JP2994875B2 - High pressure block device - Google Patents
High pressure block deviceInfo
- Publication number
- JP2994875B2 JP2994875B2 JP4244763A JP24476392A JP2994875B2 JP 2994875 B2 JP2994875 B2 JP 2994875B2 JP 4244763 A JP4244763 A JP 4244763A JP 24476392 A JP24476392 A JP 24476392A JP 2994875 B2 JP2994875 B2 JP 2994875B2
- Authority
- JP
- Japan
- Prior art keywords
- block device
- pressure block
- case
- terminal board
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Details Of Resistors (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は高圧ブロック装置の構造
に関するものであり、特に樹脂モールドして成る高圧ブ
ロック装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a high-pressure block device, and more particularly to an improvement of a high-pressure block device formed by resin molding.
【０００２】[0002]
【従来の技術】従来の高圧ブロック装置を図４に示す。
従来の高圧ブロック装置では、ケース１の外周におい
て、該ケース１と一体に螺着用ツバ部１ａを複数個形成
し、該螺着用ツバ部１ａによってプリント基板等（図示
せず）にビスで固定しているのが普通である。2. Description of the Related Art FIG. 4 shows a conventional high-pressure block device.
In the conventional high-pressure block device, a plurality of screw-in flanges 1a are formed integrally with the case 1 on the outer periphery of the case 1, and the screw-in collar 1a is fixed to a printed board or the like (not shown) with screws. It is common to have.
【０００３】[0003]
【発明が解決しようとする課題】然し乍ら、上記した従
来の高圧ブロック装置では、ケース１の外周に螺着用ツ
バ部１ａを設ける必要があるため、高圧ブロック装置の
取り付け面積が広くなってしまい、ひいては機器の小型
化に支障をきたすという問題がある。However, in the above-mentioned conventional high-pressure block device, since it is necessary to provide the screwing flange 1a on the outer periphery of the case 1, the mounting area of the high-pressure block device becomes large, and as a result, There is a problem that it hinders downsizing of the device.
【０００４】[0004]
【課題を解決するための手段】上記課題を解決するため
に本発明では、電子部品素子が載置されたターミナルボ
ードと、一面が開放され前記ターミナルボードを収納す
るケースとを備え、前記ターミナルボードを前記ケース
に収納した状態でケース内に樹脂を充填して成る高圧ブ
ロック装置において、前記充填樹脂に埋没せず、前記ケ
ースの開放端面から外へ突出しない高さを有する螺着用
ボスを、前記ターミナルボードと一体に成形する。According to the present invention, there is provided a terminal board having an electronic component element mounted thereon, and a case having an open surface for accommodating the terminal board. In a high-pressure block device in which the case is filled with resin in a state housed in the case, a screwing boss having a height that is not buried in the filled resin and does not protrude from an open end surface of the case, Molded integrally with the terminal board.
【０００５】[0005]
【作用】上記本発明の高圧ブロック装置は、ケースの開
放端縁をプリント基板等の上面に当接させ、プリント基
板等の下面側から挿通したビスをビス螺着用ボスに螺着
することにより、プリント基板等に固定される。In the high-pressure block device of the present invention, the open edge of the case is brought into contact with the upper surface of a printed circuit board or the like, and a screw inserted from the lower surface side of the printed circuit board or the like is screwed into a boss for screwing. It is fixed to a printed circuit board or the like.
【０００６】[0006]
【実施例】以下、図面を参照しつつ本発明の一実施例に
つき説明する。先ず、図１は高圧ブロック装置の外観を
示している。同図において２はターミナルボード、２ａ
は前記ターミナルボードと一体に成形された螺着用ボ
ス、３は接続端子、４は絶縁モールド用の樹脂である。
５はケースであり、前記ターミナルボード２を収納する
と共に内部に前記樹脂４が充填される。前記螺着用ボス
２ａは、前記樹脂４によって埋没しないようにその高さ
が設定されているが、ケース１の開放端面５ａよりは低
く設定されているものである。An embodiment of the present invention will be described below with reference to the drawings. First, FIG. 1 shows an appearance of a high-pressure block device. In the figure, 2 is a terminal board, 2a
Is a boss for screwing integrally formed with the terminal board, 3 is a connection terminal, and 4 is a resin for insulating molding.
Reference numeral 5 denotes a case which houses the terminal board 2 and is filled with the resin 4 therein. The height of the screw boss 2 a is set so as not to be buried by the resin 4, but is set lower than the open end face 5 a of the case 1.
【０００７】次に図２は前記ターミナルボード２の外観
を示している。該ターミナルボード２は、図３に示すよ
うにその上に電子部品素子６が載置されるものである。FIG. 2 shows the appearance of the terminal board 2. The terminal board 2 has an electronic component element 6 mounted thereon as shown in FIG.
【０００８】本発明の高圧ブロック装置の組み立ては、
図３に示す如く上に電子部品素子６が載置されたターミ
ナルボード２をケース５に収納した後、樹脂４を充填し
て成される。このようにして完成された高圧ブロック装
置は、螺着用ボス２ａを使用してプリント基板等（図示
せず）の上にビスで固定される。[0008] The assembly of the high-pressure block device of the present invention is as follows.
As shown in FIG. 3, the terminal board 2 on which the electronic component elements 6 are mounted is housed in a case 5 and then filled with a resin 4. The high-pressure block device completed in this manner is fixed on a printed circuit board or the like (not shown) with screws using a boss 2a for screwing.
【０００９】[0009]
【発明の効果】本発明に依れば、高圧ブロック装置のケ
ースの開放端縁がプリント基板等の上面に当接し、プリ
ント基板等の下面側から挿通されたビスがビス螺着用ボ
スに螺着することにより、高圧ブロック装置がプリント
基板等に固定されるので、高圧ブロック装置のケース外
周に固定用のツバ部等を設ける必要がなく、高圧ブロッ
ク装置の取り付け面積が少なくてすみ、省スペース及び
機器の小型化に寄与することができる。また、高圧ブロ
ック装置のターミナルボードから引き出された接続端子
とプリント基板等との接続部に掛かる荷重が軽減され
る。According to the present invention, the open edge of the case of the high-pressure block device comes into contact with the upper surface of the printed circuit board or the like, and the screw inserted from the lower surface side of the printed circuit board or the like is screwed into the screw boss. By doing so, since the high-pressure block device is fixed to a printed circuit board or the like, there is no need to provide a fixing brim section or the like on the outer periphery of the case of the high-pressure block device. This can contribute to downsizing of the device. Further, the load applied to the connection between the connection terminal drawn from the terminal board of the high-voltage block device and the printed circuit board or the like is reduced.
【図１】本発明の高圧ブロック装置の外観を示す斜視
図。FIG. 1 is a perspective view showing the appearance of a high-pressure block device according to the present invention.
【図２】ターミナルボードの形状を示す外観斜視図。FIG. 2 is an external perspective view showing the shape of a terminal board.
【図３】ターミナルボード上の電子部品素子を示す外観
斜視図。FIG. 3 is an external perspective view showing an electronic component element on a terminal board.
【図４】従来の高圧ブロック装置の外観を示す斜視図。FIG. 4 is a perspective view showing the appearance of a conventional high-pressure block device.
２ ターミナルボード ２ａ 螺着用ボス ３ 接続端子 ４ 樹脂 ５ ケース ６ 電子部品素子 Reference Signs List 2 terminal board 2a screw boss 3 connection terminal 4 resin 5 case 6 electronic component element
Claims (1)
ードと、一面が開放され前記ターミナルボードを収納す
るケースとを備え、前記ターミナルボードを前記ケース
に収納した状態でケース内に樹脂を充填して成る高圧ブ
ロック装置において、 前記充填樹脂に埋没せず、前記ケースの開放端面から外
へ突出しない高さを有する螺着用ボスを、前記ターミナ
ルボードと一体に成形したことを特徴とする高圧ブロッ
ク装置。1. A terminal board on which an electronic component element is mounted, and a case which is open on one side and stores the terminal board, wherein a resin is filled in the case with the terminal board stored in the case. A high-pressure block device, comprising: a screw boss having a height that is not buried in the filling resin and does not protrude from an open end surface of the case to the terminal board. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4244763A JP2994875B2 (en) | 1992-09-14 | 1992-09-14 | High pressure block device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4244763A JP2994875B2 (en) | 1992-09-14 | 1992-09-14 | High pressure block device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0696901A JPH0696901A (en) | 1994-04-08 |
| JP2994875B2 true JP2994875B2 (en) | 1999-12-27 |
Family
ID=17123546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4244763A Expired - Fee Related JP2994875B2 (en) | 1992-09-14 | 1992-09-14 | High pressure block device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2994875B2 (en) |
-
1992
- 1992-09-14 JP JP4244763A patent/JP2994875B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0696901A (en) | 1994-04-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071022 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081022 Year of fee payment: 9 |
|
| LAPS | Cancellation because of no payment of annual fees |