JPS5833719Y2 - semiconductor equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION This invention relates to an improvement of a semiconductor device having a plurality of diodes attached to a substrate, and particularly to a substrate suitable for stacking.

When connecting a large number of diodes in series after final or intermediate molding, generally the diode 2 and the capacitor are placed on one side of an annular insulating substrate 1 made of a baking plate, etc., as shown in Figure 1. 3 connected in parallel are sequentially fixed, and the parallel connected bodies on the two sides are connected in series using a connecting wire 4 on the other side of the substrate 1 to form a single semiconductor device.

When it is desired to connect a larger number of diodes in series, the required number of semiconductor devices is stacked and connected in series.

However, in such conventional semiconductor devices, it is not possible to maintain a constant distance between the substrates, so an insulating spacer 8 must be used. 1 has the disadvantage that it is difficult to install the insulating spacer in a suitable manner depending on the positional relationship between the diode 2 and the capacitor 3, which are already fixed on the substrate.

Furthermore, since input/output terminals 6 and 7 like eyelets are only provided on opposite sides of the mango insulation slit 5, the connection relationship with the semiconductor devices placed above and below is complicated, making the work difficult. The disadvantage was that the performance was extremely poor.

The present invention is a semiconductor device that can eliminate the drawbacks of conventional semiconductor devices as described above.

An embodiment of the present invention will be described below with reference to FIGS. 3 to 5.

A substrate 1 made of an insulating material such as a baking board 1 is provided with a cylindrical upright portion 11 along a circular window portion 10 formed in its center, and this upright portion 11 has a similar configuration on its upper portion. A fittable part 11 that can be fitted with an upright part of another board.
It is equipped with a.

The outer diameter d of the fittable portion 11a is approximately the same as or slightly smaller than the inner diameter d' of the fitting recess 11b provided on the opposite side.

Further, the substrate 1 includes a slit 12 for insulation between input and output terminals extending from the periphery to the window 10, an insertion hole 13 for an output lead wire, and a protrusion 14, which are provided to face each other across the slit 12. ing.

Therefore, if such a board 1 is used, the diode 2 or the diode 2 and the capacitor 3, or other electronic components connected in parallel as required, can be successively connected in series around the standing portion 11, and at the same time the board can be connected simultaneously. 1, and among these outermost node wires 11 and 12, the lead wire 11
A single semiconductor device in which a plurality of diodes are connected in series can be obtained by inserting the lead wire 12 through the insertion hole 13 and leading it out to the other side of the substrate 1, and fixing it by winding the lead wire 12 around the protrusion 14. Fittable portions 11a and fittable portions 11 of adjacent semiconductor devices to be further stacked
Stack the required number of substrates 1 while fitting them together, and connect the lead wires 11 led out through the insertion holes 13 to the projections 1.
4 and then soldering the lead wires 11 and 12, a high voltage rectifier can be obtained.

In other words, in the present invention, the upright portion 11 serves as a spacer that maintains a predetermined distance between the substrates, and also serves to mechanically connect adjacent substrates. When manufacturing a high-voltage rectifier by stacking such semiconductor devices, there is no need for spacers or members to mechanically connect the boards to each other, and in addition, there is no need for lead wires at the locations that should become output terminals. Since the insertion holes and protrusions are provided to support the output lead wires, the handling of these lead wires is extremely simple, and the connection work with adjacent semiconductor devices is extremely easy. The above effect is extremely large.

Furthermore, if slits are provided at predetermined intervals in the upright portion 11 as shown by the chain lines in FIG. 3, elastic force will be generated in the radial direction of the slits, so even if the accuracy of the upright portion is poor, the elastic force can be utilized. A good mechanical bond can be obtained by fitting adjacent substrates together, and it is also possible to provide a slit I as shown by the chain line in FIG. 4 in order to increase the creepage of the substrate 1 between the terminals of the diode. Of course, the insertion hole 13 may be an insertion hole communicating with the slit 12 or the peripheral portion of the substrate 1.

Furthermore, the protrusion 14 may be formed integrally with the substrate 1 from the same material, but it may also be made of metal, and the shape may be a simple rod-like shape.
Various shapes can be considered, such as an inverted shape or a shape that holds the lead wire.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a conventional semiconductor device, in which A is a top view, B is a side view, and C is a bottom view, and FIG. 2 is a high voltage rectifier in which such semiconductor devices are stacked and connected in series. FIG. 3 is a diagram showing a substrate used in the semiconductor device of the present invention, in which A shows a plan view, B shows a side view,
FIG. 4 is a diagram showing an embodiment of a semiconductor device according to the present invention;
FIG. 5 is a diagram showing an embodiment of a high voltage rectifier device in which a plurality of semiconductor devices shown in FIG. 4 are stacked and connected in series. 1-insulating substrate, 2-diode, 11-standing portion, 11
a-fittable part, 12-insulating slit, 13-lead wire insertion hole, 14-protrusion.

Claims (1)

[Scope of utility model registration request] In a semiconductor device in which a plurality of insulating substrates each having at least a plurality of series-connected diodes arranged thereon are stacked and connected to each other in series, the insulating substrate has an upright portion having a predetermined height provided approximately at the center thereof. and one or more insulating slits extending from the periphery toward the center, and a lead wire insertion hole and a lead wire supporting protrusion provided respectively between the insulating slits, A plurality of insulating substrates are stacked together with the standing portion interposed therebetween, and the series-connected diodes arranged around the standing portion of each insulating substrate are connected to each other through the lead wire insertion hole and the lead wire support protrusion. A semiconductor device characterized by being connected in series.