JPS5828341A - Bonding method for dielectric film - Google Patents

Abstract

PURPOSE:To obtain the smooth bonded surface of dielectric films of multilayer structure by providing a plurality of buffer layers on the back surface of the superposed part to be bonded of the films when bonding the films and applying supersonic energy and pressure to the layers from a supersonic horn. CONSTITUTION:When dielectric films 30, 30' of multilayer structure, each of which has a supporting layer 20, a resistance layer 31 and a recording layer 22 are bonded, the two films 30, 30' to be bonded and a plurality of buffer layers 25 are held between a supersonic horn 1 and a lower bearer 3. Supersonic energy and pressure are applied to them from the horn 1, thereby bonding them. In this manner, the supersonic vibration to be applied from the horn 1 is continuously applied to the films to be bonded, thereby obtaining the smooth bonded surface. A cellophane tape, polyester film, polypropylene film or the like is adapted as a buffer material 25.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for joining dielectric films, particularly belt-shaped dielectric films used in the field of transfer electrostatic recording, and more specifically to a method for joining dielectrics having a multilayer structure. It is.

Conventionally, in the ultrasonic welding of electric films, the films to be welded are stacked between an ultrasonic generating horn l and a lower pedestal 30, as shown in FIG.

The bonding method was performed by applying pressure while applying ultrasonic waves, and by applying heat due to vibration. However, Jin's method has the disadvantage that it is not possible to smoothen the junction in contact with the horn. Therefore, in the patent application filed on the same day, the present inventors proposed a buffer layer 1 as shown in Figure llI2.
A method was proposed in which a buffer layer is provided at the 0t-joint portion and the buffer layer is placed on the lower pedestal.

However, as shown in FIG.
When joining films with surfaces made of different materials, such as a belt-shaped electrostatic recording film composed of a recording layer 22, simply providing a buffer layer as shown in Fig. 2 does not make the joining surface smooth. To become a person is to separate.

An object of the present invention is to provide a method for smoothing the joint surface of a film made of a plurality of materials having different softening points and other materials, as shown in FIG.

An object of the present invention is to provide a buffer layer at the junction 8f+ of the dielectric films to be bonded in a method for bonding dielectric films formed of a plurality of film-like substances having different properties such as softening points, This can be achieved by a bonding method in which the parts are placed on a lower pedestal and ultrasonic waves are applied while applying no pressure using an ultrasonic generating horn.

Specifically, as shown in FIG. 4, the method of the present invention is a method of bonding an electrostatic recording film comprising a recording layer, a low resistance layer, and a recording layer using ultrasonic waves. superimposed recording bodies 30 and 30', a buffer layer or a plurality of buffer layers and a lower pedestal 3t disposed on the opposite side of the ultrasonic horn through the recording bodies 30 and 30';
-It is characterized by arranging it in the above order and applying pressure at the same time as applying ultrasonic waves.

In the present invention, by providing a plurality of buffer layers on the back surfaces of stacked recording bodies to be joined, the ultrasonic vibration is sustained to smooth the joined part of the part facing the ultrasonic hole. .

In the case where this buffer layer is not provided, in the conventional method, the joint portion becomes as shown in FIG. 5, and a step is generated. This level difference reaches about 30 inches [K] relative to the thickness of the film. Therefore, in applications that require smooth bonding (for example, processes using cleaning materials such as blades, such as electrostatic recording media or electrophotographic recording media), there are significant restrictions on the percentage usage. The method of the present invention improves this drawback, and the step difference on the bonding surface can be reduced by, for example, 100 mm.
In the case of a recording medium with a thickness of s, it is possible to suppress the thickness by several μ[K], and it can be used for all purposes.

As the buffer layer used in the present invention, for example, a material such as cellophane tape having an adhesive layer on the base can be used, with the adhesive layer surface being placed in contact with the joint portion. The effect remains the same whether or not there is an adhesive layer.

Although this cushioning material is effective even when used alone, the inventors of the present invention have found that by using multiple sheets of cushioning material, they can be used in combination with pages. It has been found that the level difference between the surface of the recording medium and the horn becomes smaller.

It has also been confirmed that the method of the present invention always has the same effect on other laminated films, such as a photoconductive film having a paste layer, a conductive layer, a photoconductive layer, and an insulating layer. It was done.

As the cushioning material used here, in addition to Shichiro 7A/TEIG, any material with good thermal conductivity such as polyester film, polyglobylene film, polyimide film, etc. is effective.

Example Using an ultrasonic horn with an active diameter of 20 mm and a longitudinal distance of 300 mm, a reusable transfer recording method was performed in which the support layer and the recording layer were made of polyethylene terephthalate film, and the layer was made of acrylic resin. For the belt-shaped dielectric (thickness 100μ) used, in the overlap part': 2 ms, horn pressing pressure 2 to 4/-, ultrasound 2KHz.

I tried joining by adding 2Kw. As a buffer layer, commercially available cellophane tape (base film, cellophane 50μ,
A tacky adhesive layer (30μ) was used.

First, when one piece of cellophane tape was used, the height difference at the bottom of the joint surface was improved to 10μ. Next, when two pieces of cellophane tape were used, as shown in Fig. 6, the grooves had three steps, making it possible to obtain a smoother FjjJ.

On the other hand, when no cushioning material is used, the height difference in the groove is 3.
The difference in level was significantly reduced by the method of the present invention, making it possible to use the blade as a cleaning member in a transfer lid electrostatic system.

[Brief explanation of drawings]

FIG. 1 is an explanation of the conventional ultrasonic bonding method IE1. Fig. II2 is an explanatory diagram of the improved ultrasonic bonding method, Fig. 3 is a cross-sectional view of a multilayer structure dielectric, Fig. 4ii11 is an explanatory diagram of the method of the present invention, and Fig. 5 is a 0@ direction view of the bonding surface according to the conventional method. FIG. 6 is a sectional view of the bonding 11c1M made by the method of the present invention. Codes in the figure: 1... Ultrasonic horn: 2... Film: 3 **-Adhesive layer; 30.30'... Recording body. Figure 1 1211

Claims (1)

[Claims] 1. A dielectric film formed by laminating a plurality of members with different compositions using an ultrasonic bonding device consisting of an ultrasonic horn and a lower pedestal that receives the pressure of the ultrasonic horn. In the method of joining. The parts of the dielectric film to be joined are overlapped, a buffer layer is provided on this overlapped part, and ultrasonic energy and pressure are applied using an ultrasonic horn between the lower pedestals 30 with the buffer layer side facing down. A method for joining dielectric films with V* mold. λ The joining method according to claim 1, characterized in that a plurality of buffer materials are used.