JPS5828338A - Bonding method for flexible resin film - Google Patents

Abstract

PURPOSE:To prevent toner from clogging in the groove portion formed on the surfaces to be bonded of flexible synthetic resin films in a working cycle by filling an insulating synthetic resin filler in the groove when the films are bonded with supersonic wave, thereby smoothening the groove portion. CONSTITUTION:The portions to be bonded of synthetic resin recording films 2 are superposed, are then set on a bearing bed 3, a supersonic wave output is applied while a supersonic horn 1 is contacted with the films 2, the vibration energy of the horn 1 is absorbed to the films 2, the films 2 are self-heated by the friction of molecules and are bonded. Subsequently, an insulating synthetic resin filler 7 is prepared in the vicinity of the bonding portions of the films 2, a blade 6 is slidably rubbed with the surfaces of the films 2 to bury the fine grooves of the bonding portions with the filler 7, which is then hardened. The filler 7 preferably includes epoxy resin, polyester resin or the like.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for joining flexible resin films, and more particularly to smoothing the joint portion of a synthetic resin film 11itc synthetic resin film body.

To make an endless belt by joining together the ends of a recording medium (hereinafter abbreviated as recording medium) in which a photosensitive resin or dielectric resin is coated on a belt-shaped mylar film, etc. directly or through a resistive layer.a A common KTI ultrasonic welding method is used.

This process is explained using Figure 11 and Figure 2.
When the recording bodies 2 are stacked one on top of the other and set on the pedestal 3, and ultrasonic power is applied while the ultrasonic horn 1 is in contact with the recording bodies, the ultrasonic horn vibrates and the recording bodies absorb the energy. The Sifilm self-heats and welds due to molecular friction. Depending on the degree of ultrasonic output and pressure, the overlapping O welding state may be affected, and when the ultrasonic output and pressure are insufficient, F
There is a step in the i-seam (Fig. 2), and when using the appropriate surface power and pressure, a generally good seam can be obtained (Fig. 2 (parent). However, in the latter case, the seam can also be enlarged. As shown in Figure 2), there are small surface grooves (width approximately 20 μm,
depth of 10-20*m).

In the recording medium manufactured in this way, a latent image is formed by light expansion in the case of a photosensitive recording medium, or by electric discharge in the case of a dielectric material, and the image is made visible with toner of opposite polarity to the latent image. Transfer it to paper to obtain an image. The toner remaining on the recording medium is cleaned and used again. In the former latent image format, even if some toner remains, there is no problem in the subsequent processing process, but in the latter electric writing method, thin bottle electrodes 4 are lined up in parallel as shown in Figure 3. A voltage is applied to the multi-needle electrode and corona discharge is performed to form a latent image, so in order to stably create this latent image, the gap between the bottle electrode and the dielectric surface is 5~
20μml! The cleaning of the recording medium must be thorough because if residual toner adheres to these gaps, stable discharge will not occur. However, in the case where the cleaning method '5 is used as the cleaning method as shown in FIG. (Figure 4 (B))
In the next image forming cycle, the toner adheres to the bottle electrode and causes discharge failure. That is, the presence of toner prevents sufficient discharge, resulting in discharge failure or discharge stoppage, which causes pit omission in that area. m2WJ busy)
Even very small particles such as toner powder (less than a few microns)
is observed to be clogged.

As mentioned above, it is difficult to properly maintain the ultrasonic welding conditions when joining recording belts made of synthetic resin films (1). It was not possible to prevent toner from entering the groove.

Accordingly, an object of the present invention is to provide an ultrasonic bonding method for synthetic resin film recording belts that does not generate minute grooves that would cause clogging.

The object of the present invention is achieved by filling grooves formed in the ultrasonic bonding surface with an insulating synthetic resin filler in a method for ultrasonic bonding of flexible synthetic resin films.

In the method of the present invention, a synthetic resin filler is prepared near the seam of the synthetic resin film recording belt after ultrasonic bonding (Fig. 5 (A)), and the film surface is rubbed with a blade to bond 1. Fill the micro grooves in the area with filler (Fig. 5 (8)
), the filling material fed into this groove is later hardened. As the synthetic resin filler, resins that provide a hard surface such as hardening type, reaction type, and solvent type are used.

According to the method of the present invention, it is possible to smooth out the minute grooves (steps) at the seam that occur in the conventional ultrasonic bonding method of synthetic resin film recording bodies, and to prevent the toner from clogging the minute grooves during the image forming cycle. Since it is possible to prevent toner from adhering to the electrode surface of the multi-needle electrode, it is possible to prevent pit dropouts caused by toner adhering to the electrode surface even during long-term image forming cycles. 7. A highly reliable information processing device can be provided.

Further, as the filler used in the method of the present invention, any filler can be used as long as it forms an insulating film after application.
Examples include reactive resins such as cyanoacrylates, solvent-based resins that are used by dissolving them in a solvent such as ester, and water-dispersed resins such as I-rimer emulsion. The electrical resistance of the filler used in the present invention is 1×10+oΩ1 or more. or,
As a method for filling the filler powder, in addition to the exemplified method of scraping after application using a blade or the like, any commonly used application method such as spray coating 1, for example, a method using a brush may be used.

Fillers such as solvent-based resins (for example, the product name Cemedine 3)
000), the filler has a low viscosity and exhibits insulation properties after curing.

Furthermore, the method of filling the microgrooves at the film seams according to the present invention is not limited to the above-mentioned recording medium, but can also be applied to any general flexible synthetic resin film, etc. to obtain the same effect. Needless to say.

Example 1 A resistance layer of 1θμ and a 6μ polyester film were pasted on 100μ Mylar. 10% of 4-lyester resin (trade name Pyro Y200, manufactured by Duin Co., Ltd.) was used as a filler resin to bond the recording film. A methylene chloride solution was applied to the seam using a brush wheel. Next, this was filled into the 0 groove with a brake P made of urethane and scraped off. In the electrostatic recording material having a seam portion obtained after drying the solvent, it is possible to almost completely eliminate the grooves at the joint portion of 10 to 20μ that occur in the case of the conventional 1&I method, and the final The level difference was less than 1μ. Using the electrostatic recording material prepared in this way, latent formation, development,
When the original cycle of transfer and cleaning was performed, it took 30,000 cycles before pit drop occurred. On the other hand, in the case of using a recording medium having a seam according to the conventional method, pit drop occurred after 10,000 cycles.

[Brief explanation of the drawing]

Figure 1 is a diagram for explaining the conventional ultrasonic welding method. The figure is a diagram for explaining the state in which the groove of the seam is filled by the method of the electrical invention. Reference numerals in the figure: 1... Ultrasonic horn 2... Recording film 3... pedestal 4...Bin electrode 5...
・Cleaning blade 6... Shire P7... Filler 8... Toner. Fig. 1 (A) (B) ζ;] To 2=:=ko (C) Fig. 3 Fig. 510 Horizontal flute 4 Fig. IN5 Fig. (B) 8

Claims (1)

[Claims] 1. A method for ultrasonic bonding of a removable synthetic resin film, characterized in that the grooves formed on the ultrasonic bonding surface are filled with an insulating metal resin filler. How to join fairy ilms. λ A patent characterized in that the flexible synthetic resin film is a flexible resin film alone or a composite formed by supporting or coating at least one dielectric substance on the flexible resin film. A method for joining flexible resin films according to claim 1.