JPS583357Y2 - Heat dissipation structure of electronic equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to efficiently thermally connecting two heat conductors in a method of dissipating heat by heat conduction.

This heat dissipation method thermally connects the heating element mounted on the printed board and the unit (or housing) through thermal conduction, and radiates heat to the outside of the unit.

The details will be explained with reference to FIG.

The heat of the heating element 1 is conducted to the conduction plate 5 mounted on the printed board 11.

This heat is brought to both the upper and lower ends of the printed board 11 by the conductive plate.

Thereafter, it is conducted to the unit 6 and released outside the unit 6.

At this time, thermal connection between the conductive plate on the printed board and the unit becomes a problem.

Conventional examples of this connection method are shown in FIGS. 2-4.

In FIG. 2, the conductive plate and the unit are connected by a contact spring.

In this method, the print can be mounted and removed easily, but the contact pressure is weak, so the efficiency is not good.

FIG. 3 utilizes a diagonal inclination as shown in the cross-sectional view.

However, it cannot be used for large gaps.

In Figure 4, screws are tightened from the unit side, so it cannot be used if two or more units overlap.

The present invention provides a heat dissipation structure that allows efficient thermal connection between the unit and the conductive plate on the printed circuit board.

This proposal utilizes the deformation of the X-shaped metal fittings to efficiently connect the conductive plate and the unit thermally.

FIG. 5 shows an embodiment of the present invention.

A is a perspective view, b is a front view, and C is a side view.

By tightening the screw 21 as described in b, the angle of the X-carved metal fitting 22 changes and the length L increases.

Conversely, when the screw 21 is loosened, the length t becomes smaller.

This change is used to connect the unit and the conductor.

In this case, the amount of change in length t can be increased compared to the example shown in FIG.

Further, in the example shown in FIG. 4, there is a problem that the timer fitting 10 does not move even if the screw is loosened, but in the present invention, by loosening the screw 21, the length t becomes smaller, and this problem does not occur.

According to the present invention, a large length change can be obtained by tightening or loosening the screw, so that an efficient heat dissipation structure can be obtained.

[Brief explanation of drawings]

FIG. 1 is a schematic diagram of heat dissipation by conduction, FIGS. 2 to 4 are conventional illustrations, and FIG. 5 is an embodiment of the present invention. 5... Conductive plate, 6... Unit, 7... Contact spring, 11... Printed board.

Claims (1)

[Scope of utility model registration request] A heat dissipation structure for an electronic device comprising a printed board having a heat conductive plate attached to one side and a heat generating element attached thereto, a unit for storing the printed board, and means for coupling the heat conductive plate to the unit wall, wherein the coupling A means for adjusting the print board includes an X-carved metal fitting provided in a gap between the storage rail of the unit and the stored printed circuit board, a screw for adjusting the intersection angle of the X-carved metal fitting, and a screw attached to the X-carved metal fitting to A heat dissipation structure for an electronic device characterized by comprising a plate-shaped metal fitting that applies pressing force to the plate.