JPS5831275U - Inclined barrel plating device - Google Patents
Inclined barrel plating deviceInfo
- Publication number
- JPS5831275U JPS5831275U JP12605481U JP12605481U JPS5831275U JP S5831275 U JPS5831275 U JP S5831275U JP 12605481 U JP12605481 U JP 12605481U JP 12605481 U JP12605481 U JP 12605481U JP S5831275 U JPS5831275 U JP S5831275U
- Authority
- JP
- Japan
- Prior art keywords
- plating
- barrel plating
- plated
- cathode body
- plating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 title claims description 11
- 238000000151 deposition Methods 0.000 claims 1
- 238000009713 electroplating Methods 0.000 claims 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来構造になる傾斜型バレルめっき装置の主要
部構成を示す側断面図、第２図は前記装置に装着された
陰極体の一部を破断した正面図、第３図は本考案の一実
施例に係わる傾斜型バレルめつき装置用陰極体の正面図
、第４図は第３図のＩ−Ｉ’断面矢視図である。
なお、図中において１は傾斜型バレルめつき装置、２は
バレル、３．１４はバレル内に突出する陰極突起、４．
１１は陰極体、９は被めっき物、１０はめつき液、１２
は絶縁環体、１３は分割陰極体を示す。Fig. 1 is a side cross-sectional view showing the main components of a conventional inclined barrel plating device, Fig. 2 is a partially cutaway front view of the cathode body installed in the device, and Fig. 3 is the present invention. FIG. 4 is a front view of a cathode body for an inclined barrel plating apparatus according to an embodiment of the present invention, and is a sectional view taken along the line II' in FIG. 3. In the figure, 1 is an inclined barrel plating device, 2 is a barrel, 3.14 is a cathode projection protruding into the barrel, and 4.
11 is a cathode body, 9 is an object to be plated, 10 is a plating solution, 12
13 indicates an insulating ring body, and 13 indicates a divided cathode body.
Claims (1)
つき槽にめっき液と被めっき物を入れ該めっき液中に陽
極体を垂下浸漬し、前記めつき槽を回転させながら前記
波めっき物表面に電気めっき層を被着形成する装置にお
いて、陰極体は複数個に分割し相互が電気的に絶縁され
て環状に装着され、めっき中の被めっき物が接する前記
分割陰極体のみ回路接続して通電されるように構成した
ことを特徴とする傾斜型バレルめつき装置。A plating solution and the object to be plated are placed in a tilted barrel plating tank in which at least a part of the cathode body is exposed at the bottom, and the anode body is dipped downward into the plating solution, and while the plating tank is rotated, the surface of the wave-plated object is In an apparatus for depositing and forming an electroplating layer on a surface, the cathode body is divided into a plurality of parts, which are electrically insulated from each other and mounted in a ring shape, and only the divided cathode body that comes into contact with the object to be plated during plating is connected to the circuit. A tilted barrel plating device characterized in that it is configured to be energized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12605481U JPS5831275U (en) | 1981-08-26 | 1981-08-26 | Inclined barrel plating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12605481U JPS5831275U (en) | 1981-08-26 | 1981-08-26 | Inclined barrel plating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5831275U true JPS5831275U (en) | 1983-03-01 |
Family
ID=29919856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12605481U Pending JPS5831275U (en) | 1981-08-26 | 1981-08-26 | Inclined barrel plating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5831275U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348317A (en) * | 2005-06-13 | 2006-12-28 | Univ Fukuoka | Device and method for electroplating micro material |
| JP2016014171A (en) * | 2014-07-02 | 2016-01-28 | 株式会社イデヤ | Electroplating device |
| JP2021172881A (en) * | 2020-04-17 | 2021-11-01 | 孝志 上市 | Plating apparatus |
-
1981
- 1981-08-26 JP JP12605481U patent/JPS5831275U/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348317A (en) * | 2005-06-13 | 2006-12-28 | Univ Fukuoka | Device and method for electroplating micro material |
| JP4635221B2 (en) * | 2005-06-13 | 2011-02-23 | 学校法人福岡大学 | Electroplating apparatus and plating method for minute objects |
| JP2016014171A (en) * | 2014-07-02 | 2016-01-28 | 株式会社イデヤ | Electroplating device |
| JP2021172881A (en) * | 2020-04-17 | 2021-11-01 | 孝志 上市 | Plating apparatus |
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