JPS5832317Y2 - Electronics - Google Patents

Description

[Detailed Description of the Invention] This invention relates to an electronic device assembly structure that takes into account the heat dissipation effect of electronic devices that have heat-generating electronic components, such as solid-state relays.

Conventionally, as an assembly structure for electronic devices with heat-generating electronic components, the heat-generating electronic components such as triacs are screwed onto the wiring board via bushings, and the electronic components are brought into contact with the case or heat sink. Although things are known,
The number of constituent parts increases, and the assembly work becomes more complicated.

This idea fixes a wiring board with a heat-generating electronic component between a pair of upright pillars on a terminal base, and then attaches an arm protruding from the pillar to the inner wall of a corner of a metal case to provide elasticity. To provide an electronic device that reduces the number of parts, simplifies assembly work, and improves the heat dissipation effect by deforming the heat-generating electronic component to press it into contact with the inner wall of the case. The purpose is to

Hereinafter, embodiments of this invention will be described based on the drawings.

FIG. 1 shows the structure of an electronic device according to this invention, in which 11 is a terminal base having an external terminal 12;
14 is a pair of pillars erected on the base 11, 14 is a heat-generating electronic component such as a triac, and 15 is other electronic components such as a resistor array and a transistor. (Fig. 2).

Reference numeral 17 is a metal case that houses the base 11 and the board 16 on which the electronic components 14 and 15 are mounted, and 18 is a resin filled in the case 17.

As shown in FIG. 2, the wiring board 16 having the heat generating electronic component 14 and other electronic components 15 is fixed to a pair of pillars 13 and 13 erected on the base.

In addition, the above-mentioned heat-generating electronic component 1 is attached to this support 13.13.
Arms 21 and 21 are respectively protruded from the side 20 opposite to the side 19 on which the base 11 (the first
) is housed in the metal case 17 together with the wiring board 16, as shown in the figure, the arm 21.21 comes into contact with the corner inner wall 22 of the case 17 and is elastically deformed, and the reaction force P causes , the heat generating electronic component 14 is pressed into contact with the inner wall 23 of the case 17.

As shown in FIG. 3, the base 11 includes a base portion 24 and a through hole 25 formed in an oval shape at the center of the base portion 24.
, a pair of pillars 13.13 erected at a predetermined interval, and protrusions 2 protruding from both sides of each pillar 13.13.
6.26, which are integrally molded from non-conductive resin.

A guide groove 28.28 extending in the longitudinal direction is formed on the opposing surface 27.27 of both branches 13.13, and an arm 21.21 curved upward in an arc is protruded from the side surface. There is.

Furthermore, a recess 29 is formed in each of the projections 26.26, and an external terminal 12.1 is formed in the base portion 24 of the base 11.
2 is fixed by insert molding.

As shown in FIGS. 1 and 3, the metal case 17 includes:
It has an opening 30 at the bottom, a protrusion 31 is formed on the inner wall 23, and the corner inner wall 22 forms a curved surface as shown in FIGS. 2 and 4.

Next, the assembly process will be explained.

First, in FIG. 3, a guide groove 2 is formed in a pair of supports 13 and 13 on which a wiring board 16 on which a heat-generating electronic component 14 and other electronic components 15 are mounted is erected on a base 11.
8 and fix this board 16 between both branches 13°13.

Next, the base 11 holding the wiring board 16 is fitted into the metal case 17 through the opening 30 and housed therein.

At this time, the protrusion 26 protruding from the case 11
After coming into contact with the convex portion 31 formed on the inner wall 23 of the protrusion 26 and deflecting inward, the protrusion 26 returns due to a reaction force when the concave portion 29 of the protrusion 26 and the convex portion 31 coincide with each other, and the concave portion 29
The convex portion 31 engages with the base 11 . Case 17 and wiring board 16 are fixed.

When the above-described base 11 and wiring board 16 are housed in the case 17, as shown in FIG.
2, and further, the arm 21 is elastically deformed in the direction of arrow a along the curvature surface of the corner inner wall 22, so that a reaction force P is generated in the support column 13.

As a result, as shown in Figure 2, the above two branches 13.13
The wiring board 16 fixed therebetween is pushed to the side 19 opposite to the protruding side 20 of the arm 21, and this side 19 of the board 16
The heat generating electronic component 14 mounted on the metal case 17 is pressed into contact with the inner wall 23 of the metal case 17 .

FIG. 5 shows the base 11. This shows a state in which the case 17 and the wiring board 16 are fixed, and at this time, as described above, the heat-generating electronic component 14 mounted on the board 16 is in contact with the inner wall 23 of the metal case 17 for heat conduction. This increases the heat dissipation effect of the component 14.

Note that a heat sink may be attached to the heat generating electronic component 14 and this heat sink may be pressed into contact with the inner wall 23 of the case 17.

Furthermore, if the arm 21 is configured to be curved upward in an arc shape as in the embodiment (see Fig. 3), the arm 21 can be lengthened as a whole even though the lateral distance is short. , the pressing force of the heat generating electronic component 14 against the metal case 17 can be increased.

Furthermore, when the above-mentioned bending direction is upward, the deflection of the support 13, that is, the heat generating electronic component 1 mounted on the board 16
The pressing force of step 4 becomes even greater.

After that, as shown in FIG. 6, the through hole 2 of the base 11 is
5 (see Figures 3 and 5), the resin 18 is inside the case 17.
and fill the base 11. in the case 17. The substrate 16 and electronic components 14 and 15 are molded, and the through hole 25 is closed.

This allows each component to be firmly fixed.

As described in detail above, in the electronic device according to the present invention, a wiring board having a heat-generating electronic component is fixed between a pair of pillars installed upright on a terminal base, and an arm protruding from the pillars is attached to a metal case. By abutting against the inner wall of the corner of the metal case and elastically deforming it, the heat-generating electronic component is pressed into contact with the inner wall of the metal case by the reaction force, so that the heat dissipation effect of the component can be measured. Furthermore, during assembly, bushings and set screws are no longer required, reducing the number of parts and simplifying assembly work.

Furthermore, since the support is interposed between the wiring board with electronic components and the metal case, it has the effect of maintaining good electrical insulation.

[Brief explanation of the drawing]

Figure 1 is a partially sectional front view of an electronic device according to this invention, Figure 2 is a cross-sectional view taken along line 2-2 in Figure 1, Figure 3 is an exploded perspective view, and Figure 4 is a cross-sectional view of the electronic device. An enlarged view of the fourth part in the figure, and FIGS. 5 and 6 are longitudinal sectional side views showing the assembly process. 11...terminal base, 13...post,
14... Heat generating electronic component, 16... Wiring board, 17... Metal case, 18...
・Resin, 19...Side where heat-generating electronic components are attached, 20...Opposite surface side, 21...
Arm, 22... Corner inner wall, 23...
Inner wall, 27... Opposite surface of pillar, 28...
・Guide groove.

Claims (5)

[Scope of utility model registration request] (1) A pair of posts are erected on the terminal base, a wiring board with heat-generating electronic components is fixed to these posts, and the above-mentioned posts are attached to the side opposite to the side on which the heat-generating electronic components are mounted. An electronic device in which a protruding arm is provided, and the arm is brought into contact with the inner wall of a corner of the metal case to be elastically deformed, thereby bringing the heat-generating electronic component housed in the case into pressure contact with the inner wall of the case. . (2) The electronic device according to claim 1, wherein the inner wall of the corner portion of the metal case is a curved surface. (3) The electronic device according to claim 1 or 2, wherein the arm is curved upward in an arc. (4) Utility model registration claims Paragraphs 1 and 2, in which a guide groove extending in the longitudinal direction is formed on the opposing surfaces of the pair of pillars, and the wiring board is inserted and fixed into the guide groove. The electronic device described in item 3. (5) The electronic device according to claim 1, 2, 3, or 4 of the utility model registration claim, wherein the metal case is filled with resin.