JPS5834190A - Plating liquid washing and collecting method - Google Patents

Plating liquid washing and collecting method

Info

Publication number
JPS5834190A
JPS5834190A JP12451781A JP12451781A JPS5834190A JP S5834190 A JPS5834190 A JP S5834190A JP 12451781 A JP12451781 A JP 12451781A JP 12451781 A JP12451781 A JP 12451781A JP S5834190 A JPS5834190 A JP S5834190A
Authority
JP
Japan
Prior art keywords
plating liquid
plating solution
cleaning
gold plating
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12451781A
Other languages
Japanese (ja)
Other versions
JPH0213037B2 (en
Inventor
Tadashi Hoshino
忠 星野
Yoshinori Noguchi
野口 好則
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12451781A priority Critical patent/JPS5834190A/en
Publication of JPS5834190A publication Critical patent/JPS5834190A/en
Publication of JPH0213037B2 publication Critical patent/JPH0213037B2/ja
Granted legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To efficiently collect an expensive plating liquid, by leading a substance to be treated, which has been subjected to plating, into a washing vessel having a stepped cutting part, and washing the remaining plating liquid with water. CONSTITUTION:A substance to be treated 2 which has been treated with a gold plating liquid is moved, and is led to a stepped cutting part 81 of a washing vessel 8 for washing the gold plating liquid. The part of the remaining gold plating liquid 3 adhering onto the substance to be treated 2 is washed by water 5 fed from a water feed pipe 9, and the water which has washed the remaining gold plating liquid 3 is overflowed a gold plating liquid collecting tank 7, and feed to a plating liquid collecting device, then regenerated.

Description

【発明の詳細な説明】 本発明は、自動部分メッキ装置のメッキ液洗浄回収方法
に係り、とくに回収効率の向上を図ったメッキ液洗浄回
収方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plating solution cleaning and recovery method for an automatic partial plating apparatus, and more particularly to a plating solution cleaning and recovery method that improves recovery efficiency.

被処理物たとえば電子交換機用コネクタコンタクト等は
、高信頼性が要求されるために一般に金メッキが行われ
ている。ところが前記コネクタコンタクF全面に金メッ
キを施すことは、コネクタのコヌトに占める金の比率が
大きくなる。そどで前記コネクタコンタクFの金メッキ
処理は必要最小11に止める自動部分メッキが一般に行
われている・このような従来の自動部分メッキ装置のメ
ッキ液洗浄回収槽の側断面図を第1図に示す。図におい
てlは合成樹脂等からなる金メツキ液回収槽、8はたと
えば電子交換機用コネクタコンタクト等の被処理物、8
は前記被処理物2の一部分に付着していゐ残存金メッキ
液、番は水δを噴射するノズμ、6社前記ノズfi/4
に連なる給水管である。
2. Description of the Related Art Items to be processed, such as connector contacts for electronic exchanges, are generally plated with gold because high reliability is required. However, when the entire surface of the connector F is plated with gold, the proportion of gold in the connector becomes large. Therefore, the gold plating process for the connector contact F is generally carried out by automatic partial plating, which stops the required minimum number of parts from 11. Fig. 1 shows a side cross-sectional view of the plating solution cleaning and recovery tank of such a conventional automatic partial plating device. show. In the figure, l is a gold plating liquid recovery tank made of synthetic resin, etc.; 8 is a workpiece such as a connector contact for an electronic exchange;
is the remaining gold plating solution attached to a part of the workpiece 2, No. is the nozzle μ that sprays water δ, and No. 6 is the nozzle fi/4 for spraying water δ.
This is a water supply pipe connected to the

この構成において、最終メッキ工程を終了した被処理物
8たとえば電子交換機用コネクタコンタク)が移動され
て金メツキ液洗浄回収槽1に導かれ、該金メツキ液回収
槽1内において被処理物2に付着している残存メッキ液
8を洗浄するように′&りている。ところがこのような
従来の洗浄回収方法で杜被処理物IK付着している残存
金メッキ液8を大量の水墨をノスμ4を介して洗浄する
ので、洗浄された残存金メッキ液8が稀薄となり高価な
金メッキ液8の回収効率が悪いという問題点がh5え。
In this configuration, the object to be processed 8 (for example, a connector contact for an electronic exchange) that has completed the final plating step is moved and led to the gold plating solution cleaning recovery tank 1, and the object to be processed 2 is transferred to the object to be processed 2 in the gold plating solution recovery tank 1. The remaining plating solution 8 adhering to the plate is washed away. However, in such a conventional cleaning and recovery method, the remaining gold plating solution 8 adhering to the object to be treated is washed away with a large amount of ink through the nozzle μ4, so the washed remaining gold plating solution 8 becomes diluted, resulting in expensive gold plating The problem with h5 is that the collection efficiency of liquid 8 is poor.

本発明の目的は、前記の問題点を解決すべくなされ九も
ので、少量の水で洗浄し金メッキ液の回収効率を向上し
た新規なメッキ液洗浄回収方法を提供するものである。
SUMMARY OF THE INVENTION An object of the present invention was to solve the above-mentioned problems, and it is an object of the present invention to provide a new plating solution cleaning and recovery method that uses a small amount of water for cleaning and improves the recovery efficiency of the gold plating solution.

前述の目的を達成するため、本発明は、自動部分メッキ
装置によりメッキされた被処理物に付着している残存メ
ッキ液の洗浄回収方法において、被処理物の対応する部
分を切削した前記洗浄容器に給水して前記切削部で前記
被処理物を洗浄するとともに、洗浄後のメッキ液を回収
槽にて回収することを特徴とするものである。
In order to achieve the above-mentioned object, the present invention provides a method for cleaning and recovering residual plating solution adhering to a workpiece plated by an automatic partial plating apparatus, in which the cleaning container is provided with a corresponding portion of the workpiece being cut. The plating solution is characterized in that the plating solution is supplied with water to clean the object to be processed in the cutting section, and the plating solution after cleaning is recovered in a recovery tank.

以下図面を参照しながら本発明に係るメッキ液洗浄回収
方法の実施例について詳細に説明する。
Embodiments of the plating solution cleaning and recovery method according to the present invention will be described in detail below with reference to the drawings.

第2図は、本発明の一実施例を説明するための側断面図
で、前回と同等の部分については同一符号が付してあり
、7は合成樹脂等から々る金メツキ液回収槽、8は合成
樹脂醇の円筒からなシ、段付切削部81を形成した洗浄
容器、9は前記洗浄容器への給水管である。
FIG. 2 is a side sectional view for explaining one embodiment of the present invention, in which the same parts as the previous one are given the same reference numerals, and 7 is a collection tank for gold plating liquid collected from synthetic resin, etc.; Reference numeral 8 designates a cleaning container made of a cylindrical synthetic resin mixture and having a stepped cut portion 81 formed therein, and 9 a water supply pipe to the cleaning container.

この構成において、金メッキ処理を終了し九被処理物8
、例えば電子交換機用コネクタコンタクトが移動して金
メッキ液を洗浄する洗浄容器8の段付切削部81に導か
れ、前記被処理物2に付着した残存金メツキ液80部分
が、給水管9により前記洗浄容器8に供給された水5に
よって洗浄され、残存金メッキ液8は水5に含まれて金
メッキ液回収槽2に溢れ、図示し表いメッキ液を回収す
る処理装置に送られ構成される。
In this configuration, after completing the gold plating process,
For example, a connector contact for an electronic exchange is moved and guided to a stepped cutting part 81 of a cleaning container 8 for cleaning the gold plating solution, and a portion of the remaining gold plating solution 80 adhering to the workpiece 2 is removed by the water supply pipe 9. The remaining gold plating solution 8 is washed with water 5 supplied to the cleaning container 8, and the remaining gold plating solution 8 is contained in the water 5 and overflows into the gold plating solution recovery tank 2, and is sent to the processing device shown in the figure for recovering the plating solution.

なお、本寮施例の最終のメッキ処理として金を用いで説
明したが、金に限らず銀その他の貴金属であっても構わ
ない、tた洗浄容器8の断面形状を円筒について説明し
たが、円筒に限らず角状。
Although gold was used as the final plating process in this dormitory example, the cross-sectional shape of the cleaning container 8 was described as being cylindrical. Not only cylindrical but also angular.

台形状その他如何なる形状であっても構わない。It may be a trapezoid or any other shape.

以上の説明から明らかなように、本発明に係るメッキ液
洗浄回収方法によれば、従来のメッキ液洗浄回収方法に
くらべて残存メッキ液の洗浄水量が框めで少量となるの
で、金メッキ液の回収作業能率の向上が期待できるとと
も′に経済的効果も期待できる。
As is clear from the above explanation, according to the plating solution cleaning and recovery method according to the present invention, the amount of cleaning water for residual plating solution is smaller at each frame than in the conventional plating solution cleaning and recovery method, so that the gold plating solution can be recovered. Not only can we expect to improve work efficiency, but we can also expect economic effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図社従来のメッキ液洗浄回収槽を説明するための側
断面図、第2図は本発明に係るメッキ液洗浄回収槽の一
実施例を説明するための側断面図である。 図において、lおよび7は金メツキ液回収槽、2は被処
理物、8は残存金メッキ液、4はノズル、6は水、6お
よび9は給水管、8は洗浄容器、8tlは段付切削部、
を示す。 第1図 第2図
FIG. 1 is a side sectional view for explaining a conventional plating solution cleaning and recovery tank, and FIG. 2 is a side sectional view for explaining an embodiment of the plating solution cleaning and recovery tank according to the present invention. In the figure, l and 7 are gold plating liquid recovery tank, 2 is the object to be processed, 8 is the remaining gold plating liquid, 4 is the nozzle, 6 is water, 6 and 9 are water supply pipes, 8 is a cleaning container, 8tl is stepped cutting Department,
shows. Figure 1 Figure 2

Claims (1)

【特許請求の範囲】[Claims] 自動部分メッキ装置によりメッキ処理された被処理物に
付着している残存メッキ液の洗浄回収方法において、被
処理物の対応する部分を切削した洗浄容器に給水して前
記切削部で前記被処理物を洗浄するとともに、洗浄後の
メッキ液を回収槽にて回収することを特徴とするメッキ
液洗浄回収方法。
In a method for cleaning and recovering residual plating solution adhering to a workpiece plated by an automatic partial plating device, water is supplied to a cleaning container in which a corresponding part of the workpiece has been cut, and the workpiece is removed by the cutting section. A plating solution cleaning and recovery method characterized by cleaning the plating solution and collecting the plating solution after cleaning in a recovery tank.
JP12451781A 1981-08-08 1981-08-08 Plating liquid washing and collecting method Granted JPS5834190A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12451781A JPS5834190A (en) 1981-08-08 1981-08-08 Plating liquid washing and collecting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12451781A JPS5834190A (en) 1981-08-08 1981-08-08 Plating liquid washing and collecting method

Publications (2)

Publication Number Publication Date
JPS5834190A true JPS5834190A (en) 1983-02-28
JPH0213037B2 JPH0213037B2 (en) 1990-04-03

Family

ID=14887430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12451781A Granted JPS5834190A (en) 1981-08-08 1981-08-08 Plating liquid washing and collecting method

Country Status (1)

Country Link
JP (1) JPS5834190A (en)

Also Published As

Publication number Publication date
JPH0213037B2 (en) 1990-04-03

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