ)偏向板90偏向中心に
第3タースオ=d像Psが形成される。そして、偏向板
りKよ〕電子C−ムを偏向し、l11v−ム整形用アΔ
−チャマスタ1の像を82ビームIk形用アΔ−チャマ
スタ1eK対してずらすことkよ〕、電子C−ムの形状
および寸法を可変することがで自る。
The third cabinet is a schematic diagram showing the nine conventional O electron beam optical mirrors equipped with one^** function. In the figure, I is the 1st m antenna lens, r is the 1st vm shaping layer ano-cha mask, 1 is the second container lens, 9 is a deflection plate for beam shaping, 1
- is the armature master for 2F-m shaping, 11 is the third condenser lens, 12 is the deflection plate for V-m positioning, IJ
is the objective lens, and 14 is the sample surface. Also, De,~P4
show the 1st to 40th Tawasaud images, respectively. In the case of ζO, a third turret image Ps is formed at the center of deflection of the deflection plate 90 (by lenses # and #). Then, the electron C-arm is deflected by the deflection plate K, and the l11v-arm shaping arm Δ
- By shifting the image of the channel master 1 with respect to the 82-beam Ik type armature master 1eK], the shape and dimensions of the electron beam can be varied.

ここで、上記偏向1[りの偏向中心にり胃スオーΔ像が
ないと、V−ムの形状中寸法曽を変えたと自に試料*1
4に照射されゐV−ムの強度が変動すゐ。それ故、りp
スオーd像?、を偏向板tの偏向中心に形成してい石の
である。
Here, if there is no gastric suo Δ image at the center of deflection 1 above, it is assumed that if the shape of V-mu is changed, the sample *1
4, the intensity of the V-me irradiated varies greatly. Therefore, rip
Suor d statue? , is formed at the deflection center of the deflection plate t.

とζろで、第1図および第!IIK示し良電子ビーム光
学鏡筒にありては偏向1[O偏向中心にである。ヒOえ
めタ票スオーΔ像を偏向板の偏向中心に結像するレンズ
−必要とな)、装置構成の複雑化を拓く。畜らに1光学
系によりて線偏向4[O偏向中心タースオー/#儂を結
像で龜傘い鳩舎があ)、ζO場会曽遮しぇtランキング
1およびV−ム葺形を効果的に行うむとはで1iない。
and ζro, Figure 1 and Figure 1! In the case of a good electron beam optical column shown in IIK, the deflection is 1[O at the center of the deflection. A lens is required to form an image on the center of deflection of the deflection plate, which opens up the complexity of the device configuration. In addition, the optical system is used to deflect the line 4 [O deflection center 30 / # I is imaged and there is an umbrella pigeon house), ζ O position shielding t ranking 1 and V - effective form of the roof. It is not 1i to do it.

まえ、この110党学鏡筒では偏肉1[Kよる′偏肉感
度が比較的小さい丸め、電子ビーム鍮両速度を高速化し
得凍い等の間層があう九。&お、上述し大壷問題は電子
V−ム光学鏡@0みならず、イオンーーム鏡筒′鏡曽に
ついても云える仁とであ為。
First, in this 110-dimensional lens barrel, the sensitivity of thickness deviation due to K is relatively small. &Oh, the above-mentioned large pot problem is not only true for the electron beam optical mirror @0, but also for the ion beam mirror.

本−―線上記事情を考慮して1に畜れえもので、その目
的とす為とζろは、偏肉IIの偏向中心にタースオーΔ
像を結像すゐためのレンズ等を要することなく、荷電C
−^t)fランキングおよびビームIl形等を効果的に
行うことができ、装置構成O筒略化および偏向感度の向
上を社か夛得る荷電♂−ム光学鏡曽を提供することにあ
る。
Main line - Considering the above circumstances, it is a beast to 1, and its purpose is to set the center of deflection of uneven meat II at the center of deflection Δ.
Charge C without requiring a lens etc. to form an image.
-^t) It is an object of the present invention to provide a charged electron beam optical mirror which can effectively perform f-ranking, beam Il shaping, etc., simplify the device configuration, and improve deflection sensitivity.

まず、本発明の詳細な説明する。本実9I!O骨子は、
少なくとも2組の偏向器をタロスオーパ像等の物点を挾
んで配置し、壷偏陶器で荷電C−ムを偏向し九と亀の物
点O位置が等目的に偏向する前の位置と一歇するように
しえ40″esする。′:)壕シ、第3図に示す如くタ
ースオーΔ僚Qを挾んで上側に嬉10偏肉器11を、下
側に第2の偏向器2jを配置し、第10偏向器21でビ
ームを一方向(紙爾左方向)K偏向すると共に、第20
偏向器21でビームを上記と同方向に偏向する。そして
、第20偏向器12を介し九ビームの延長線(図中破線
で示す)が前記り四スオーΔ像Qの定常位置中心と接す
るように1偏向器11.11の各偏向量を調節する。
First, the present invention will be explained in detail. Honji 9I! The O-bone is
At least two sets of deflectors are arranged to sandwich an object point such as a Talos Opa statue, and the charged C-m is deflected with a biased pottery, so that the position of the object point O of Nine and Tortoise is the same as the position before being deflected to the same objective. In the trench, as shown in Fig. 3, the 10th deflector 11 is placed on the upper side, and the second deflector 2j is placed on the lower side, sandwiching the Tarsuo Δ force Q. , the beam is deflected in one direction (to the left) by the tenth deflector 21, and the beam is deflected by the tenth deflector 21.
The beam is deflected by the deflector 21 in the same direction as above. Then, the amount of deflection of each of the first deflectors 11 and 11 is adjusted so that the extension line of the nine beams (indicated by broken lines in the figure) touches the center of the steady position of the four-wave Δ image Q through the 20th deflector 12. .

これKより、実際のり費スオーΔ像q′カ偏向前のクロ
スオーバIIQの位置よ〉左方肉にずれているKも拘わ
らず、C−ム観橢面21から見るとビームはあたかも偏
向前のクロスオー/f儂Qから放出されたように見える
。すなわち、セームの偏向中心が常にタロスオーΔ像Q
の定常位置中心に存在することKする。
From this K, the position of the crossover IIQ before the actual beam swarm Δ image q' is deflected. Despite K being shifted to the left, when viewed from the C-m viewing surface 21, the beam is as if it were before the deflection. It appears to have been emitted from Cross-O/f's Q. In other words, the deflection center of the chame is always the Talosau Δ image Q
K exists at the center of the steady position of.

本発明はこのような点に着回し、り四スオーΔ像十アー
ーデヤ儂等O物点を挾んアナなくともi!親の偏向器を
配置し、これらO偏向器によ〕荷電C−ムをそれヤれ同
方向に偏向制御す為と共に、上記各偏向Sを介し九荷電
曾−ムの偏肉中心を上記物点O定常位置中心に設定する
ようKしえものである。し丸がりて零発11によれば、
tラン午ンダ中ビーム整形勢〇九め荷電ビームを偏向し
たとしても、ζO偏向に俸い試料面上でビームが移動す
ることがない。このため、ブランキング中V−ム整形を
効果的に行い得る。
The present invention is applicable to such points, and it is possible to interpose the four points, Δimages, ten points, etc. A parent deflector is arranged, and in order to control the deflection of the charged C-m in the same direction by these O deflectors, and to control the deflection of the charged C-m in the same direction, the uneven thickness center of the nine charged C-m is controlled to be It is possible to set the point O at the center of the steady position. According to Shimarugarite Zero Hatsu 11,
Even if the charged beam is deflected during beam shaping during the t run, the beam will not move on the sample surface due to the ζO deflection. Therefore, V-me shaping can be effectively performed during blanking.

しかも、タ■スオーパ像やアノ−チャ像を偏向器の偏向
中心に形成す為丸めのレンズが不要となるので、装置構
成の簡略化をはか夛得る。まえ、2組以上の偏向器を用
いビームをII)増しするようにしているOで、偏向感
度を大暑(することがでIIi為、これは、高電圧電f
ビーム露光錬置中イオンビーム露光装置#にありては描
画適度の大幅な高速化Ki&が〉極めて有効である。
Moreover, since a tassel image or an aperture image is formed at the center of deflection of the deflector, a round lens is not required, so that the device configuration can be simplified. First, two or more sets of deflectors are used to increase the beam size.
In the case of the ion beam exposure apparatus # during beam exposure processing, it is extremely effective to significantly increase the writing speed Ki&.

以下、本発明の詳細を図示の実施例によって説明する。Hereinafter, details of the present invention will be explained with reference to illustrated embodiments.

第411は本発明を電子ビーム露光装置に適用し九−実
施例を示す概略構成図である。図示しない電子銃および
ゴンデンナレンズ41によ);ンデンナレ71110上
方KIIEIり胃スオーΔ像Q、が形成され、ζOクロ
スオーΔ像q、はレンズlllICよ)プラン午ンダ用
アΔ−チャマスタ1j上に結儂される。アノ−チャマス
タJ1を挾んでその上方および下方にはブランキング用
01111および第20偏向@11.14がそれぞれ配
置されている。とれらの偏向@11.14紘インタフェ
ース11を介し良計算機1#からO指令によシそれぞれ
計算機制御される。つ壜)、ブランキング時に所定の偏
向電圧を印加され、電子ビームをそれぞれ同方向に偏向
すると共に1その偏向中心をアパーチャマスタJ1上の
第2り胃スオーΔ像q、の定常位置中心と一致せしめる
ものとなっている。第1および第2の偏向板s1.I4
を介し良電子C−ムは対物レンズJfKよ)lE車畜れ
試料璽J1上に照射投影されるatお、第4閣中Jりは
ビーム位置決め用偏向板を示している。
No. 411 is a schematic configuration diagram showing a ninth embodiment in which the present invention is applied to an electron beam exposure apparatus. An electron gun and gondenna lens 41 (not shown) form an upper KIIEI gastric sweep Δ image Q, and a ζO cross-over Δ image q is placed on the planar lens Δ-cha master 1j. be united. A blanking 01111 and a 20th deflection @11.14 are arranged above and below the anorcture master J1, respectively. These deflections @11.14 are each computer controlled by the O command from the computer 1# via the Hiro interface 11. During blanking, a predetermined deflection voltage is applied to deflect the electron beams in the same direction, and align the center of the deflection with the steady position center of the ruminal swollen image q on the aperture master J1. It has become something to encourage. First and second deflection plates s1. I4
The electron beam is projected onto the objective lens JfK via the electron beam JfK.

このような構成であれげ、ブランキング時に第1および
1g5o偏肉@aa、14Fcそれぞれ所定の偏向電圧
を印加することによって、電子V−ムをアパーチャマス
ク12で値ぎることかでI!為。そしてこの場合、冬偏
向板13.84で偏向される電子ビームO偏肉中心が常
に第3り買スオーΔ像Q、0定當位置中心となるので、
ブランキング時に試料面J1上でビームが移動する勢O
不部会線ない、1え、偏向板I J 、140偏向中心
にクロスオーd像を形威すゐためOレンズが不要と&)
、これによ)構成O簡略化をはか〕得る等O効果を奏す
る。
With such a configuration, by applying a predetermined deflection voltage to each of the first and 1g5o uneven thickness @aa, 14Fc during blanking, the electron V can be overvalued by the aperture mask 12. For. In this case, since the center of the uneven thickness of the electron beam O deflected by the winter deflection plate 13.84 is always the center of the third scanning angle Δ image Q, 0 constant position,
The force of the beam moving on the sample surface J1 during blanking
There is no fubekai line, 1, deflection plate IJ, 140, since it forms a cross-over image at the center of deflection, an O lens is not required.
, this provides advantages such as simplifying the configuration.

なお、零発−は上述した実施例に限定されるものではな
い。例えば、1g41EIK示したタリティカル照明方
式O代)k1ケーラ照明方式のアーーチヤ横影蓋電子ビ
ーム露光装置に適用することもできる。この場合、物点
がアノ−チャ像となるので、アパーチャ儂を挾んで2組
の偏向板を配置すればよい。11九、−子ビーム露光羨
tK限ら子イオンビーム露光装置、その他各種の荷電V
−ム装置に適用すゐことができる。例えば、イオンビー
ム露光−置に適用しえ場合、前記第4図に示し九構成で
イオンビームの前記偏向板1Jから偏肉板J4★での走
行時間(100鵬−・C〜1μ―・@)を考慮して、1
1148m中破纏に示す如く遷延−路40を設ければよ
い。
Note that the zero firing is not limited to the above-mentioned embodiment. For example, the present invention can be applied to an Archier horizontal shadow lid electron beam exposure apparatus using a tertitical illumination method (O)k1 Koehler illumination method as shown in 1g41EIK. In this case, since the object point becomes an aperture image, two sets of deflection plates may be placed with the aperture in between. 119, -son beam exposure equipment, limited ion beam exposure equipment, and other various charges V
- Can be applied to system equipment. For example, when it can be applied to an ion beam exposure position, the travel time of the ion beam from the deflection plate 1J to the uneven thickness plate J4★ (100 P-・C~1μ-・@ ), 1
As shown in the 1148m middle break, a delay road 40 may be provided.

さらに1プランキンダOみならずV−ムの寸法および大
暑さを可蜜すJlv−ム整形に%適用するヒとができる
。こO場合、前記11!IIK示しえ構成で偏向1[#
の代夛に岡■中破線で示す2組の偏向板41.41或い
はZaO偏崗偏向41゜41を設けるようkすればよい
、tえ、ビームの偏向は偏向板に隈らず偏肉コイルを用
いてもよいのは勿論である。さらに偏向板或いは偏向コ
イルから1に石偏陶器は、前記物点を挾んで3組に限る
もので社なく、それ以上であってもよい、その−2本発
−はその要旨を逸脱しない範■で、種々変法して実施す
為ことができる。
In addition, it is possible to apply 1% to the size of not only Plankind but also V-mu and Jlv-mu plastic surgery. In this case, 11! Deflection 1 [#
As a substitute, two sets of deflection plates 41.41 or ZaO polarization deflection 41゜41 as shown by the dashed lines in the middle can be installed. Of course, it is also possible to use Furthermore, the number of stone-biased pottery from the deflection plate or deflection coil is limited to three sets sandwiching the object point, and there may be more than that, without departing from the gist of the matter. (2) Various modifications can be made to implement the method.

4.1111O簡単な説明 第imlおよび菖2■はそれぞれ従来の電子ビーム光学
鏡筒を示す概略構成図 ms図は零発fIの厚層を説明
するための模式図、第4図は零発−を電子V−ム露光装
置に適用した一実施例を示す概略構成図である。
4.1111O Brief Explanation No. iml and irises No. 2 (2) are schematic configuration diagrams showing conventional electron beam optical lens barrels, respectively. MS diagram is a schematic diagram for explaining the thick layer of zero-firing fI, and FIG. 1 is a schematic configuration diagram showing an example in which the method is applied to an electronic V-me exposure apparatus.

zl、sx−偏向器、xi−hンデンナレンズ、12−
アノ−チャマスタ、11.J4・・・ツツン命ンダ用偏
崗板、1i−インタフェース、J#・・・計算機、JP
一対物しyJe%J#−試料爾、[ト・ビーム位置決め
層偏肉器、4m−・遷延回路、41 、41 、4 J
−f−h%’fil用傭肉板 出用人肉板人  弁履士 麹 江 武 彦才1図 才2図 才3図 矛4WJ 第1頁の続き 0発 明 者 辻和夫 ■出 願 人 東芝機械株式会社 東京都中央区銀座4丁目2番11
zl, sx-deflector, xi-h ndenna lens, 12-
Anocha Master, 11. J4...Polarizing plate for Tsutsun orderer, 1i-interface, J#...Computer, JP
One-objective yJe%J#-sample, [to-beam positioning layer unevenness device, 4m--prolongation circuit, 41, 41, 4 J
-f-h%'fil mercenary board for mercenary board Bentorishi Takeshi Kojie Hikosai 1 figure 2 figure 3 figure 4 WJ Continued from page 1 0 Inventor: Kazuo Tsuji ■ Applicant: Toshiba Machine Co., Ltd. 4-2-11 Ginza, Chuo-ku, Tokyo

Claims (2)

【特許請求の範囲】[Claims] (1)  物点を試料藺止に結像し諌試料W!に荷電ビ
ームを照射すゐ荷電V−ム光学傭曽において、上記物点
を挾んで少なくとも雪層O個陶器を配置し、これらO偏
向器によ)上記荷電C−ムをそれぞれ同方向に偏向せし
め、上記各偏向器を介し九荷電−−ムO偏向中心を前記
物点O電電位置中心に設定し九ことを特徴とする荷電ビ
ーム光学鏡筒。
(1) Focus the object point on the sample and capture the sample W! In a charged V-me optical system that irradiates a charged beam onto a charged beam, at least O snow layers are placed between the object points, and these O deflectors deflect the charged C-me in the same direction. 9. A charged beam optical lens barrel characterized in that the deflection center of the charged beam is set at the center of the electrical position of the object point via each of the deflectors.
(2)  前記物点は、タ冒スオーΔ像或い拡アΔ−チ
ャ偉であることを特徴とする特許請求O範fil11項
記載の荷電C−ム光学鏡筒。5
(2) The charged C-me optical lens barrel according to claim 11, characterized in that the object point is a vertical scan Δ image or an enlarged Δ-cha image. 5
JP56101449A 1981-06-30 1981-06-30 Charged-beam optical mirror tube Pending JPS584255A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56101449A JPS584255A (en) 1981-06-30 1981-06-30 Charged-beam optical mirror tube

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56101449A JPS584255A (en) 1981-06-30 1981-06-30 Charged-beam optical mirror tube

Publications (1)

Publication Number Publication Date
JPS584255A true JPS584255A (en) 1983-01-11

Family

ID=14300993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56101449A Pending JPS584255A (en) 1981-06-30 1981-06-30 Charged-beam optical mirror tube

Country Status (1)

Country Link
JP (1) JPS584255A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62177849A (en) * 1986-01-30 1987-08-04 Jeol Ltd Focusing ion beam device
US6987265B2 (en) 1997-08-07 2006-01-17 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
JP2009016360A (en) * 2008-10-20 2009-01-22 Hitachi Ltd Inspection method and device using electron beam

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62177849A (en) * 1986-01-30 1987-08-04 Jeol Ltd Focusing ion beam device
US6987265B2 (en) 1997-08-07 2006-01-17 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
US7012252B2 (en) 1997-08-07 2006-03-14 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
US7232996B2 (en) 1997-08-07 2007-06-19 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
US7439506B2 (en) 1997-08-07 2008-10-21 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
US8134125B2 (en) 1997-08-07 2012-03-13 Hitachi, Ltd. Method and apparatus of an inspection system using an electron beam
US8604430B2 (en) 1997-08-07 2013-12-10 Hitachi, Ltd. Method and an apparatus of an inspection system using an electron beam
JP2009016360A (en) * 2008-10-20 2009-01-22 Hitachi Ltd Inspection method and device using electron beam
JP4548537B2 (en) * 2008-10-20 2010-09-22 株式会社日立製作所 Inspection method and inspection apparatus using electron beam

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