JPS5830732B2 - Method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component - Google Patents
Method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic componentInfo
- Publication number
- JPS5830732B2 JPS5830732B2 JP6405676A JP6405676A JPS5830732B2 JP S5830732 B2 JPS5830732 B2 JP S5830732B2 JP 6405676 A JP6405676 A JP 6405676A JP 6405676 A JP6405676 A JP 6405676A JP S5830732 B2 JPS5830732 B2 JP S5830732B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- face
- paste
- printing
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Printing Methods (AREA)
- Resistance Heating (AREA)
- Ceramic Capacitors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は、メタライズ層又は絶縁層をセラミック電子部
品の端面に印刷する方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for printing metallization or insulating layers on the end faces of ceramic electronic components.
例えば第1図に示すようなリング状のアルミナセラミッ
クなどの電子部品の端面全体にメタライズ層又は絶縁層
を施さなければならないような場合がある。For example, there are cases where it is necessary to apply a metallized layer or an insulating layer to the entire end face of an electronic component such as a ring-shaped alumina ceramic as shown in FIG.
このようなメタライズ層又は絶縁層を施すにはスクリー
ン印刷では極めて困難であったので、作業者が手作業で
メタライズペースト又は絶縁ペーストをたん念に塗布し
ていた。Since it is extremely difficult to apply such a metallized layer or insulating layer by screen printing, workers have to carefully apply the metallized paste or insulating paste by hand.
このため、手間がかかる上に塗られたメタライズペース
ト層又は絶縁ペースト層の厚さが不均一であることおよ
び第2図に示すように塗られたメタライズペースト又は
絶縁ペーストが過剰になりやすく塗布された端面よりた
れてしまうという欠点があった。For this reason, it is time-consuming and the thickness of the applied metallizing paste layer or insulating paste layer is uneven, and as shown in Figure 2, the applied metallizing paste or insulating paste tends to be excessive. It has the disadvantage that it sag from the end surface.
本発明のメタライズ層又は絶縁層をセラミック電子部品
の端面に印刷する方法は、従来法に見られた前記の欠点
を解消したものでスクリーンにその表面よりメタライズ
ペースト又は絶縁ペーストを塗布し、スクリーンの裏面
ににじみ出た余分のペーストを除去しついでこのスクリ
ーンをセラミック電子部品の端面におしつける方法であ
る。The method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component according to the present invention solves the above-mentioned drawbacks of the conventional method.The method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component eliminates the above-mentioned drawbacks found in the conventional method. This method involves removing excess paste that has oozed out from the back surface and then applying this screen to the end surface of the ceramic electronic component.
本発明を図示の実施例にもとづいて、さらに詳細に説明
する。The present invention will be explained in more detail based on illustrated embodiments.
まず、第3図に示すように、ステンレスやシルクなどの
繊維1でできたスクリーンにローラーまたはドクターブ
レードなどのペースト塗布具でメタライズペースト又は
絶縁ペーストを塗布する。First, as shown in FIG. 3, metallizing paste or insulating paste is applied to a screen made of fiber 1 such as stainless steel or silk using a paste applicator such as a roller or a doctor blade.
この際ペースト2はスクリーンの裏面にもにじみ出る。At this time, paste 2 also oozes out to the back side of the screen.
次に、第4図に示すように、このスクリーンの裏面をド
クターブレードなどでかきとることにより、にじみ出た
余分のペーストを除去する。Next, as shown in FIG. 4, the back side of this screen is scraped off with a doctor blade or the like to remove the excess paste that has oozed out.
ついで、このスクリーンを電子部品の端面におしつげる
ことにより、第5図に示すように、電子部品の端面3に
ペースト2が加不足なく印刷される。Then, by applying this screen to the end surface of the electronic component, as shown in FIG. 5, the paste 2 is evenly printed on the end surface 3 of the electronic component.
印刷されたものを焼成することにより、この電子部品は
端面にメタライズ層又は絶縁層を有するものとなる。By firing the printed material, this electronic component has a metallized layer or an insulating layer on the end surface.
本発明は以上のように構成されるので、端面をメタライ
ズしたリガラスなどの絶縁層を塗布するほか、端面にオ
ーミック電極を付与することもできる。Since the present invention is configured as described above, in addition to coating the end face with an insulating layer such as metallized glass, it is also possible to provide an ohmic electrode on the end face.
すなわち例えば第6図に示すような特開昭49−114
130号公報記載のハニカム構造を有する正特性発熱素
子の格子面4に電極を付与する方法として使用してもよ
い。That is, for example, as shown in FIG.
The present invention may also be used as a method for providing electrodes on the lattice surface 4 of a positive temperature heating element having a honeycomb structure as described in Japanese Patent No. 130.
この場合、余分のペーストが除去されたスクリーンを単
にハニカム体の格子面4に押しつけるだけでなく、押し
つげたスクリーンの上からスキージ等でこすることによ
りすべての格子面により均一に印刷することができる。In this case, in addition to simply pressing the screen from which excess paste has been removed onto the lattice surface 4 of the honeycomb body, it is also possible to print more uniformly on all lattice surfaces by rubbing the pressed screen with a squeegee or the like. can.
なお、正特性発熱素子に付与する電極用ペーストは、印
刷後焼成することにより、正特性発熱素子とオーミック
接触をするものでなげればならない。Note that the electrode paste applied to the PTC heating element must be baked after printing so as to come into ohmic contact with the PTC heating element.
本発明によれば電子部品の端面にメタライズペーストな
どを簡単にかつ加不足なく印刷できるので、電子部品の
信頼性が向上するなど、本発明はこの種産業の発展に寄
与するところが太きい。According to the present invention, metallized paste or the like can be easily and accurately printed on the end face of electronic components, so the reliability of electronic components is improved, and the present invention greatly contributes to the development of this type of industry.
第1図は端面にメタライズ層を施す必要のある電子部品
の例の斜視図、第2図は手で印刷された端面の拡大説明
図、第3図および第4図は本発明の工程説明図、第5図
は本発明による方法で印刷された端面の拡大説明図、お
よび第6図は本発明の方法を適用しうる別の電子部品の
斜視図である。
1・・・・・・スクリーンの繊維、2・・・・・・印刷
ペースト。Fig. 1 is a perspective view of an example of an electronic component that requires a metallized layer to be applied to the end face, Fig. 2 is an enlarged explanatory view of a hand-printed end face, and Figs. 3 and 4 are explanatory diagrams of the process of the present invention. , FIG. 5 is an enlarged explanatory view of an end face printed by the method according to the present invention, and FIG. 6 is a perspective view of another electronic component to which the method of the present invention can be applied. 1...Screen fiber, 2...Printing paste.
Claims (1)
は絶縁ペーストを塗布し、スクリーンの裏面ににじみ出
た余分のペーストを除去し、ついでこのスクリーンをセ
ラミック電子部品の端面におしつげることを特徴とする
メタライズ層又は絶縁層をセラミック電子部品の端面に
印刷する方法。1. A metallized layer or insulating paste, which is characterized by applying metallizing paste or insulating paste to the screen from its surface, removing the excess paste oozing out from the back side of the screen, and then applying this screen to the end surface of a ceramic electronic component. A method of printing an insulating layer on the end face of a ceramic electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6405676A JPS5830732B2 (en) | 1976-06-03 | 1976-06-03 | Method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6405676A JPS5830732B2 (en) | 1976-06-03 | 1976-06-03 | Method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS52147764A JPS52147764A (en) | 1977-12-08 |
JPS5830732B2 true JPS5830732B2 (en) | 1983-07-01 |
Family
ID=13247043
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6405676A Expired JPS5830732B2 (en) | 1976-06-03 | 1976-06-03 | Method of printing a metallized layer or an insulating layer on the end face of a ceramic electronic component |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5830732B2 (en) |
-
1976
- 1976-06-03 JP JP6405676A patent/JPS5830732B2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS52147764A (en) | 1977-12-08 |
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