JPS5831293B2 - Molding mold for insert resin sealing - Google Patents

Molding mold for insert resin sealing

Info

Publication number
JPS5831293B2
JPS5831293B2 JP2937979A JP2937979A JPS5831293B2 JP S5831293 B2 JPS5831293 B2 JP S5831293B2 JP 2937979 A JP2937979 A JP 2937979A JP 2937979 A JP2937979 A JP 2937979A JP S5831293 B2 JPS5831293 B2 JP S5831293B2
Authority
JP
Japan
Prior art keywords
mold
resin
insert
resin sealing
range
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP2937979A
Other languages
Japanese (ja)
Other versions
JPS55123441A (en
Inventor
愛三 金田
重晴 角田
桂三 大槻
隆 中川
正義 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP2937979A priority Critical patent/JPS5831293B2/en
Publication of JPS55123441A publication Critical patent/JPS55123441A/en
Publication of JPS5831293B2 publication Critical patent/JPS5831293B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/26Moulds
    • B29C45/37Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • B29C45/372Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To provided a metal mold with a smooth relief shape subjected to satin finish within a specified range of surface roughness, suitable for molding parts including an insert for resin sealing of semiconductor or the like, which is excellent in the mold releasing property, wear resistance and the like. CONSTITUTION:A metal mold for molding parts including an insert for resin sealing of semiconductors or the like, is subjected to satin finish with the surface roughness ranging from 5 to 15mu with a smooth relief shape by a discharge processing or sandblasting. In addition, the relief shape shall be such that the surface roughness/pitch ranges from 1/10 to 1/200 having the inclination below 10mu/0.2mm within 0-100% of the reference length in the Affot's bearing curve. The performance can be further improved by applying a hard chromium plating or a metal treatment of impregnating a plated metal matrix with a fluorocarbon resin such as tetrafluoroethylene resin or dispersing the resin into the metal matrix.

Description

【発明の詳細な説明】 本発明は半導体の樹脂封止などのインサートを含む部品
を成形するための成形金型に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a molding die for molding a component including an insert for resin encapsulation of a semiconductor or the like.

従来、半導体の樹脂封止などのインサートを含む部品を
成形するための成形金型は鏡面仕上するのを通例として
いた。
Conventionally, molds for molding parts including inserts for resin encapsulation of semiconductors have generally been mirror-finished.

これは成形品を金型から離型する際の力、すなわち離型
力を小とすることが強く要求されたことによるもので、
離型力が犬であるとインサートと樹脂との接着力its
する等の不具合が生じた。
This is due to the strong need to reduce the force required to release the molded product from the mold, that is, the mold release force.
The mold release force is strong and the adhesive force between the insert and the resin is
Problems such as

しかし、鏡面仕上には工数がかかり、金型の製作工数の
10〜20%を占め、製作費用も総製作費の10〜20
%を占めるものであった。
However, mirror finishing takes a lot of man-hours, accounting for 10-20% of the mold manufacturing man-hours, and the manufacturing cost is also 10-20% of the total manufacturing cost.
% of the total.

更に、鏡面仕上された金型による成形品は、微小なひけ
、又はピンホールが目立ち易く、商品名などを示すマー
キングの付着性、耐久性が劣るという欠点があった。
Furthermore, molded products made from mirror-finished molds have the disadvantage that minute sink marks or pinholes are easily noticeable, and the adhesion and durability of markings indicating product names and the like are poor.

これらの点に関して第1図ないし第5図を参照してさら
に説明する。
These points will be further explained with reference to FIGS. 1 to 5.

第1図はトランスファモールド成形型の一例を示す断面
図であり、第2図はこれによって作られた樹脂封止半導
体の断面図である。
FIG. 1 is a cross-sectional view showing an example of a transfer molding mold, and FIG. 2 is a cross-sectional view of a resin-sealed semiconductor manufactured using the mold.

予め予備成形された樹脂が高周波加熱機(図示しない)
によって予備加熱されてポット4に投入され、上型1、
下型2より熱を受けて醇融する。
The preformed resin is heated in a high frequency heating machine (not shown).
It is preheated and put into the pot 4, and then the upper mold 1,
It receives heat from the lower mold 2 and melts.

躊融した樹脂5はプランジャ3によって移送され、ラン
ナ6、ゲート7を経てキャビティ8を充填する。
The molten resin 5 is transferred by the plunger 3, passes through the runner 6 and the gate 7, and fills the cavity 8.

樹脂が硬化するまで型は閉じた状態に保持され、硬化後
に下型2が下方に移動し、キャビティ8に対応する形状
を持つ成形品が上型1および下型2から離型せしめられ
る。
The mold is held closed until the resin hardens, and after hardening, the lower mold 2 is moved downward, and the molded product having a shape corresponding to the cavity 8 is released from the upper mold 1 and the lower mold 2.

樹脂封止半導体の場合にはそのインサートとして半導体
ペレット10がリードフレーム9にマウントされ、金線
11で相互結線されたものが上型1と下型2とによって
作られるキャビティ8に配置されて樹脂5によって封止
される。
In the case of a resin-sealed semiconductor, semiconductor pellets 10 are mounted on a lead frame 9 as inserts, and those interconnected with gold wires 11 are placed in a cavity 8 formed by an upper mold 1 and a lower mold 2, and the resin is sealed. It is sealed by 5.

従って樹脂の硬化する過程で樹脂が上型1又は下型2に
接着する力が強いと硬化時の収縮によって内部応力が作
用し、インサートである半導体ペレット10またはリー
ドフレーム9と樹脂5との間の接着が剥離するおそれが
ある。
Therefore, if the adhesive force of the resin to the upper mold 1 or the lower mold 2 is strong during the curing process of the resin, internal stress will act due to contraction during curing, and the gap between the semiconductor pellet 10 or lead frame 9, which is the insert, and the resin 5 will be generated. There is a risk that the adhesive may peel off.

樹脂5の硬化が完了して下型2を移動させるとき、すな
わち離型時において樹脂5と型との間の接着力が過大で
あると離型時に内部応力が作用し、樹脂の強度が不十分
であると半導体ペレット10にクラックが発生するおそ
れがある。
If the adhesive force between the resin 5 and the mold is excessive when the lower mold 2 is moved after the curing of the resin 5 is completed, that is, when the mold is released, internal stress will be applied during the mold release, and the strength of the resin will become insufficient. If it is insufficient, cracks may occur in the semiconductor pellet 10.

このような欠点はしばしば経験されており、金型面と樹
脂との間の接着力が大きいとインサート部を樹脂で封止
保護するという本来の目的に反する信頼性の悪い製品が
できることになる。
Such drawbacks are often experienced, and strong adhesion between the mold surface and the resin results in an unreliable product that defeats the original purpose of sealing and protecting the insert with the resin.

第3図ないし第5図にキャビティ8の表面形状を示す概
念的断面図を示し、第3図は鏡面、第4図は梨地面、第
5図は研削または化学エツチング等によって形成された
面である。
Figures 3 to 5 are conceptual cross-sectional views showing the surface shape of the cavity 8. Figure 3 shows a mirror surface, Figure 4 shows a satin surface, and Figure 5 shows a surface formed by grinding or chemical etching. be.

第3図に示す鏡面は第4図、第5図に示す面と対比した
とき明かに樹脂との接着面積が小さく、みかけ単位面積
あたりの接着力が小であると考えられる。
When compared with the surfaces shown in FIGS. 4 and 5, the mirror surface shown in FIG. 3 clearly has a smaller adhesion area with the resin, and it is considered that the adhesive force per apparent unit area is smaller.

なお、通常接着剤による接着の場合に接着効果を改善す
るためエツチング又はサンドブラスト等を行って粗面化
することも行われている。
In addition, in the case of bonding using an adhesive, etching or sandblasting or the like is usually performed to roughen the surface in order to improve the bonding effect.

第5図のような断面形状を持つ場合には樹脂が表面の小
孔に入りこむことによって接着力が増大するという、い
わゆるアンカー効果があることも一般的に知られている
It is also generally known that when the cross-sectional shape is as shown in FIG. 5, there is a so-called anchor effect in which the adhesive force increases as the resin enters the small pores on the surface.

このような理由によって従来はキャビティ8の内面を鏡
面仕上とすることが常識となっている。
For these reasons, it has conventionally been common practice to give the inner surface of the cavity 8 a mirror finish.

本発明の目的は従来の鏡面仕上の金型の欠点を除去し、
優れた離型性を持つ金型を提供するにある。
The purpose of the present invention is to eliminate the drawbacks of conventional mirror finish molds,
The purpose of the present invention is to provide a mold with excellent mold release properties.

本発明によれば、なめらかな凹凸形状を有し且つ面粗さ
Hmaxが5〜15μの範囲の梨地面仕上となされてい
るインサート樹脂封止用成形金型が提供される。
According to the present invention, there is provided a mold for insert resin sealing, which has a smooth uneven shape and has a satin finish with a surface roughness Hmax in the range of 5 to 15 μm.

凹凸形状としてはHm ax /ピッチが1/10〜1
/200の範囲、アボット負荷曲線において基準長さ0
〜100%の範囲で傾斜が10μ/2007rt7nの
範囲とすることが望ましく、梨地面仕上はサンドブラス
ト条件または放電加工条件を調節することによって好便
に行うことができる。
As for the uneven shape, Hmax/pitch is 1/10 to 1
/200 range, reference length 0 in Abbott load curve
It is desirable that the slope is in the range of 10μ/2007rt7n in the range of 100%, and the satin finish can be conveniently achieved by adjusting the sandblasting conditions or electric discharge machining conditions.

勿論この仕上加工はキャビテイ面についてのみ行えばよ
い。
Of course, this finishing process only needs to be performed on the cavity surface.

さらに、本発明によれば、梨地仕上面を硬質クロームメ
ッキ、又は弗化炭素ポリマー複合化金属表面処理(メッ
キ金属マトリックス中に四弗化エチレン樹脂等の合邦化
炭素樹脂を含浸または分散させる処理)などの金属表面
処理を施したインサート樹脂封止用成形金型も提供され
る。
Furthermore, according to the present invention, the matte finished surface is hard chrome plated or fluorocarbon polymer composite metal surface treatment (processing to impregnate or disperse a synthetic carbon resin such as tetrafluoroethylene resin in the plating metal matrix). A mold for insert resin sealing which has been subjected to metal surface treatments such as the above is also provided.

これは前者に比して離型性、耐摩耗性がさらに改善され
る。
This further improves mold releasability and abrasion resistance compared to the former.

本発明の実施例について添付図面を参照して説明する。Embodiments of the present invention will be described with reference to the accompanying drawings.

第6図は5KD−11製の試料に放電加工により梨地面
を形成してその表面粗さを触針法により実測した一例を
示し、第7図はそのアボット負荷曲線を示す。
FIG. 6 shows an example in which a satin surface was formed on a sample made of 5KD-11 by electrical discharge machining and the surface roughness was actually measured by the stylus method, and FIG. 7 shows its Abbott load curve.

第8図は第6図の試料に膜厚5μの硬質クロームメッキ
を施したもののアボット負荷曲線を示し、第9図は表面
粗さHmaxが比較的小さい梨地面に硬質クロームメッ
キ処理を行ったもののアボット負荷曲線を示す。
Figure 8 shows the Abbott load curve for the sample in Figure 6 with hard chrome plating with a film thickness of 5 μm, and Figure 9 shows the Abbott load curve for the sample in Figure 6 with hard chrome plating applied to the pear surface with a relatively small surface roughness Hmax. The Abbott load curve is shown.

第7図ないし第9図のアボット負荷曲線はいずれも山部
の傾斜が広い範囲においてゆるやかであり、表面形状と
してはあまりエツジの鋭い凹凸を含まない粗面であるこ
とが判る。
It can be seen that the Abbott load curves shown in FIGS. 7 to 9 all have a gentle slope in a wide range, and the surface shape is a rough surface that does not include many sharp-edged irregularities.

すなわち第4図に概略的に示したような梨地面形状を有
し、アンカー効果を持つような凹所なとがないものであ
る。
That is, it has a satin surface shape as schematically shown in FIG. 4, and has no recesses or edges that would have an anchor effect.

なお、硬質クロームメッキ処理を施すことにより、傾斜
がゆるやかとなり、凹凸形状がさらになめらかとなって
いることが判る。
It can be seen that by applying the hard chrome plating treatment, the slope becomes gentler and the uneven shape becomes smoother.

第10図は樹脂成形作業を繰り返したときの表面のぬれ
性の変化を鏡面にクロームメッキを施したもの(A)、
Hmax = 5μおよび15μの梨地に硬質クロー
ムメッキしたもの(それぞれBおよびC)。
Figure 10 shows changes in surface wettability when resin molding is repeated, with chrome plating applied to the mirror surface (A);
Hmax = 5μ and 15μ satin with hard chrome plating (B and C, respectively).

及びlHmax−10μの梨地に弗化炭素ポリマ複合化
処理をしたもの(D)について対比して示している。
and fluorocarbon polymer composite treatment on a satin finish with lHmax-10μ (D) are shown in comparison.

ぬれ性は型表面に滴下した水滴の接触角として示してい
る。
Wettability is shown as the contact angle of water droplets dropped on the mold surface.

第10図によれば(刀樹脂成形をくりかえすことによっ
て型表面は樹脂からにじみ出るエステル、ワックス等に
よって被われこれが内部離型剤として作用して次第に接
触角が犬となり、ぬれにくくなること、(イ)同一表面
処理では表面粗さの粗い梨地面のほうがぬれにくいこと
、(つ)硬質クロームメッキ処理よりも弗化炭素ポリマ
複合化処理のほうがぬれにくいことが判る。
According to Figure 10, (by repeating resin molding, the mold surface is covered with ester, wax, etc. that oozes out from the resin, and this acts as an internal mold release agent, gradually increasing the contact angle and making it difficult to wet. ) It can be seen that with the same surface treatment, a matte surface with a rougher surface is more difficult to get wet, and (1) a fluorocarbon polymer composite treatment is more difficult to get wet than a hard chrome plating treatment.

第11図は連続成形作業を行った場合の離型力の変化を
、従来方式による鏡面に硬質クロームメッキをしたもの
(E)、本発明による表面粗さ15μの梨地に硬質クロ
ームメッキを施したもの(F)、表面粗さ10μの梨地
に弗化炭素ポリマ複合化処理を施したもの(G)につい
て示している。
Figure 11 shows the change in mold release force when continuous molding is performed, for the conventional method with hard chrome plating on a mirror surface (E) and the present invention with hard chrome plating on a matte surface with a surface roughness of 15μ. (F) and a material (G) in which a satin finish with a surface roughness of 10 μm was subjected to a fluorocarbon polymer composite treatment.

尚表面粗さ10μの111面に硬質クロームメッキを施
したもの印についても示している。
Also shown is a mark with hard chrome plating applied to the 111th surface with a surface roughness of 10μ.

第11図および第10図からぬれ性と離型力との間に対
応的関係があることが判る。
It can be seen from FIGS. 11 and 10 that there is a corresponding relationship between wettability and mold release force.

すなわち(7)最もぬれにくい弗化炭素ポリマ複合化処
理は樹脂成形作業の初期から後期にいたるまで離型力が
Okg/C711,と測定され、(イ)硬質クロームメ
ッキ処理の場合は成形作業の初期では梨地面のほうが鏡
面よりも離型力が犬であるが、表面が離型剤で次第に覆
われると共に鏡面よりも離型力が小となり、(つ)研削
面に硬質クロームメッキを施したものは、ぬれ性では放
電加工梨地面の場合とあまり差はないが成形作業の初期
では離型力が10kg/ff1以上と測定され、明らか
にアンカー効果が存在することが判る。
In other words, (7) the fluorocarbon polymer composite treatment, which is the least wettable, has a mold release force of Okg/C711 from the early to late stages of the resin molding process, and (a) the hard chrome plating process has a mold release force of Okg/C711 during the molding process. Initially, the mold release force on the pear-ground surface was stronger than on the mirror surface, but as the surface was gradually covered with mold release agent, the mold release force became smaller than on the mirror surface, and (1) hard chrome plating was applied to the ground surface. Although the wettability of the material is not much different from that of the electrical discharge machined satin surface, the mold release force was measured to be 10 kg/ff1 or more at the initial stage of the molding operation, clearly indicating that an anchor effect exists.

上述データは清浄な型表面を持つ試料について連続的に
成形作業を行ったときのぬれ性、離型力を測定したデー
タであるが、実際の成形作業ではダミーショット等によ
り型表面は離型剤で被われており、清浄ではない。
The above data is data obtained by measuring the wettability and mold release force when molding is performed continuously on samples with clean mold surfaces. However, in actual molding work, the mold surface is exposed to mold release agent using dummy shots, etc. It is covered with dirt and is not clean.

従って第11図において硬質クロームメッキの場合に本
発明による梨地仕上のほうが鏡面仕上よりも離型力が犬
であるということは実際には生じない。
Therefore, in the case of hard chrome plating in FIG. 11, it does not actually occur that the matte finish according to the present invention has a greater release force than the mirror finish.

なお、弗化炭素ポリマ複合化金属表面処理が著しく有利
であることは明らかである。
It is clear that fluorocarbon polymer composite metal surface treatment is extremely advantageous.

粗面とぬれ性との関係は一般につぎのウエンツエル(W
enzel )の式で表わされる。
The relationship between rough surfaces and wettability is generally expressed by Wenzel (W
enzel ).

CO3θ’/cosθ−R こSに θ′:粗面上の接触角 θ:平坦面上の接触角 R=Ar/Aa (R≧1) AI−:真の表面積 Aa:見掛けの表面積 したがって θ〈90°のとき θ′〈θ θ〉90°のとき θ′〉θ の関係が成立する。CO3θ'/cosθ-R θ′: Contact angle on rough surface θ: Contact angle on flat surface R=Ar/Aa (R≧1) AI-: true surface area Aa: Apparent surface area therefore When θ〈90° θ′〈θ When θ〉90° θ′〉θ The relationship holds true.

すなわち、ぬれ易い表面材質に対しては表面粗さが粗い
ほどぬれ易くなり、ぬれ難い表面材質の場合は表面粗さ
が粗いほどぬれ難くなる。
That is, for a surface material that is easy to wet, the rougher the surface roughness, the easier it is to wet, and for a surface material that is difficult to wet, the rougher the surface roughness, the harder it is to wet.

従って離型剤または表面処理などによってぬれ難い表面
を形成するようにした金型の場合は鏡面よりも梨地面の
方がぬれ難く、離型に有利であることが判った。
Therefore, in the case of a mold in which a surface that is difficult to wet is formed using a mold release agent or surface treatment, it has been found that a satin surface is more difficult to wet than a mirror surface and is more advantageous for mold release.

なお接着加工の場合に表面にサンドブラスト等を施して
粗面化しているが、これはぬれ易い表面材に対する効果
を期待したものである。
In the case of adhesive processing, the surface is roughened by sandblasting, etc., but this is expected to be effective for surface materials that are easily wetted.

上述のように表面粗さが粗いはど離型に有利であるが、
実際の成形品は側面を持っており、表面粗さが過大であ
ると離型時に側面にかじり傷が発生する。
As mentioned above, rough surface roughness is advantageous for mold release, but
Actual molded products have side surfaces, and if the surface roughness is excessive, scratches will occur on the sides when the mold is released.

本発明による梨地仕上面は離型性が良好であるので硬化
収縮時に型面から剥離するが、かじり傷を防止するため
には抜き勾配を過大にする必要があり、HmaXを15
μ以下とすることが望ましい。
The satin finished surface according to the present invention has good mold releasability, so it peels off from the mold surface during curing and shrinkage, but in order to prevent galling, it is necessary to make the draft angle excessively high, and HmaX is 15
It is desirable that it be less than μ.

伺、Hmaxを5μより小とすると鏡面仕上との差が小
となり、本発明による効果が得られなくなる。
However, if Hmax is made smaller than 5μ, the difference from the mirror finish becomes small, and the effects of the present invention cannot be obtained.

表面粗さを種々に変えた545C材製の丸棒を離型材の
無い条件下で樹脂に埋込み成形し、引抜力を測定した結
果、引抜力の最大値FmaXはFmaX=1131og
R+327 但し、丸棒の直径10闘、R−)(maxで与えられる
Round bars made of 545C material with various surface roughnesses were embedded and molded in resin without a release agent, and the pulling force was measured. As a result, the maximum value of the pulling force FmaX was FmaX = 1131og
R+327 However, the diameter of the round bar is 10mm, R-) (given as max).

)Imaxが15μよりも大きくなるとpmaxが著し
く大となることが判った。
) It has been found that when Imax becomes larger than 15μ, pmax becomes significantly large.

R=0.4μのときFmax = 270−、 R=
20μのときFmaXは1500)ci9となる。
When R=0.4μ, Fmax=270−, R=
When 20μ, FmaX becomes 1500)ci9.

凹凸形状はなめらかであることが必要であり、Hmax
/ピッチが1/10よりも大きい、すなわちピッチに対
してHmaxが犬であると側面のぬき勾配を太きくしな
いと成形品にかじり傷ができる。
The uneven shape must be smooth, and Hmax
/If the pitch is larger than 1/10, that is, if Hmax is too small for the pitch, scratches will occur on the molded product unless the side wall slope is made thicker.

通常の抜き勾配(約95°)を持つ成形品の場合にはこ
の値を1/10よりも小とすることが望ましい。
In the case of a molded article with a normal draft angle (approximately 95°), it is desirable that this value be smaller than 1/10.

さらに、この値が1/10よりも大であるとアンカー効
果が生ずることになる。
Furthermore, if this value is greater than 1/10, an anchor effect will occur.

尚、)(r11ax/ピッチを1/200よりも小とす
ることはサンドブラスト処理、放電加工処理によって形
成することが困難である。
Note that it is difficult to form by sandblasting or electric discharge machining when the r11ax/pitch is smaller than 1/200.

凹凸形状を判断する別の指標としてアボット負荷曲線が
ある。
Another indicator for determining the shape of unevenness is the Abbott load curve.

これは凹部(ピット)の形状が測定範囲(基準長さ)で
どの程度そろっているかを示すものであり、望ましくは
基準長さ0〜100%の範囲で傾斜が10μ70.2
mm以下とする。
This indicates how uniform the shapes of the recesses (pits) are in the measurement range (reference length), and preferably the slope is 10μ70.2 in the range of 0 to 100% of the reference length.
It shall be less than mm.

特に基準長さ0〜5%の範囲における傾斜が10μ10
.2朋を超える場合は凸部の先端がサンドペーパー研磨
面の場合の如く尖っていることを示し、アンカー効果が
生ずることになる。
In particular, the slope in the range of 0 to 5% of the reference length is 10μ10
.. If it exceeds 2 mm, it indicates that the tip of the convex portion is sharp as in the case of a sandpaper polished surface, and an anchor effect will occur.

商品名などを成形品に表示するマーキングを施すとき、
成形品は洗浄して表面の離型剤などを除去した状態でマ
ーキングが行われる。
When applying markings to display product names etc. on molded products,
Marking is performed after the molded product has been cleaned to remove mold release agents and other substances from the surface.

このとき表面はぬれ易くなっており、梨地仕上の金型で
成形された成形品のマーキング用インクの付着性は鏡面
仕上の金型により成形された成形品に比して優れている
At this time, the surface is easily wetted, and the adhesion of marking ink to a molded product molded with a satin finish mold is superior to that of a molded product molded with a mirror finish mold.

梨地面仕上された金型で成形された成形品の外観は著し
く良好である。
The appearance of the molded product molded using the matte-finished mold is extremely good.

これは前述のように梨地面がぬれ難く従って樹脂と接着
し難いので、樹脂の硬化収縮時の応力が金型の表面に伝
達されず、均一な接着剥離が生じ易いので部分的なひけ
が生じ難いためと考えられる。
This is because, as mentioned above, the satin surface is difficult to wet and therefore difficult to bond with the resin, so the stress caused by the curing and shrinkage of the resin is not transmitted to the surface of the mold, and uniform adhesive peeling tends to occur, resulting in local sink marks. This is thought to be because it is difficult.

このことは樹脂トインサートとの接着にとっても有利で
ある。
This is also advantageous for adhesion with resin inserts.

本発明による成形品は鏡面仕上による金型の成形品のよ
うに光を反射しないので、微小なひけ又はピンホール等
が目立たず、高級品であるというイメージを与える効果
もある。
Since the molded product according to the present invention does not reflect light like a mirror-finished molded product, minute sink marks or pinholes are less noticeable, giving the product an image of being a high-quality product.

本発明により従来の鏡面仕上された金型を梨地仕上にす
ることにより以下の効果が得られる。
According to the present invention, the following effects can be obtained by changing a conventional mirror-finished mold to a matte finish.

(力 樹脂が梨地の凹部に楔状に入りこむような形状で
ない梨地仕上面を放電加工、サンドブラスト加工などに
よって容易に形成できるので、従来鏡面仕上加工のため
に必要とした工数を省略し、金型の製作日数を10〜2
0%短縮し、且つ製作費用を約10〜20%低減するこ
とができる。
(Power) A satin finished surface that does not have a shape where the resin wedges into the concave part of the satin finish can be easily formed by electric discharge machining, sandblasting, etc., so the man-hours required for conventional mirror finishing processing can be omitted, and the mold Production time: 10-2
It is possible to reduce the time by 0% and reduce the manufacturing cost by about 10 to 20%.

(イ)梨地面仕上とすることにより、離型性を向上せし
め、ダミーショツト数を従来の金型の場合に比し約30
%低減することができる。
(a) The satin surface finish improves mold releasability and reduces the number of dummy shots by approximately 30 compared to conventional molds.
% can be reduced.

(つ)離型性が向上したので、インサートと樹脂トの接
着性が著しく改善され、製品の不良率が減少し、耐湿信
頼性が向上する。
(1) Since the mold releasability is improved, the adhesion between the insert and the resin is significantly improved, the defect rate of the product is reduced, and the moisture resistance reliability is improved.

江)ひけ、ピンホール等の微小な欠陥が目立たなくなり
、製品に高級イメージを与え、商品価値が高められる。
E) Minute defects such as sink marks and pinholes become less noticeable, giving the product a high-class image and increasing its value.

(1) マーキング用インクの付着性および耐久性が
改善され、マーキング不良を約175 とすることがで
きた。
(1) The adhesion and durability of the marking ink were improved, and the number of marking defects was reduced to about 175.

曲)弗化炭素ポリマー複合化金属表面処理された梨地仕
上面を薄肉小形パッケージの成形金型に適用することに
より大幅に離型性が向上され、同一成形条件で比較して
モールドクラック発生率を約1/100に、ペレットク
ラック発生率を約1710に低減可能となる。
) By applying a satin finish surface treated with a fluorocarbon polymer composite metal surface to a mold for forming a thin-walled small package, mold release properties are greatly improved, and the incidence of mold cracks is lower when compared under the same molding conditions. It is possible to reduce the pellet crack occurrence rate to about 1,710, which is about 1/100.

成形条件で比較すると樹脂の硬化時間を半減しても鏡面
仕上による金型の場合と同程度の不良率とすることがで
き、成形サイクルの短縮に効果が大きい。
Comparing the molding conditions, even if the curing time of the resin is halved, the defect rate can be reduced to the same level as in the case of a mirror-finished mold, which is highly effective in shortening the molding cycle.

すなわち現状の不良限度内においてサイクルタイムを約
40%低減でき、生産効率を大幅に向上せしめることが
できる。
That is, the cycle time can be reduced by about 40% within the current defect limit, and production efficiency can be greatly improved.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はインサートを含む樹脂封止の例を説明するため
のトランスファモールド型の断面図、第2図はインサー
ト樹脂封止製品の実施例として示す樹脂封止ICの断面
図、第3図、第4図、第5図はそれぞれ鏡面、梨地面、
アンカー効果を持っ粗面の概略的断面図、第6図は本発
明により放電加工で形成された梨地面の粗さ測定データ
を示すグラフ、第7図はそのアボット負荷曲線図、第8
図は第6図の梨地面を硬質クロームメッキしたときのア
ボット負荷曲線を示す図、第9図は第6図の場合に比し
て面粗さの小さい梨地面に硬質クロ−ムメツキを施した
もののアボット負荷曲線図、第10図は本発明による金
型に樹脂を連続成形したときの型表面のぬれ性変化を従
来の鏡面仕上された金型と対比して型表面のぬれ性の変
化を示す図、第11図は本発明による金型と樹脂との間
の離型力を、従来の鏡面仕上の場合および研削仕上の場
合と対比して示す図である。 1・・・・・・上型、2・・・・・・下型、3・・・・
・・プランジャ、5・・・・・・樹脂、8・・・・・・
キャビティ。
Fig. 1 is a cross-sectional view of a transfer mold type for explaining an example of resin sealing including an insert, Fig. 2 is a cross-sectional view of a resin-sealed IC shown as an example of an insert resin-sealed product, Fig. 3, Figures 4 and 5 show mirror surface, pear surface, and
A schematic cross-sectional view of a rough surface having an anchor effect, FIG. 6 is a graph showing roughness measurement data of a matte surface formed by electric discharge machining according to the present invention, FIG. 7 is an Abbott load curve diagram thereof, and FIG.
The figure shows the Abbott load curve when the pear-shaped surface shown in Fig. 6 is plated with hard chrome, and Fig. 9 shows the Abbott load curve when the pear-skinned surface shown in Fig. 6 is plated with hard chrome. Fig. 10 is an Abbott load curve diagram of the object, which shows the change in wettability of the mold surface when resin is continuously molded into the mold according to the present invention, comparing it with a conventional mirror-finished mold. The figure shown in FIG. 11 is a diagram showing the mold release force between the mold and the resin according to the present invention in comparison with the case of conventional mirror finishing and the case of grinding. 1...Top mold, 2...Bottom mold, 3...
...Plunger, 5...Resin, 8...
cavity.

Claims (1)

【特許請求の範囲】 1 そのキャビテイ面がなめらかな凹凸形状を有し且つ
面粗さHmaxが5〜15μの範囲の梨地面仕上となさ
れていることを特徴とするインサート樹脂封止用成形金
型。 2 前記凹凸形状がHm ax /ピッチが1/10〜
1/200の範囲、アボット負荷曲線において基準長さ
0〜100%の範囲で傾斜が10μ/ 0.2 mm以
下として限定されることを特徴とする特許請求の範囲第
1項記載のインサート樹脂封止用成形金型。 3 前記梨地面仕上を放電加工またはサン・ドブラスト
加工によって形成したことを特徴とする特許請求の範囲
第1項または第2項記載のインサート樹脂封止用成形金
型。 4 そのキャビテイ面がなめらかな凹凸形状を有し且つ
面粗さHmaxが5〜15μの範囲の梨地面上に硬質ク
ロームメッキ又はメッキ金属マトリックス中に四弗化エ
チレン樹脂等の合邦化炭素樹脂を含浸あるいは分散する
金属表面処理が施されていることを特徴とするインサー
ト樹脂封止用成形金型。 5 前記凹凸形状がHm ax /ピッチが1/10〜
1/200の範囲、アボット負荷曲線において基準長さ
0〜100%の範囲で傾斜が10μ/ 0.2 mm以
下の範囲として限定されることを特徴とする特許請求の
範囲第4項記載のインサート樹脂封止用成形金型。 6 前記梨地面が放電加工またはサンドブラスト加工に
よって形成されたことを特徴とする特許請求の範囲第4
項または第5項記載のインサート樹脂封止用成形金型。
[Claims] 1. A mold for insert resin sealing, characterized in that the cavity surface thereof has a smooth uneven shape and has a satin finish with a surface roughness Hmax in the range of 5 to 15μ. . 2 The uneven shape has a Hmax/pitch of 1/10 to
The insert resin seal according to claim 1, wherein the slope is limited to 10μ/0.2 mm or less in the range of 1/200% and the reference length in the range of 0 to 100% in the Abbott load curve. Molding mold for stopping. 3. The insert resin sealing mold according to claim 1 or 2, wherein the satin surface finish is formed by electric discharge machining or sand blasting. 4 Hard chrome plating on the pristine surface whose cavity surface has a smooth uneven shape and a surface roughness Hmax in the range of 5 to 15μ, or impregnation of a synthetic carbon resin such as tetrafluoroethylene resin in the plating metal matrix. Alternatively, a mold for insert resin sealing characterized by being subjected to a dispersive metal surface treatment. 5 The uneven shape has a Hmax/pitch of 1/10 to
The insert according to claim 4, characterized in that the slope is limited to 10 μ/0.2 mm or less in the range of 1/200 and in the range of 0 to 100% of the reference length in the Abbott load curve. Molding mold for resin sealing. 6. Claim 4, wherein the satin surface is formed by electric discharge machining or sandblasting.
The mold for insert resin sealing according to item 1 or item 5.
JP2937979A 1979-03-15 1979-03-15 Molding mold for insert resin sealing Expired JPS5831293B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2937979A JPS5831293B2 (en) 1979-03-15 1979-03-15 Molding mold for insert resin sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2937979A JPS5831293B2 (en) 1979-03-15 1979-03-15 Molding mold for insert resin sealing

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP6335984A Division JPS6074446A (en) 1984-04-02 1984-04-02 Manufacture of semiconductor plastic package
JP6335884A Division JPS6074457A (en) 1984-04-02 1984-04-02 Semiconductor plastic package

Publications (2)

Publication Number Publication Date
JPS55123441A JPS55123441A (en) 1980-09-22
JPS5831293B2 true JPS5831293B2 (en) 1983-07-05

Family

ID=12274501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2937979A Expired JPS5831293B2 (en) 1979-03-15 1979-03-15 Molding mold for insert resin sealing

Country Status (1)

Country Link
JP (1) JPS5831293B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012206521A (en) * 2006-11-22 2012-10-25 Apic Yamada Corp Resin molding die and processing method thereof

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06105725B2 (en) * 1985-12-16 1994-12-21 沖電気工業株式会社 Resin mold
JPH03169521A (en) * 1989-11-29 1991-07-23 Rohm Co Ltd Molding device for resin sealing
JPH04153010A (en) * 1990-10-18 1992-05-26 Sharp Corp Method for providing release layer on mold
JPH0479613U (en) * 1990-11-21 1992-07-10

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012206521A (en) * 2006-11-22 2012-10-25 Apic Yamada Corp Resin molding die and processing method thereof

Also Published As

Publication number Publication date
JPS55123441A (en) 1980-09-22

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