JPS5842221A - Method of producing electronic part - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for manufacturing an electronic component constituting an L% medium cap type external electrode.

Conventionally, electronic components such as resistors and capacitors that constitute an external electrode tube using a cap method have been generally mounted as shown in FIG. 1.

That is, the electronic part A in which the m antibody is formed in the capacitive electrode
A conductive material such as silver paste is applied to both end faces of the O base material, and external electrodes are attached to both end faces of the base material through baking. Next, fit a gold mII cap with a lead wire so as to handle the external electrode parts on both end faces, roll the cap and the external electrode part together, apply FutsTM cloth and solder, and wash and remove the II metal. After that, the finished product is painted with silicone 1tflIk in epoxy resin.

However, in step +i1, when soldering the external electrode parts of both base materials and the gold a pseudo-middle part with lead wires attached thereon, the soldering process is performed in advance by I
kl/s″stL9 funx invades the base material 1@ due to high heat, etc., as shown in stm, and washes l&l
In some cases, it remains as a residual mark even after the test is carried out, and this is a cause of deterioration of the characteristics of electronic parts.

In the case of the base material 1 in which a conductive material mainly composed of silver is formed as an external electrode in the trench 9, the conductive material 2 on both end faces of the trench 7 is soldered to the metal cap 3 having the lead wire 4. When soldering, there is a tendency for it to diffuse and migrate into the solder, and in some cases, a large amount of the conductive material 2 diffuses and dissolves into the solder, causing it to lose its function as a conductive material 2 and lose its properties when soldered. There are six and nine drawbacks that seriously hinder it.

The method of the present invention eliminates the conventional soldering process and the accompanying flux application process, and applies a conductive material such as silver pot paste to both end surfaces of the base material of the electronic component as described above. Alternatively, a conductive material tm cloth made of silver-in-copper paste or the like is placed inside the metal cap in advance, and both *ruc of the above-mentioned base material are attached.
0 to 70 GTO An object of the present invention is to provide a method for manufacturing an electronic component in which the conductive material is baked in a neutral or reducing atmosphere, and the conductive material on both end surfaces of the base material is fixed to the cap. It is said that

Next, the steps according to the present invention will be explained with reference to FIG.

First, the base material is a cylindrical, cylindrical, prismatic, and other Cefmic material that has been given a capacitance Ii (not shown) and annealed. Tin salting is done.

Next, external electrodes are formed on both ends of the base material, and
Secure the metal cap with the lead wire.

This is done in order to ensure complete electrical connections with peripheral components when mounting on an electronic device.

In this work, the external electrode and gold s! 11! As one method for forming a cap on a base material, a conductive material such as silver-in-copper paste is applied to both ends of the base material in a required amount 1, and a 6<y-d wire is placed so as to cover the conductive material. Another method is to attach the lead wire directly to the metal cap tube.
A method is used in which a required amount of a conductive material such as silver or copper paste is applied and caps are attached to both ends of the base material.

Next, the conductive material constituting the external conductor 11ji is baked in a partial layer, but in this @Mei, the conductive material is baked in a neutral or l1 elemental atmosphere at 600 to 700°C. What is done inside is called % mold.

When roasting the above-mentioned conductive material tube in a furnace, this salt mountain property and baking are generally □ 4! P! 'Temperature is 600~G6@'C (D range"e
This is because if I& is heated in the atmosphere in this temperature range, the cap and lead wires attached to the conductive material will be oxidized, and the conductivity will be severely reduced.

In addition, if the conductive material is baked in a reducing atmosphere with a neutral powder at a temperature of 700C or higher, the above oxidation can be prevented, but this time the base material made of barium titanate etc. is reduced and loses its dielectric properties. This is because there will be a chance to develop semiconductors.

Therefore, the baking process of the conductive material that will become the external electrode according to the method of the present invention is slowed down by the suppression of the oxidation and reduction reactions mentioned above.
It is carried out in a neutral or reducing atmosphere at 00 to 700°C.

4th FI! AIl'i shows the above-mentioned embodiment of the present invention.
A cap 8 made of gold lI4 having a weight of l1 kg is attached, and the electrically conductive material 20 is baked in a furnace 5 for baking in a yoocoit atmosphere.
0 is obtained.

(Previously, in the same way), 2 amounts of conductive material made of gold 5Ill now Yappu Hatauchi Kflk paste with lead wire 4 was placed in advance, and then the shell cap 8 was attached to the tube base material 1 and torn, and Ots as above. The figure shows one square in which the electrically conductive material was baked in a furnace to obtain the electronic component 10 shown by O in the figure.

As described above, in the method for manufacturing electronic components of the present invention, the baking of the conductive material made of medium steel paste or the like at both ends of the base material is sometimes performed by simultaneously making the base material and the metal cap K11llll,
Electronic components are formed using a cap method, and the soldering process required in the conventional method is omitted, resulting in 94 steps.

Therefore, it is possible to omit the flux application and flux cleaning process that accompany soldering, resulting in a significant cost reduction.

In addition, the soldering process eliminates any troubles that may lead to quality deterioration caused by the soldering process, flux application, cleaning process, etc., making it possible to widely supply electronic components of stable quality.

[Brief explanation of the drawing]

Figure 1 is a process diagram of the conventional method for manufacturing electronic components, Figure 2 is a diagram showing 111 squares of the manufacturing process using the conventional cap method, and Figure 3 is a process diagram of the method of manufacturing electronic components of the present invention. Figures 1 and 4 are diagrams showing mm in the manufacturing process of this invention. l... Base material, 2... Conductive material 1, 8... Cap, 5... Baking 1 furnace. Patent applicant Murata Manufacturing Co., Ltd. Agent Patent attorney Kazu 1) Sho

Claims (1)

[Claims] # of electronic components made by attaching metal caps to opposite ends of the base material! In the remote method, a conductive material is applied to both end surfaces of the base material in advance and a metal cap is attached to the front and back, or a conductive material is applied to the inside of the gold JIk inner cap and a metal cap is attached to both end faces of the base material beforehand. After applying the conductive material to both end surfaces of the base material and placing a metal cap over the conductive material,
A method for manufacturing an electronic component, characterized in that a neutral trout of SOO to 700° C. is heated in a reducing atmosphere to bake the conductive material and to fix the base material and the metal cap. .