JPS5830079A - Microconnector for mounting superconductive element - Google Patents
Microconnector for mounting superconductive elementInfo
- Publication number
- JPS5830079A JPS5830079A JP56127407A JP12740781A JPS5830079A JP S5830079 A JPS5830079 A JP S5830079A JP 56127407 A JP56127407 A JP 56127407A JP 12740781 A JP12740781 A JP 12740781A JP S5830079 A JPS5830079 A JP S5830079A
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- module board
- foot
- wiring module
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Multi-Conductor Connections (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は、極低温で使用する超伝導コンピュータの超伝
導素子（チップ）と配線上ジュール基板とを接続するマ
イクロコネクタに関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a microconnector for connecting a superconducting element (chip) of a superconducting computer used at extremely low temperatures and a Joule board on wiring.
第１図に従来の超伝導素子実装用マイクロコネクタの断
面図を示す。第１図において超伝導素子（チップ）１か
らの配線２はカード３．フットと呼ばれる基板４上を通
シ、＃７ツト４上のマイクロビン５に接続されている。FIG. 1 shows a cross-sectional view of a conventional microconnector for mounting superconducting elements. In FIG. 1, wiring 2 from a superconducting element (chip) 1 is connected to a card 3. It passes through a substrate 4 called a foot and is connected to a microbin 5 on #7 foot 4.
マイクロビン５は１、ボード６中に慶大形成されたマイ
クロソケット部７中の水銀球８を介して配線モジュール
基板９上のマイクロビン５′と電気的に接続され、さら
に配線モジュール基板９上の配線２′に接続されている
。The microbin 5 is electrically connected to the microbin 5' on the wiring module board 9 via the mercury bulb 8 in the microsocket part 7 formed in the board 6, and is further connected to the microbin 5' on the wiring module board 9. It is connected to the wiring 2'.
第２図は該マイクロビン５，５′の外観図を、第３図は
骸マイクロコネクタの全体図を示すものである。マイク
ロビン−列には数１０個のビンが高精度にとルつけられ
、該マイク四コネクタ全体で数１０００個のマイクロビ
ンが必要である。を九、該マイクロビン５．５′は第１
図に示すようにそれぞれ７ツト４上及び配線モジュール
基板？上にはんだ付けされているため、第２図のような
台座のついた形状にする必要があシ、このよう表彰状の
微小なビンを製作するのが極めて困難で価格も高いとい
う欠点があった。また個々のマイクロビン５．５′の製
作が困難であるだけでなく該マイクロビン５，５′をフ
ット４上や配線モジュール基板９上に高精度にはんだで
固定するのも極めて困難で、経済性、生産性の点で問題
があった。FIG. 2 shows an external view of the microbins 5, 5', and FIG. 3 shows an overall view of the skeleton microconnector. Several tens of micro-bins are attached to the micro-bin row with high precision, and several thousand micro-bins are required for the entire four-microphone connector. 9, the microbin 5.5' is the first
As shown in the figure, 7 and 4 top and wiring module board respectively? Since it is soldered on the top, it is necessary to make it into a shape with a pedestal as shown in Figure 2, which has the disadvantage that it is extremely difficult to make such a small bottle for the certificate and it is expensive. . Furthermore, not only is it difficult to manufacture individual microbins 5.5', but also it is extremely difficult to fix the microbins 5, 5' onto the foot 4 or the wiring module board 9 with high precision by soldering, making it economical. There were problems in terms of performance and productivity.
本発明は、これらの欠点を除去するために第１図中の！
イクロビン５．５′に代わシに電気導体からなるワイヤ
を用い、またフット及び配線モジュール基板にそれぞれ
相対向して貫通穴を形成し、該ワイヤを該貫通穴にそれ
ぞれ貫挿して固定し、該ワイヤによシ該７ツト上及び該
配線モジュール基板上の両配線の接続を行なうようにし
たものであり、以下本発明の実施例を図面について説明
する。The present invention aims to eliminate these drawbacks as shown in FIG.
A wire made of an electrical conductor is used instead of the Icrobin 5.5', through-holes are formed facing each other in the foot and the wiring module board, and the wires are inserted into the through-holes and fixed. Both the wiring on the shaft and the wiring module board are connected by wires, and embodiments of the present invention will be described below with reference to the drawings.
第４図は本発明の一実施例であって、１は超伝導素子（
チップ）、２，２′は配線、３はカード、４はフット、
６はボード、７はマイクロソケット部、８は水銀球、９
は配線モジュール基板、１０゜１０′は貫通穴、１１．
１１’はワイヤである。FIG. 4 shows an embodiment of the present invention, in which 1 is a superconducting element (
chip), 2 and 2' are wiring, 3 is card, 4 is foot,
6 is a board, 7 is a micro socket part, 8 is a mercury bulb, 9
is the wiring module board, 10°10' is the through hole, 11.
11' is a wire.
本構成においては、フット４、配線モジュール基板９に
形成された貫通穴１０，１０’に導通ワイヤ１１゜１１
’がそれぞれはめζまれ、はんだで該フット４および骸
配線モジュール基板９に固定されている。In this configuration, the conductive wires 11 and 11 are inserted into the through holes 10 and 10' formed in the foot 4 and the wiring module board 9.
' are respectively fitted and fixed to the foot 4 and the skeleton wiring module board 9 with solder.
電気信号は該チップ１から配線２を通シワイヤ１１゜水
銀球８．ワイヤ１１′を介して配線モジュール基板上の
配線２′へ伝達される。The electrical signal is passed from the chip 1 through a wire 11 and a mercury bulb 8. The signal is transmitted to the wiring 2' on the wiring module board via the wire 11'.
本構成のマイクロコネクタにおいては、第２図に示す形
状の製作に困難性をともなうマイクロビン５．５′が不
要であシ、しかも、フット４及び配線モジュール基板９
のそれぞれの上へ高精度に位置決めしてはんだで固定す
る必要もなく該接続部の製作が極めて容易になる。The micro connector of this configuration does not require the micro bin 5.5' which is difficult to manufacture in the shape shown in FIG.
It is not necessary to position the connectors with high accuracy and fix them with solder on each of the connectors, making it extremely easy to manufacture the connectors.
以上説明したように、従来のマイクロビンを使用したコ
ネクタに比べてマイクロビンの代シに、 −ワイヤを使
用することによシ製作が容易で、貫通穴によシ位置決め
を行なうため極めて容易に高精度位置決めができる等の
利点があシ、超伝導素子実装用マイクロコネクタの製作
を容易かつ安価に行なうことができる。As explained above, compared to the conventional connector using a microbin, the connector is easier to manufacture by using a wire instead of a microbin, and it is extremely easy to position the connector by using a through hole. It has advantages such as high precision positioning, and can easily and inexpensively manufacture a micro connector for mounting superconducting elements.
第１図は、従来のマイクロ；ネクタの断面図、第２図は
マイクロビンの外観図、第６図は従来のマイクロコネク
タの全体図、第４図は本発明の実施例の断面図である。
１・・・超伝導素子（チップ）、２，２Ｉ ・・・配線
、５・・・カード、４・・・フット、５，５’ −・・
マイクロビン、６・・・ボード、７・・・マイクロソケ
ット部、８・・・水銀球、９・・・配線モジュール基板
、１０．１０’・・・貫通穴、１１．１１’・・・ワイ
ヤ。
特許出願人 日本電信電話公社
代理人 弁理士玉蟲久五部 （外６名）第１図
第２図Fig. 1 is a sectional view of a conventional micro connector, Fig. 2 is an external view of a micro bottle, Fig. 6 is an overall view of a conventional micro connector, and Fig. 4 is a sectional view of an embodiment of the present invention. . 1... Superconducting element (chip), 2,2I... Wiring, 5... Card, 4... Foot, 5,5' -...
Micro bottle, 6... Board, 7... Micro socket part, 8... Mercury bulb, 9... Wiring module board, 10.10'... Through hole, 11.11'... Wire . Patent applicant Nippon Telegraph and Telephone Public Corporation agent Patent attorney Gobe Tamamushi (6 others) Figure 1 Figure 2
Claims (1)
イクロコネクタにおいて、フット及び配線モジュール基
板に形成した貫通穴に電気導体からなるワイヤをそれぞ
れ貫挿し、該超伝導素子（チップ）から皺フットへ至る
配線および該配線モジュール基板上の配線と、該ワイヤ
とをそれぞれはんだ付すして固定；接続することによシ
、該超伝導素子（チップ）からの配線と骸配線モジュー
ル基板上の配線との電気的接続を行うことを特徴とする
超伝導素子実装用マイクロコネクタ。In a micro connector that connects a superconducting element (chip) and a wiring module, wires made of an electrical conductor are inserted through through holes formed in the foot and the wiring module board, respectively, and lead from the superconducting element (chip) to the wrinkled foot. The wiring and the wiring on the wiring module board are fixed by soldering, respectively; by connecting the wiring, the wiring from the superconducting element (chip) and the wiring on the skeleton wiring module board are connected. A micro connector for mounting superconducting elements, which is characterized by its ability to perform directional connections.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56127407A JPS5830079A (en) | 1981-08-14 | 1981-08-14 | Microconnector for mounting superconductive element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56127407A JPS5830079A (en) | 1981-08-14 | 1981-08-14 | Microconnector for mounting superconductive element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5830079A true JPS5830079A (en) | 1983-02-22 |
| JPS6117342B2 JPS6117342B2 (en) | 1986-05-07 |
Family
ID=14959211
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56127407A Granted JPS5830079A (en) | 1981-08-14 | 1981-08-14 | Microconnector for mounting superconductive element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5830079A (en) |
-
1981
- 1981-08-14 JP JP56127407A patent/JPS5830079A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6117342B2 (en) | 1986-05-07 |
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