JPH0955462A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPH0955462A JPH0955462A JP20863395A JP20863395A JPH0955462A JP H0955462 A JPH0955462 A JP H0955462A JP 20863395 A JP20863395 A JP 20863395A JP 20863395 A JP20863395 A JP 20863395A JP H0955462 A JPH0955462 A JP H0955462A
- Authority
- JP
- Japan
- Prior art keywords
- package
- external lead
- out terminal
- terminal plate
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】この発明は、インバータ装置等の
電力変換装置に使用されるパワーモジュールなどの半導
体装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a power module used in a power conversion device such as an inverter device.
【0002】[0002]
【従来の技術】近年、IGBT(絶縁ゲート型バイポー
ラトランジスタ)など複数個収納したパワーモジュール
が電力変換装置に多く用いられている。このパワーモジ
ュールは主回路を構成するために、例えば銅板などの導
体とネジで固定される。図7は従来のパワーモジュール
の要部構成図で、同図(a)は上面図、同図(b)は同
図(a)のX−X線切断部の内部構成図、同図(c)は
同図(a)のY−Y線切断部の内部構成図を示す。外部
導出端子板4は露出部で直角に曲げられ、パッケージ1
の表面と接触する。露出した外部導出端子板4にはネジ
より多少大きい貫通孔14が設けられ、この貫通孔14
と対応するパッケージ1側にはネジ9を固定するナット
13が嵌め込まれ、このナット13からはみ出たネジの
先端部10を収納できるように凹型の孔8が設けられて
いる。主回路を構成するための導体11と外部導出端子
板4とをこのネジ9とナット13で固定する。2. Description of the Related Art In recent years, power modules containing a plurality of IGBTs (insulated gate bipolar transistors) have been widely used in power converters. This power module is fixed to a conductor such as a copper plate with screws to form a main circuit. 7A and 7B are configuration diagrams of a main part of a conventional power module. FIG. 7A is a top view, FIG. 7B is an internal configuration diagram of an X-X line cutting part in FIG. 7A, and FIG. () Shows the internal block diagram of the YY line cutting part of the same figure (a). The external lead-out terminal plate 4 is bent at a right angle at the exposed portion,
Contact with the surface of. The exposed external lead-out terminal plate 4 is provided with a through hole 14 which is slightly larger than the screw.
A nut 13 for fixing a screw 9 is fitted on the side of the package 1 corresponding to, and a concave hole 8 is provided so as to accommodate a tip portion 10 of the screw protruding from the nut 13. The conductor 11 for constituting the main circuit and the external lead-out terminal plate 4 are fixed with the screw 9 and the nut 13.
【0003】[0003]
【発明が解決しようとする課題】しかし、従来のパワー
モジュールの構造では導体11を固定するためのナット
13を必要とし、またこのナット13をパッケージ1に
嵌め込むための工数が掛かり、製造コストが高いという
問題がある。この発明の目的は、前記の課題を解決する
ために、ナットを不要とし、低い製造コストのパワーモ
ジュールなどの半導体装置を提供することにある。However, in the structure of the conventional power module, the nut 13 for fixing the conductor 11 is required, and the man-hour for fitting the nut 13 into the package 1 is required, resulting in a manufacturing cost. There is a problem of being expensive. An object of the present invention is to provide a semiconductor device such as a power module which does not require a nut and has a low manufacturing cost, in order to solve the above problems.
【0004】[0004]
【課題を解決するための手段】前記の目的を達成するた
めに、パッケージの内部から外部に導出される外部導出
端子板を有する半導体装置において、外部導出端子板の
外部に露出した箇所に、外部導体を固着するための雌ネ
ジを設ける。また外部導出端子板の露出した箇所がパッ
ケージ表面と接触し、雌ネジのある箇所と対応するパッ
ケージ側に雌ネジの直径より大きい凹型の孔を開けると
よい。また外部導出端子板の露出した箇所がパッケージ
表面から離れるようにする。In order to achieve the above-mentioned object, in a semiconductor device having an external lead-out terminal plate led out from the inside of the package to the outside, the external lead-out terminal plate is exposed to the outside at a location exposed to the outside. Provide a female screw for fixing the conductor. Further, it is preferable that the exposed portion of the external lead-out terminal plate comes into contact with the package surface and a concave hole larger than the diameter of the female screw is formed on the package side corresponding to the portion where the female screw is present. Also, the exposed portion of the external lead-out terminal plate should be separated from the package surface.
【0005】[0005]
【作用】従来のネジを固定するためのナットの役割を外
部導出端子板に設けた雌ネジにもたせる。The function of the nut for fixing the conventional screw is given to the female screw provided on the external lead-out terminal plate.
【0006】[0006]
【実施例】図1は第一実施例のパワーモジュールの内部
の要部構成図を示す。同図は図7(c)に相当する内部
構成図である。樹脂製のパッケージ1内に半導体チップ
2が配置され、さらにこの半導体チップ2を汚れや湿気
から防ぐためのゲル3(軟らかい樹脂)が空間を残して
詰まっている。パッケージ1内の外部導出端子板4と半
導体チップ2が搭載されたマウント板5とは接続板6で
接続し、パッケージ1外に露出した外部導出端子板4は
直角に折り曲げられ、パッケージ1の表面と接触し、雌
ネジ7が設けられている。この雌ネジを含むネジの箇所
(円内)は拡大して示されている。また雌ネジ7のある
箇所に対応するパッケージ1には凹型の孔8が開けら
れ、ネジの先端部10が収納される。主回路を構成する
ための導体11と外部導出端子板4とはネジ9で固着さ
れる。図示されていないが、当然、この導体11にはネ
ジ9が通る貫通孔が開けられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view of the internal structure of a power module of the first embodiment. This figure is an internal configuration diagram corresponding to FIG. A semiconductor chip 2 is arranged in a resin-made package 1, and a gel 3 (soft resin) for preventing the semiconductor chip 2 from dirt and moisture is filled in leaving a space. The external lead-out terminal plate 4 in the package 1 and the mount plate 5 on which the semiconductor chip 2 is mounted are connected by a connecting plate 6, and the external lead-out terminal plate 4 exposed to the outside of the package 1 is bent at a right angle to form a surface of the package 1. And the female screw 7 is provided. The location of the screw (in the circle) including this female screw is shown enlarged. In addition, a concave hole 8 is opened in the package 1 corresponding to the position where the female screw 7 is present, and the tip portion 10 of the screw is accommodated therein. The conductor 11 for forming the main circuit and the external lead-out terminal plate 4 are fixed with screws 9. Although not shown, naturally, the conductor 11 has a through hole through which the screw 9 passes.
【0007】図2は第二実施例のパワーモジュールの内
部の要部構成図を示す。同図も図7(c)に相当する内
部構成図である。パッケージ1外に露出した外部導出端
子板4はパッケージ1表面から離れており、またネジの
先端部10はパッケージ1外にあるためパッケージ1に
は前記の凹型の孔を設ける必要はない。勿論ネジの先端
部がパッケージ1に接する場合には凹型の孔をパッケー
ジに設けても構わない。このパッケージ1ではゲル3が
空間を埋め尽くしているので、図1の場合より小型にな
っている。また、外部導出端子板4とパッケージ1表面
との空間にはスナバ回路等を設けることができる。もち
ろん図1のパッケージ1のようにゲル3が満ちていない
場合にもこの実施例は適用できる。FIG. 2 is a diagram showing the internal configuration of the power module of the second embodiment. This figure is also an internal configuration diagram corresponding to FIG. Since the external lead-out terminal plate 4 exposed to the outside of the package 1 is separated from the surface of the package 1 and the tip 10 of the screw is outside the package 1, it is not necessary to provide the concave hole in the package 1. Of course, if the tip of the screw contacts the package 1, a concave hole may be provided in the package. In this package 1, since the gel 3 fills the space, it is smaller than the case of FIG. A snubber circuit or the like can be provided in the space between the external lead-out terminal plate 4 and the surface of the package 1. Of course, this embodiment can be applied to the case where the gel 3 is not filled like the package 1 of FIG.
【0008】図3は第三実施例のパワーモジュールの内
部の要部構成図を示す。同図は図7(c)に相当する内
部構成図である。これは図2のパッケージ1に図1のネ
ジ9部を適用した実施例であり、図1より小型になって
いる。図4ないし図6は第一ないし第三の各実施例に対
応した変形例を示す。外部導出端子板4の一部がパッケ
ージの側壁12に埋め込まれている。こうすることで外
部導出端子板4はパッケージ1に強固に固着され、ネジ
締めを確実に行うことができる。FIG. 3 is a diagram showing the internal construction of the power module of the third embodiment. This figure is an internal configuration diagram corresponding to FIG. This is an embodiment in which the screws 9 of FIG. 1 are applied to the package 1 of FIG. 2, and the size is smaller than that of FIG. 4 to 6 show modified examples corresponding to the first to third embodiments. A part of the external lead-out terminal plate 4 is embedded in the side wall 12 of the package. By doing so, the external lead-out terminal plate 4 is firmly fixed to the package 1 and the screw can be securely tightened.
【0009】[0009]
【発明の効果】従来のネジを固定するためのナットの役
割を外部導出端子板に設けた雌ネジにもたせることでナ
ットを不要とし、且つ、ナットをパッケージに嵌め込む
工数を減らすことで、製造コストの低減を図る。EFFECTS OF THE INVENTION By providing the role of the conventional nut for fixing the screw to the female screw provided on the external lead-out terminal plate, the nut is not required and the number of steps for fitting the nut into the package is reduced. Aim to reduce costs.
【図面の簡単な説明】[Brief description of drawings]
【図1】この発明の第一実施例のパワーモジュールの内
部の要部構成図FIG. 1 is a configuration diagram of an essential part inside a power module according to a first embodiment of the present invention.
【図2】この発明の第二実施例のパワーモジュールの内
部の要部構成図FIG. 2 is a configuration diagram of an essential part inside a power module according to a second embodiment of the present invention.
【図3】この発明の第三実施例のパワーモジュールの内
部の要部構成図FIG. 3 is a schematic diagram of the internal configuration of a power module according to a third embodiment of the present invention.
【図4】第一実施例の変形例のパワーモジュールの内部
の要部構成図FIG. 4 is a configuration diagram of main parts inside a power module of a modified example of the first embodiment.
【図5】第二実施例の変形例のパワーモジュールの内部
の要部構成図FIG. 5 is a configuration diagram of main parts inside a power module according to a modification of the second embodiment.
【図6】第三実施例の変形例のパワーモジュールの内部
の要部構成図FIG. 6 is a configuration diagram of main parts inside a power module according to a modification of the third embodiment.
【図7】従来のパワーモジュールの要部構成図で、同図
(a)は上面図、同図(b)は同図(a)のX−X線切
断部の内部構成図、同図(c)は同図(a)のY−Y線
切断部の内部構成図7A and 7B are configuration diagrams of a main part of a conventional power module, in which FIG. 7A is a top view, FIG. 7B is an internal configuration diagram of an X-X line cutting portion in FIG. 7A, and FIG. c) is an internal configuration diagram of the section cut along the line YY in FIG.
1 パッケージ 2 半導体チップ 3 ゲル 4 外部導出端子板 5 マウント板 6 接続板 7 雌ネジ 8 凹型の孔 9 ネジ 10 ネジの先端部 11 導体 12 側壁 13 ナット 14 貫通孔 1 Package 2 Semiconductor Chip 3 Gel 4 External Derivation Terminal Plate 5 Mounting Plate 6 Connection Plate 7 Female Thread 8 Recessed Hole 9 Screw 10 Screw Tip 11 Conductor 12 Sidewall 13 Nut 14 Through Hole
Claims (3)
部導出端子板を有する半導体装置において、外部導出端
子板の外部に露出した箇所に、外部導体を固着するため
の雌ネジを設けたことを特徴とする半導体装置。1. A semiconductor device having an external lead-out terminal plate led out from the inside of a package, wherein a female screw for fixing an external conductor is provided at a portion exposed to the outside of the external lead-out terminal plate. Characteristic semiconductor device.
ジ表面と接触し、雌ねじのある箇所と対応するパッケー
ジ側に雌ネジの直径より大きい凹型の孔が開けられてい
ることを特徴とする請求項1記載の半導体装置。2. An exposed portion of the external lead-out terminal plate is in contact with the package surface, and a concave hole larger than the diameter of the female screw is formed on the package side corresponding to the portion having the female screw. Item 1. The semiconductor device according to item 1.
ジ表面から離れていることを特徴とする請求項1記載の
半導体装置。3. The semiconductor device according to claim 1, wherein the exposed portion of the external lead-out terminal plate is separated from the package surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20863395A JPH0955462A (en) | 1995-08-16 | 1995-08-16 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20863395A JPH0955462A (en) | 1995-08-16 | 1995-08-16 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0955462A true JPH0955462A (en) | 1997-02-25 |
Family
ID=16559470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20863395A Pending JPH0955462A (en) | 1995-08-16 | 1995-08-16 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0955462A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6809410B2 (en) * | 2000-11-30 | 2004-10-26 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor module |
EP2302674A1 (en) * | 2009-09-29 | 2011-03-30 | ABB Research Ltd. | Electrical terminal, electronic circuit module with an electrical terminal and corresponding method of manufacturing thereof |
JP2012134300A (en) * | 2010-12-21 | 2012-07-12 | Mitsubishi Electric Corp | Semiconductor device |
DE102020104723A1 (en) | 2020-02-24 | 2021-08-26 | Semikron Elektronik Gmbh & Co. Kg | Power electronic submodule for mounting on a cooling device |
-
1995
- 1995-08-16 JP JP20863395A patent/JPH0955462A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6809410B2 (en) * | 2000-11-30 | 2004-10-26 | Mitsubishi Denki Kabushiki Kaisha | Power semiconductor module |
EP2302674A1 (en) * | 2009-09-29 | 2011-03-30 | ABB Research Ltd. | Electrical terminal, electronic circuit module with an electrical terminal and corresponding method of manufacturing thereof |
JP2012134300A (en) * | 2010-12-21 | 2012-07-12 | Mitsubishi Electric Corp | Semiconductor device |
DE102020104723A1 (en) | 2020-02-24 | 2021-08-26 | Semikron Elektronik Gmbh & Co. Kg | Power electronic submodule for mounting on a cooling device |
US11533822B2 (en) | 2020-02-24 | 2022-12-20 | Semikron Elektronik Gmbh & Co. Kg | Power electronics submodule for mounting on a cooling device |
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