JPS5831076A - Method and device for forming film by physical vapor deposition method - Google Patents

Abstract

PURPOSE:To obtain a uniform film efficiently even with relatively small objects such as powder, granules or the like by transmitting oscillations through a vessel disposed in a bell-jar on the object to be plated in said vessel and forming the film in such a state. CONSTITUTION:After the inside of a bell-jar A is evacuated 1 to a prescribed degree of vacuum, the gaseous Ar introduced therein is ionized by a high frequency or DC power source, whereby the object to be plated in a vessel 4 disposed in the bell-jar A is sputtered. During the sputtering, oscillations of desired frequencies and waveforms are generated from a waveform generator B and are transmitted to an oscillating body 3 on a sample table 2 via current leading-in terminals 7, electric wires 8 and electrodes 5, 5 and are further transmitted to the object in the vessel 4 via the vessel 4. As a result, the film is formed uniformly even on the extremely small object to be plated.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention provides a method for forming a film on the surface of a plated object by a physical vapor deposition method such as vacuum deposition, sputtering, or ion blating.

It is related to the device, and was designed to make it possible to efficiently form a uniform coating even when the object to be plated is relatively small, such as a single particle of powder or a small part. It is something.

Conventionally, the method of uniformly applying physical vapor deposition to the surface of small objects was to place a barrel inside Versier.

A method is known in which the barrel is rotated to move a small object, which is the object to be plated, inside the barrel, thereby changing the surface of the object to be plated with respect to the vapor deposition source.

ω Even if the rotation of the barrel is continuous, the movement of the object to be plated will be affected by the frictional force between them and the uneven fit.
It may become stationary even if slightly, which has an adverse effect on uniform film formation.

■Since the rotation of the barrel is driven through the Berscia wall,
Maintaining the degree of vacuum is a hassle.

Placing the drive source, such as a motor, inside the Versia not only unnecessarily damages the space inside the Versia, but also causes contamination by gas generated by the motor and damage to the performance of the motor itself, which is definitely not desirable.

It had such drawbacks.

The present invention is not limited to the above-mentioned points, and will be described below based on the embodiments shown in the accompanying drawings. In FIG. 1, reference numeral A indicates.

A part of the Versier part of the physical vapor deposition equipment such as vacuum evaporation, sputtering, ion blating, etc. is shown, and the exhaust hole 1 is shown.
The sample stage 2 is formed so as not to obstruct the exhaust system through the
, there is a vibrating body 3 fixed by adhesion, screwing, etc., or simply mounted, and this vibrating body 5 includes a stainless steel, tungsten, etc. A container 4 made of , titanium, tantalum, or the like is fixed by adhesive, screws, or the like. Here, as the sample stage 2.

It may be a specially-made one, but of course, one that already exists as part of the device may also be used.

Moreover, in order to prevent the vibration of the vibrating body 5 from being transmitted to unnecessary parts, a vibration absorbing material may be interposed at an appropriate location. Furthermore, the vibrating body 5 and the container 4 should be arranged at appropriate locations as long as the object to be plated does not jump out of the container 4 due to vibration.
It may be crushed in an appropriate direction, or a direction control mechanism for the container 4 may be added.

Nine different materials can be selected for the vibrating body 3. namely, quartz, Rochelle salt, and ADP.

Barium titanate porcelain, zirconate titanate.

Piezoelectric vibrator made of lead porcelain, niobic acid-based lead porcelain, etc.

These include magnetostrictive vibrators such as nickel, Al7Ero, and magnetostrictive ferrite porcelain, or electrodynamic vibrators that have the same principle as ordinary speakers. how to choose these
Further, the size and shape to be used are determined depending on the object to be plated, processing conditions, etc.

The direction of vibration of the vibrating body 3 is also set as appropriate, for example, perpendicular or horizontal to the container 4, but the vibration of the vibrating body 3 and the movement of the object to be plated placed in the container 4 always coincide. It's not something you have. That is, as shown enlarged in FIG. 2, in this embodiment, the container 4 has a flat plate shape except for the local part, and although the electrode (for example, a silver electrode) 5 is interposed therebetween, the container 4 is substantially flat. Since it is directly attached to the vibrating body 5, if the vibrating body 3 vibrates in the vertical direction in the drawing, the object to be plated also moves (jumps) in the vertical direction, but the container 4.

For example, if it has a regular or irregular uneven or wavy bottom surface and is solid, bowl-shaped, or hemispherical,
The direction of motion given to the object to be plated is different from the direction of vibration of the vibrating body 3.

This indicates that the movement of the object to be plated is not limited to the vicinity of the place where each object is placed, but the entire object to be plated may have movement as a flow. This also indicates that the structure of the vibrating body 5 and the container 4 may have an engineering structure, such as a parts feeder (for example, a linear feeder) that is normally used during product assembly. Note that there are cases where the vibrating body 3 itself does not vibrate uniformly.

Now, returning to FIG. 1, the electrical connection to the vibrating body 3 is as follows.
It is connected to an external waveform generator B via a current introduction terminal 7 provided on a 7-lunge 6 of the Versier wall. Here, the current introduction terminal 7 was provided on the 7 lange 6 because commercially available physical vapor deposition equipment is usually provided with several blind flanges, and the current introduction terminal 7 has the same standard as this blind 7 lange. Since the flange 6 with 7 is also commercially available, it is not possible to use the conventional device as is.
If a dedicated device is used, the electric wire 8 may be directly connected to the waveform generator B after a sufficient seal is provided on the Versier wall.

It is of course preferable that the electric wire 8 is coated with an insulator or Teflon to prevent short circuits, but in order to increase the versatility of the device, the vibrating body 3, container 4, etc. should be removable. Since it is preferable that the current introduction terminal 7 of the electric wire 8
Although soldering may be used for attachment to the connector, it is preferable that the connector be detachable using an appropriate connector or the like.

However, you can use a normal waveform generator B.
It may be preferable to provide a waveform sweep section.

That is, the vibration applied to the container 4 causes the magnitude of -t66 I&radius to vary in each part of the container 4, and the coating on the object to be plated may become non-uniform, so this is to prevent this.

As mentioned above, even in cases where the position of the object to be plated within the container 4 changes over time.

There's no harm in turning it on.

Next, the processing will be explained, but the physical vapor deposition processing itself does not require any special features compared to conventional methods. For example, to describe an example of sputtering, after creating a vacuum of 1×·10' Torr or higher in Vershear, argon gas is introduced to create a vacuum of 1×10 to 1×10'''5 Torr.
Create a vacuum of about r.

2 Ionize argon gas using a high frequency or DC power source and perform sputtering treatment. Of course.

There are no special features regarding other sputtering processes, vacuum evaporation, ion blating, etc.

Measures such as heating the body to be plated may also be employed as necessary.

The key point is to give motion to the object to be plated by vibrating the container during the treatment.

As mentioned above, the energy given and the direction of this motion are set appropriately, and for this purpose, when using the above device, the waveform generator B generates V, sine waves, square waves, triangular waves, etc. For example, the waveform control is performed such that the pressure is increased to about 50 to 1000 cm, and the frequency is tuned to the resonant frequency of the vibrating body 3 used (for example, 10 to 1'0000H2) and swept. As described above, the shape of the container 4 and the like also contribute.

Vibrate the container by any means.

When this is transmitted to the object to be plated, the movement of the object to be plated will continuously change the surface relative to the deposition source (or target). Therefore, a uniform coating can be formed on the surface of the object to be plated.

Especially when the object to be plated is relatively flat.

In such cases, if the containers are placed in a container with a flat bottom and the container is vibrated parallel to the bottom, the surface of the object to be plated relative to the evaporation source (or target) may not change.

There is a point.

<Example 1> Vapor deposition treatment was performed using a vacuum evaporation apparatus having a Versier section shown in FIG. The vibrating body 5 is made of barium titanate porcelain with a diameter of 50 mm and a thickness of 5 mm.

The bottom of container 4 is made of stainless steel and has a diameter of 1001B.

The bottom surface was given a slight bowl shape. In the container 4, 2 to 2 glass particles each having a diameter of about 0.4) IIB are added.
Lay them in three layers, and place them so that the surface is located 200 degrees below the evaporation source (a conical basket-shaped tungsten wire containing copper balls).
Copper was deposited at rr.

At this time, the vibration direction of the vibrator was vertical, and the vibration applied to the container 4 was boosted to 300 V to sweep the second son wave, thereby changing the nodes and antinodes of the standing wave generated in the container 4 over time. by this.

After the set maximum splashing amount of glass particles of 51 ml was obtained, a copper coating was uniformly formed on the surface of each glass particle after about 10 seconds of vapor deposition, and no undeposited areas were observed.

<Example 2> The shoes shown in FIG. 1 and having a nine-sided part were subjected to sputtering treatment using a talling device (200 W, high frequency power supply). The vibrating body 3 and container 4 were the same as in Example 1. Pour alumina powder with an average particle size of α05wk into container 4 to a thickness of 3 degrees, and place it under the target (copper) 5.
After installation so that the surface was located at 01s, the degree of vacuum was once set to 5 x 10-6 Torr, argon gas was introduced, and sputtering treatment was performed at 3 x 10 Torr.

At this time, the vibration applied to the container 4 was increased to 600V.
After approximately 30 minutes of sputtering treatment using the square wave of KH2 (F16), a copper film was uniformly formed on the surface of each alumina powder, and the influence of the standing wave generated in the container 4 was virtually not observed. Ta.

As stated above, according to the present invention, it is possible to efficiently form a uniform coating even on extremely small objects to be plated. It can be applied to a variety of industrial materials such as surface treatment of parts, bolts, nuts, etc., surface treatment of pigments, S coating, and surface treatment of powder for sintered materials.

[Brief explanation of drawings]

FIG. 1 is a longitudinal cross-sectional view of essential parts showing an embodiment of the device of the present invention;
FIG. 2 is an enlarged view of the vibrating body portion of FIG. 1. 3... Vibrating body, 4... Container,
5... Electrode. 6... Flange, 7... Current introduction terminal, A... Versier part. B...Waveform generator patent applicant Pentel Co., Ltd.

Claims (3)

[Claims] (1) In a method of forming a coating on the object to be plated by a physical vapor deposition method while moving the object to be plated, the vibration is applied to the object to be plated inside the container by vibrating a specific container placed in the persian. physical vaporization, which is characterized by the formation of a film in this state. Film formation method by including. death〕 (2) A container containing the object to be plated is fixed, an electromagnetic vibrating body is placed inside the Persia, and a hole and a waveform generator for applying a driving waveform to the vibrating body are placed outside the Persia. physical vapor deposition equipment. (3) The physics according to claim 2, characterized in that the electrical connection between the vibrating body and the □ waveform generator is made through a current introduction terminal provided on a flange of the Persian wall. Targeted vapor deposition equipment 0