JPS5827977A - Metal plating method on linear body - Google Patents
Metal plating method on linear bodyInfo
- Publication number
- JPS5827977A JPS5827977A JP56126502A JP12650281A JPS5827977A JP S5827977 A JPS5827977 A JP S5827977A JP 56126502 A JP56126502 A JP 56126502A JP 12650281 A JP12650281 A JP 12650281A JP S5827977 A JPS5827977 A JP S5827977A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- tube
- temp
- linear body
- heating tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 238000007747 plating Methods 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title claims description 6
- 238000010438 heat treatment Methods 0.000 claims abstract description 30
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 9
- 238000002844 melting Methods 0.000 claims abstract description 8
- 230000008018 melting Effects 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 3
- 229910052738 indium Inorganic materials 0.000 claims abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 239000011651 chromium Substances 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 239000002355 dual-layer Substances 0.000 claims 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 239000013307 optical fiber Substances 0.000 abstract description 11
- 239000000155 melt Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 239000000835 fiber Substances 0.000 abstract 1
- -1 aluminum Chemical compound 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Optical Fibers, Optical Fiber Cores, And Optical Fiber Bundles (AREA)
- Surface Treatment Of Glass Fibres Or Filaments (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は真空蒸着による線状体の金属メッキ方法に関す
る。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of metal plating a linear body by vacuum deposition.
１−
光ファイバに金属メッキを施す手段として、１）電気メ
ッキ（無電解メッキ、電解メッキ）、１１）ディッピン
グ、１１１）真空メッキ等が有力であるが、夫々は次の
ような欠点を有している。1- As a means of applying metal plating to optical fibers, 1) electroplating (electroless plating, electrolytic plating), 11) dipping, 111) vacuum plating, etc. are effective, but each has the following drawbacks. ing.
即ち、１）においては、光ファイバが水分にさらされる
ので伝送ロスが増す、１１）においては、被覆膜が偏肉
し、ひび割れが生ずる、そし、て最後に１１１）の場合
、膜厚が充分な厚さにならず、従ってメッキ速度を上げ
ることができず、また蒸発金属の歩留シが悪い。That is, in case 1), the optical fiber is exposed to moisture, which increases transmission loss, in case 11), the coating film becomes uneven in thickness and cracks occur, and finally, in case 111), the film thickness increases. The thickness is not sufficient, so the plating rate cannot be increased, and the yield of evaporated metal is poor.
上記１）及び１１）の欠点は、本質的な問題であシ、現
段階での技術的解決は困難と思われる。The drawbacks 1) and 11) above are essential problems, and it seems difficult to solve them technically at this stage.
この点、１１１）における欠点は本質的なものではなく
、技術的に解決可能でちゃ、従って本発明は上記３つの
手段の中段後の１１１）を対象とするものである。In this point, the drawback in 111) is not essential and can be solved technically, and therefore the present invention is directed to 111), which is the middle stage of the above three means.
ところで、真空メッキは一般に、るつぼ内の金属を蒸発
させ、この蒸発金属を線状体等に付着させるのであるが
、上記１１１）の欠点は、るつぼ内の金属を蒸発させる
、という点に根ざしている。By the way, vacuum plating generally evaporates the metal in a crucible and attaches this evaporated metal to a linear object, etc., but the drawback of 111) above is rooted in the fact that the metal in the crucible is evaporated. There is.
即ち、かかる方法においては、るつぼからの蒸発金属を
被メッギ物−■二に絞ることは難しく、換言すれば、蒸
発金属を被メツギ物上に集中させることは難しく、この
ため、蒸発金属の無駄が多く、歩留りが悪かった。That is, in such a method, it is difficult to narrow down the evaporated metal from the crucible to the object to be melted. In other words, it is difficult to concentrate the evaporated metal on the object to be melted, and for this reason, the evaporated metal is wasted. There were a lot of problems, and the yield was poor.
特に、被メッキ物が、１ｔｆ径１２５μｍという細い光
ファイバの場合には、」二記とあい１つてさらに欠点が
助長されることになっていた。Particularly, when the object to be plated is a thin optical fiber with a 1tf diameter of 125 μm, the disadvantages mentioned above are exacerbated.
本発明は、真空容器内に設置した２市るつぼ内で、金属
をその融点より少し高い１ｌｕ１度で溶解させ、該金属
に対しては当該金属の融点より相当に高いｙｌｎｉ度の
加熱管をその相当部分が上記金属液面から突出する状態
で設けておき、さらに該加熱管の内部に線状体を走行さ
せるようにすることにより上記問題点を解決し」：うと
いうもので、これを図面に示す実施例を参ｉｊＱ （、
なから説明すると、第１図に示すように、真空容器（１
）内に２屯るつぼ（２）ヲ設置し、同るつぼ（２）内（
こ、例えばアルミニウム等の金に’Ａ （３１ｆ入れ、
回るつぼ（２）を発熱体（４）の抵抗加熱により加熱す
ることによって上記金属（３）溶融させる。In the present invention, a metal is melted in a two-way crucible placed in a vacuum container at a temperature of 1 lu 1 degree, which is slightly higher than its melting point, and a heating tube is connected to the metal at a temperature of 1 lu 1 degree, which is considerably higher than the melting point of the metal. The above problem was solved by providing a metal with a corresponding portion protruding from the surface of the metal liquid, and by running a linear body inside the heating tube. Please refer to the example shown in ijQ (,
To explain from the beginning, as shown in Figure 1, a vacuum container (1
) and place a 2-ton crucible (2) inside the same crucible (2).
For example, put 'A (31f) on gold such as aluminum,
The metal (3) is melted by heating the rotating crucible (2) by resistance heating of the heating element (4).
この溶融した金属（３）中に、円筒状の加熱管（４）′
の先端部を挿入してその残部が同金属（３）の液面から
上方に突出した状態とし、同加熱管（４）′ をその外
周に配置した抵抗加熱体（５）により加熱する０
かかる状態で、金属（３）、即ちアルミニウムをその融
点より少し高い湿度たる６８０℃に設定する。In this molten metal (3), a cylindrical heating tube (4)'
Insert the tip of the metal (3) so that its remaining part protrudes upward from the liquid level of the metal (3), and heat the heating tube (4)' with a resistance heating element (5) arranged around its outer periphery. In this state, the temperature of the metal (3), ie, aluminum, is set at 680° C., which is a humidity slightly higher than its melting point.
この温度でのアルミニウムの蒸気圧力は低いので、真空
容器（１）内の圧力を１０ ” ）−ル程度の高真空状
態にしてもアルミニウムは殆ど７８発しない０
次に加熱管（４）′の温度を、上記アルミニウムの融点
より相当高い湿度たる８００℃以上にする。The vapor pressure of aluminum at this temperature is low, so even if the pressure inside the vacuum container (1) is set to a high vacuum state of about 10"), aluminum hardly ejects. Next, the heating tube (4)' The temperature is set to 800° C. or higher, which is a humidity considerably higher than the melting point of aluminum.
上記のように、金属（３）と加熱管（４）′ との温
度を設定すると、加熱管（４）′ の温度は、金属（３
）のそれよシ相当に高いので、金属（３）は、第２図に
示すように、加熱管（４）′ の内周壁をはい」二るこ
とになる。As mentioned above, when the temperatures of the metal (3) and the heating tube (4)' are set, the temperature of the heating tube (4)' will be lower than that of the metal (3).
) is considerably higher than that of the heating tube (4), so the metal (3) will crawl over the inner peripheral wall of the heating tube (4)', as shown in FIG.
こうしてはい上った金属（３］ ’ は、加熱管（４）
′によって高温に加熱され、その温度の蒸気圧に応じて
蒸発する○
他方、加熱管（４）′の内部においてその上方から２市
るつぼ（２）の内管（６）にかけて、光ファイバ（７）
を上方から下方に向けて走行するようにしておけば、上
記蒸発金属（８）は、光ファイバ（力に側蓋することに
なる。The metal (3) that climbed up in this way is the heating tube (4)
The optical fiber (7) is heated to a high temperature by ', and evaporates according to the vapor pressure at that temperature. )
If the evaporated metal (8) is made to travel from the top to the bottom, the evaporated metal (8) will cover the optical fiber (force).
上記加熱管（４）′の上方には、光ファイバ（７）を囲
むように高周波コイル（９）を設けておくのが好ましく
、かかる状態で放電させれば、加熱管（４）′の上部に
達する多少の蒸発金属（８）は、Ｉ／Ｊ（１起されて光
ファイバ（７）に被覆されることになる。It is preferable to provide a high frequency coil (9) above the heating tube (4)' so as to surround the optical fiber (7). Some of the evaporated metal (8) reaching I/J (1) will be coated onto the optical fiber (7).
即チ、光ファイバ（７）には、最初にイＡンブレーテイ
ングがなされ、次いで＜’（空メツギが行なわれること
になり、従って蒸発金属（８）の利殖強度が大になると
ノ（にメッキ効率が増大する。In other words, the optical fiber (7) is first subjected to ion-blating and then <' (empty plating). Efficiency increases.
尚、（ＩＱ及び０１）は、発熱体（４）及び抵抗加熱体
（５）の夫々の外周に設けられた断熱材であシ、熱効率
をよくするためのものである。Note that (IQ and 01) are heat insulating materials provided around the respective outer peripheries of the heating element (4) and the resistance heating element (5) to improve thermal efficiency.
オた、（１りは真空容器（１）の外周に配置された冷却
管であシ、同容器（１）が高温になるのを防止するため
のものである。Additionally, (1) is a cooling pipe placed around the outer periphery of the vacuum container (1) to prevent the container (1) from becoming high temperature.
ここでより具体的な例について述べると、１）２重るつ
ぼ（２）の容積を約８肩、加熱管（４）′の内径を１６
胴、その長さを３０〜４０αとして、１を２重るつぼ（
２）にはＢＮ（ボロンライト）を使用し、加熱管（４）
′ にはセラミックを用い、２重るつぼ（２）の容積の
８割に達するまでニッケルを充填した。Here, we will discuss a more specific example: 1) The volume of the double crucible (2) is approximately 8 shoulders, and the inner diameter of the heating tube (4)' is approximately 16 cm.
The length of the body is 30~40α, and 1 is a double crucible (
2) uses BN (boron light), and the heating tube (4)
′ was made of ceramic and filled with nickel until it reached 80% of the volume of the double crucible (2).
光ファイバ（７）は、外径１２５μｍのものを使用し、
発熱体（４）にＭＩＣヒータを用い、高周波コイル（９
）には周波数１３．５６ Ｍｌ（ｚでＩＫＷ の電力
を通じた。The optical fiber (7) has an outer diameter of 125 μm,
A MIC heater is used as the heating element (4), and a high frequency coil (9
) passed a power of IKW at frequency 13.56 Ml (z).
１１）外径２０ｗｎのＰｖＣ被覆ケーブルをメッキすべ
き線条体とし、線速２００ｍ／分で走行させ、アルミニ
ウムを数百オングストロームの厚さで被覆した。11) A PvC coated cable with an outer diameter of 20 wn was used as the filament to be plated, and was run at a linear speed of 200 m/min to coat aluminum to a thickness of several hundred angstroms.
被ｍＪＩノは均一であった。The amount of mJI received was uniform.
尚、２ＩＴＬるつぼ（２）に充填する金属としてｉ：↑
、アルミニウム、ニッケルの他、２１ｖ、、銅、クロム
、チタン、イン／ラム等が用いられる。In addition, as the metal to be filled in the 2ITL crucible (2), i:↑
, aluminum, nickel, 21v, copper, chromium, titanium, in/ram, etc. are used.
さらに膜厚を犬にするには、本発明に係る」二記構ｊ告
を２屯にすればよい。In order to further reduce the film thickness, it is sufficient to increase the thickness of the film according to the present invention to 2 layers.
以上の」、うに本発明は、るつぼ内の金属を蒸発させる
のではなく、加熱管をはい」−ろ金属を蒸発させるので
あるから、蒸発金属を絞ることが「げ能と７＋ｔす、従
って、蒸発金１１４の歩留りが向」ニする。However, the present invention does not evaporate the metal in the crucible, but rather evaporates the metal through the heating tube. The yield of evaporated gold 114 is improved.
！、た、メツギノ！ノを犬にすることができるので、被
メツキ物の走行速度を上げることができる。! ,T-Metsugino! Since it is possible to change the shape of the object to a dog, it is possible to increase the traveling speed of the object to be plucked.
さらに、被メツキ物の周囲から金属が蒸発するので、周
上均一な厚さのメッキが得られることになる。Furthermore, since the metal evaporates from the periphery of the object to be plated, a uniform thickness of plating can be obtained over the circumference.
第１図は本発明に係る方法に使用される装置を示す概略
部分断面図、第２図は同装置の要部を示す概略断面図で
ある。
７−
（１）・・・・・真空容器
（２）・・・・・２屯るつぼ
（３）・・・・・金属
（４）′・・・・・加熱管
（７）・・・・・光ファイバ
８−
＝４５７FIG. 1 is a schematic partial sectional view showing an apparatus used in the method according to the present invention, and FIG. 2 is a schematic sectional view showing essential parts of the apparatus. 7- (1)...Vacuum container (2)...2-ton crucible (3)...Metal (4)'...Heating tube (7)...・Optical fiber 8- = 457
Claims (1)
を設けると共に該るつぼで溶解した金属の液面上には加
熱管を立てておき、上記２重るつぼ内の金属をその融点
より少し高い４１１１度で溶解させると共に上記加熱管
を上記金属の融点Ｊ：ｖ相当に高い温度に１股定し、さ
らに該加熱管の内部に線状体を走行させるようにしたこ
とを特徴とする線状体の金属メッキ方法。 （２）金属はアルミニウム、銅、クロム、ニッケル、鉛
、チタン、インジウムの中から選定されることを特徴と
する特ｉｆｆ＃ｉＪ求の範囲第１項記載の線状体の金属
メッキ方法。[Claims] (]) A dual-layer crucible for melting metal is provided in a vacuum container, and a heating tube is placed above the liquid surface of the metal melted in the crucible. The metal was melted at 4111 degrees, which is slightly higher than its melting point, and the heating tube was set at a temperature equivalent to the melting point J:v of the metal, and a linear body was run inside the heating tube. A metal plating method for a linear body, which is characterized by: (2) The metal plating method for a linear body according to item 1, wherein the metal is selected from aluminum, copper, chromium, nickel, lead, titanium, and indium.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56126502A JPS5848627B2 (en) | 1981-08-12 | 1981-08-12 | Metal plating method for linear objects |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56126502A JPS5848627B2 (en) | 1981-08-12 | 1981-08-12 | Metal plating method for linear objects |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5827977A true JPS5827977A (en) | 1983-02-18 |
| JPS5848627B2 JPS5848627B2 (en) | 1983-10-29 |
Family
ID=14936789
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56126502A Expired JPS5848627B2 (en) | 1981-08-12 | 1981-08-12 | Metal plating method for linear objects |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5848627B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154405A (en) * | 1983-02-22 | 1984-09-03 | Fujikura Ltd | metal coated optical fiber |
| JPS63307261A (en) * | 1987-06-05 | 1988-12-14 | Mitsubishi Electric Corp | Thin film forming device |
| CN109609914A (en) * | 2019-02-27 | 2019-04-12 | 昆山国显光电有限公司 | A kind of crucible and its heating control method, evaporation equipment |
-
1981
- 1981-08-12 JP JP56126502A patent/JPS5848627B2/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59154405A (en) * | 1983-02-22 | 1984-09-03 | Fujikura Ltd | metal coated optical fiber |
| JPS63307261A (en) * | 1987-06-05 | 1988-12-14 | Mitsubishi Electric Corp | Thin film forming device |
| CN109609914A (en) * | 2019-02-27 | 2019-04-12 | 昆山国显光电有限公司 | A kind of crucible and its heating control method, evaporation equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5848627B2 (en) | 1983-10-29 |
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