JPS5834935B2 - Semiconductor wafer testing probe - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a probe used for testing semiconductor products such as ICs and LSIs.

Conventionally, the test electrodes in semiconductor wafer chips have been arranged along the periphery of the chip as shown in Figure 1, so the probe tips are very close to each other with a spacing of less than 0.5 myn. Even when the contact state between the tip of the probe and the semiconductor electrode was visually confirmed from above the substrate.

However, recently, with the increase in the number of electrodes on a semiconductor chip, electrodes are arranged regularly or irregularly not only on the periphery of the chip, but also over the entire surface of the chip, including the center of the chip, as shown in Figure 2. New ideas are being devised.

The object of the present invention is to provide a probe for testing semiconductor wafers equipped with such electrodes.

Embodiments of the present invention will be described below with reference to the drawings.

Fig. 3 shows a sectional view of the embodiment of the present invention, Fig. 4 is an enlarged view of the main part of Fig. 3, Fig. 5 is a sectional view taken along the line ■-■ of Fig. 4, and Fig. 6 shows the embodiment of Fig. 3. Each shows a partial view of the plan view.

The overall structure consists of forming a circular hole 2 and a step 3 in the center of a substrate 1, adhering a probe mounting ring 4 to the step 3, and attaching probes 5...5 to the mounting ring 4. support as described below,
External connection terminals (not shown) are provided on the periphery or top surface 6 of the substrate 1, and the external connection terminals are connected to the conductors 7...7 on the substrate surface to which the bases of the probes 5...5 are soldered. are connected to each other.

Note that 9 indicates a semiconductor wafer to be tested.

The general shape of the probe 5 is at the waist (on the base side of the V-V line)
It has a uniform thickness, and from there to the bending point B, it forms a tapered part that becomes thinner toward the tip, and the tip is bent forward into a hook shape.

Furthermore, as is clear from Fig. 4, a plurality of probes are attached in multiple layers forming parallel multilayer conical surfaces in the axial direction of the mounting ring, and the inner layer (layer close to the mounting ring) The tip of the probe attached to the semiconductor chip is longer than the tip of the probe attached to the outer layer, and the tip of the probe attached to the inner layer mainly contacts the electrode provided in the center of the semiconductor chip. However, the probe attached to the outer layer mainly contacts electrodes provided at the periphery of the semiconductor chip.

In such an arrangement state, when looking at the semiconductor chip from the back side of the circuit board, as shown in C of FIG.
The probes are arranged so that the tip positions of the probes can be visualized.

The method for attaching such probes is to apply adhesive once on the mounting ring 4 and fix the probe with the long tip to form the innermost probe group in a radial pattern, and then attach the probe on top of it. By applying adhesive again to fix the probe with a shorter tip, and then applying adhesive on top of that to fix the probe with an even shorter tip, as shown in Figures 4 and 5. As shown in the figure, a structure in which the probes 5 are embedded and fixed in the adhesive 10 is obtained.

The adhesive 10 is preferably an epoxy resin.

As a modified embodiment of the present invention, a second mounting ring is also provided around the back surface of the hole 2 of the substrate 1, and a probe fixed in a layer or multiple layers is attached to the mounting ring. In addition, as another modified embodiment, a blade made of a conductor is provided radially around the back surface of the hole 2, and a probe is soldered or brazed to the tip of the blade, in combination with a so-called blade type probe. It can be implemented by

According to the present invention, the probes are fixedly disposed radially in the circumferential direction of the mounting ring and in multiple layers in the axial direction using an adhesive,
Moreover, since the tip of the probe is made longer near the mounting ring, a large number of test terminal electrodes are distributed not only on the periphery of the semiconductor chip but also in the center, making it possible to create semiconductors with high circuit integration. It is possible to relatively easily and compactly manufacture a test probe in which a large number of probes are densely packed in a small area, which is used for chip testing.

Note that since the probe is fixed using adhesive, it is mechanically strong and there is no chance of the probe fixing part becoming loose.

Furthermore, the tips of the probes are arranged so that the tips of some of the probes can be seen from the back of the board.
If you establish correspondence between them and the test terminals of the semiconductor chip, no matter how large the total number of probes is, the alignment between the other probes and the test terminals will be completed automatically, improving work efficiency. do.

[Brief explanation of drawings]

FIG. 1 is an enlarged view showing an example of an electrode arrangement on a conventional semiconductor chip, and FIG. 2 is an enlarged view showing an example of an electrode arrangement on a semiconductor chip to which the present invention is applied. Fig. 3 is a sectional view of an embodiment of the present invention, Fig. 4 is an enlarged view of the main part of Fig. 3, Fig. 5 is a cross-sectional view taken along
Figure 3 shows a partial view of the top view of the embodiment; 1... Board, 2... Hole, 4...
・Probe mounting ring, 5... Probe, 9...
・Semiconductor wafer, 10...Adhesive.

Claims (1)

[Claims] 1.0) around the hole formed in the center of the circuit board,
A probe mounting ring is provided on one side of the circuit board, and a plurality of probes each having a circular cross-section and a tip bent forward relative to the waist are mounted on the mounting ring, and each tip of the probe is attached to the above-mentioned circuit board. The probes are held opposite the surface of the substrate on which the mounting ring is provided, and are mounted so as to contact each of the semiconductor electrodes to be tested, and the bases of these multiple probes are connected to external connection terminals. In this device, the probes are fixedly arranged in a layered manner using an adhesive to form a multilayer parallel conical surface radially in the circumferential direction of the mounting ring and in the axial direction, and the inner layer (on the mounting ring) The tips of the probes provided on the nearer layers are made longer than the tips of the probes provided on the outer layers, and the probes provided on the inside as a whole are provided in the center of the semiconductor chip. The probes provided on the outside in contact with the electrodes are in contact with the electrodes on the periphery of the semiconductor chip, and the tip positions of some of the probes are visible when the semiconductor chip is viewed from the back side of the hole in the circuit board. A probe for testing semiconductor wafers, characterized in that the probe is located at.