JPS5824470Y2 - mold case - Google Patents

Description

[Detailed explanation of the idea] The present invention relates to a molded case for a high voltage power supply.

For example, the high-voltage power supply of a television receiver is molded in a resin molded case in consideration of dust-proofing, moisture-proofing, safety, and the like.

However, in conventional molded cases, when resin is injected into the case and cured, the molded resin often peels off from the inner wall of the case, and moisture etc. can enter from that part, causing insulation failure.

The present invention has been made to eliminate the above-mentioned drawbacks, and embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a plan view of a molded case showing an embodiment of the present invention.
Two protrusions 3 are formed integrally with the case 1 on the inner surfaces of the pair of long side walls 2, 2, respectively.

In this embodiment, two protrusions 3 are provided on the inner surface of each side wall 2, but they may also be provided on the short side walls 7, 7, and may be changed as appropriate depending on the size of the case, and at least one protrusion 3 is provided. is necessary.

As is clear from FIG. 1, the protrusion 3 has a circular cross section and a narrow connection portion with the side wall 2 of the case 10.
As shown in the side view of the figure, it is formed perpendicularly to the side wall 2.

Furthermore, near the four corners of the inner surface of the bottom surface 4 of the case 1, a stand 6 with screw holes 8 on which a high-voltage power supply board 5 (FIG. 2) is placed is integrally formed with the case 1.

The board 5 is fixed to the case 1 by screwing not shown screws into the screw holes 8.

With this configuration, as shown in FIG.
When stored in the case, there is a stand 6 between the case bottom 4 and the board 5.
A space is created by this, and therefore, if resin is injected in this state, this resin will flow around into the space on the back side of the substrate 5.

In addition, since the protrusion 3 has a narrow connection part with the case 1, when the mold resin injected into the case 1 hardens, it will catch on the connection part of the protrusion 3 with the side wall 2 and adhere tightly to the inner surface of the side wall. , no peeling occurs.

According to experiments conducted by the present inventor, no peeling of the mold resin occurred as a result of using the case configured as shown in FIGS. 1 and 2.

As described above, according to the present invention, since the protrusion is provided on the inner surface of the side wall of the mold case, peeling of the mold resin is completely prevented.

In addition, since the mold resin wraps around the space between the board 5 formed by the base 6 on the inner surface of the bottom surface, insulation is improved, and since the soldering part does not touch the bottom surface, creeping discharge can be prevented, which is a great advantage. be.

In the above embodiment, the protrusion 3 has a circular cross section, but may have a triangular cross section as shown in FIG.

Of course, the shape does not matter as long as the connecting part with the case is thinner than the protruding part.

Further, the shape of the stand 6 can be changed as necessary, and it is sufficient that a space is formed between the substrate and the bottom surface of the case.

Furthermore, it goes without saying that the invention is applicable not only to television receivers but also to cases of other high-voltage power supplies.

Of course, various other changes can be made as necessary.

[Brief explanation of drawings]

Fig. 1 is a plan view showing one embodiment of the molded case according to the present invention, Fig. 2 is a cutaway cross-sectional side view taken along line II-II in Fig. 1, and Fig. 3 is a schematic plan view showing another example of the protrusion. It is a diagram. In the figure, 1 is a mold case, 2 is a pair of opposing long side walls of the mold case, 3 is a projection formed on the inner surface of the long side walls,
Reference numeral 4 indicates the bottom surface of the molded case, 5 indicates the board of the high voltage power supply, and 6 indicates the stand on the bottom surface of the molded case.

Claims (1)

[Scope of utility model registration request] On the inner surface of at least one pair of opposing side walls of the molded case,
A molded case comprising at least one protrusion having a narrow connection portion with the side wall, and a plurality of pedestals of a predetermined height provided on the inner surface of the bottom surface of the case.