JPS5832441B2 - Glaze products - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a glaze resistance composition that is coated on an insulating substrate and then fired. Specifically, molybdenum, chromium, and silicon are mixed in appropriate proportions, and the composition is coated on an insulating substrate and then baked. The present invention relates to a glaze resistance composition characterized in that it contains a conductive fine powder that has been pulverized after being heated at a high temperature at a high temperature, and a glass frit.

The conductive fine powder of glazed resistors conventionally used for precision fixed resistors and resistors for thick film integrated circuits generally contains fine particles of noble metals such as silver Ag and palladium Pd, or ruthenium dioxide Ru02. Powder is used.

These precious metal-based fine powders have characteristics such as having a small reaction with glass, which is the binder for glaze resistors, and being highly heat resistant and nonflammable. You can make it.

However, the major drawback is that the material is very expensive and cannot be used as conductive fine powder for resistors for general consumer use.

On the other hand, conductive fine powders that do not use precious metals include indium oxide and thallium oxide.

When these fine powders are mixed with glass and fired at high temperatures to make glazed resistors, they strongly react with the glass.
Another disadvantage was that the temperature coefficient of resistance, which is one of the important characteristics of a resistor, becomes negative as it changes due to the influence of oxygen at high temperatures.

The purpose of the present invention is to eliminate this drawback, and to create a high-performance and inexpensive glazed resistor by using conductive fine powder made of a mixture of molybdenum silicide and chromium silicide and glass frit. A glaze-resistant composition is provided.

Hereinafter, the present invention will be explained in detail based on examples.

The conductive fine powder may be a mixture of molybdenum silicide containing MoSi2 as the main component and chromium silicide containing CrSi2 as the main component in an appropriate ratio.
It is desirable to mix chromium (Cr) and silicon (Si) in an appropriate ratio and heat-treat the mixture at high temperature in a vacuum or in an inert gas.

It is preferable to shape and heat the fine powder in the heating section/processing at high temperatures, as the silicification reaction will proceed more easily than in the form of fine powder.

This was coarsely pulverized with a hammer, etc., then pulverized with a Raikai machine, and then pulverized with a pot mill for 24 hours to obtain a fine powder.

Example I Mo: Cr: Si =0.6: 0.4:
The powder mixed at a molar ratio of 2:2 was molded into a disk shape, and heat treated in vacuum at 1400°C for 2 hours to form a sintered powder consisting of molybdenum silicide containing MoS+2 as the main component and chromium silicide containing Cr5T2 as the main component. I formed a body.

This was roughly pulverized with a hammer, then pulverized with a Raikai machine, and then finely pulverized with a pot mill for 24 hours to produce a conductive fine powder consisting of a mixture of molybdenum silicide and chromium silicide.

This conductive fine powder was mixed in a ratio of barium carbonate BaCO3: boron oxide B2O3: silicon oxide 8102: aluminum oxide A403 = 55:30:5:10 (weight ratio), and heated to a temperature of 1200°C to melt it. After putting it into water and coarsely pulverizing it, the fine glass powder crushed in a Raikai machine and a pot mill was mixed in a ratio of conductive fine powder: fine glass powder 1-=10:90 (weight ratio), and In order to provide printability, 4 cc of an organic binder prepared by mixing turpentine oil and ethyl cellulose at a ratio of 9:1 (weight ratio) to 1.1 solids was added to prepare a paste for a glaze resistor.

After screen printing this paste on an alumina porcelain substrate and drying it at 120°C, the maximum temperature was 88°C.
A glazed resistor was produced by burning through a tunnel furnace heated to 20'C, 850C, and 900C.

For the electrodes of the resistor, an electrode paste made of palladium silver PdAg and fine glass powder was added before printing and firing the resistor.

The resistance value at 25 °C is 3.9 Ω/S, respectively.
It was Ω/Sq at qt2.2.

In addition, the temperature coefficient of resistance measured in the temperature range of -55℃ and 125℃ with 25℃ as the standard is ±2641)
IMn/'C.

±268 ppm/'C and ±340 ppm7℃
Met.

Example 2 The ratio of the conductive fine powder produced in Example 1 to the glass fine powder was set to 15285 (weight percent), and the same organic viscous powder as in Example 1 was used to give printability. A paste for a glazed resistor was prepared by adding 4 cc of binder to 1.0 g of solid matter.

This paste was printed on an alumina porcelain substrate and heated to 120°C.
After drying, the maximum temperature was 8200C and 85C, respectively.
It was fired through a tunnel furnace at 00C and 900C.

The resistance value at 25°C is 1.4Ω/Sq.
, 728Ω/Sq and 609Ω/Sq.

In addition, the temperature coefficient of resistance measured in the temperature range of -55°C and 125°C with 25°C as the standard is ±4.8p, respectively.
pI]I/°C, ±20 ppm/'C> and ±12
It was possible to obtain very excellent characteristics at 12°C.

Example 3 The same conductive fine powder and glass fine powder as in Example 1 were used, the ratio of these was 30 nia 0 (weight ratio), and the same organic binder as in Example 1 was used. They were mixed in the same proportions to make a paste for glaze resistors.

This paste was printed on an alumina porcelain substrate and heated to 120°C.
After drying, it was fired in a tunnel furnace with a maximum temperature of 850°C.

The resistance value at 250C is 227Ω/Sq and 2
The temperature coefficient of resistance measured in a temperature range of -55°C and 125°C with 5°C as a reference was ±5000 ppm 7°C.

As is clear from the examples above, the glaze resistance composition containing a conductive fine powder made of a mixture of molybdenum silicide and chromium silicide and glass frit of the present invention is
d jAgJ Compared to noble metal-based glaze resistance compositions made of RuO2, etc., it is much cheaper, has excellent resistance characteristics such as temperature coefficient of resistance and load life characteristics, and uses glass as a binder. Therefore, it is a resistance composition that has many characteristics, such as being nonflammable and being able to be used by firing in air.

Therefore, it is useful not only as a resistor material for hybrid thick film integrated circuits, but also as a general inexpensive resistor.

Moreover, if this resistive composition is dried to evaporate the solvent and then molded and fired, it can be used as a body resistor, and its uses are wide.

Claims (1)

[Claims] 1. A glaze resistance composition characterized by containing a conductive fine powder made of a mixture of molybrene silicide and chromium silicide and glass frit.