JPH0955462A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen a semiconductor device in manufacturing cost by a method wherein an internal thread is provided to an external lead-out terminal board so as to dispense with a conductor fixing nut and to save man-hours required to fit a nut in a package. SOLUTION: A part of an external lead-out terminal board 4 inside a package 1 and a mounting board 5 mounted with a semiconductor chip 2 are connected together with a connecting board 6, and the others of the terminal board 4 extending out of the package 1 is bent at a right angle so as to come into contact with the surface of the package 1, and a female thread 7 is provided to it. A blind hole 8 is bored in the package 1 corresponding to the internal thread 7, and a conductor 11 comprised in a main circuit and the external lead-out terminal board 4 are fixed together with a screw 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device such as a power module used in a power conversion device such as an inverter device.

[0002]

2. Description of the Related Art In recent years, power modules containing a plurality of IGBTs (insulated gate bipolar transistors) have been widely used in power converters. This power module is fixed to a conductor such as a copper plate with screws to form a main circuit. 7A and 7B are configuration diagrams of a main part of a conventional power module. FIG. 7A is a top view, FIG. 7B is an internal configuration diagram of an X-X line cutting part in FIG. 7A, and FIG. () Shows the internal block diagram of the YY line cutting part of the same figure (a). The external lead-out terminal plate 4 is bent at a right angle at the exposed portion,
Contact with the surface of. The exposed external lead-out terminal plate 4 is provided with a through hole 14 which is slightly larger than the screw.
A nut 13 for fixing a screw 9 is fitted on the side of the package 1 corresponding to, and a concave hole 8 is provided so as to accommodate a tip portion 10 of the screw protruding from the nut 13. The conductor 11 for constituting the main circuit and the external lead-out terminal plate 4 are fixed with the screw 9 and the nut 13.

[0003]

However, in the structure of the conventional power module, the nut 13 for fixing the conductor 11 is required, and the man-hour for fitting the nut 13 into the package 1 is required, resulting in a manufacturing cost. There is a problem of being expensive. An object of the present invention is to provide a semiconductor device such as a power module which does not require a nut and has a low manufacturing cost, in order to solve the above problems.

[0004]

In order to achieve the above-mentioned object, in a semiconductor device having an external lead-out terminal plate led out from the inside of the package to the outside, the external lead-out terminal plate is exposed to the outside at a location exposed to the outside. Provide a female screw for fixing the conductor. Further, it is preferable that the exposed portion of the external lead-out terminal plate comes into contact with the package surface and a concave hole larger than the diameter of the female screw is formed on the package side corresponding to the portion where the female screw is present. Also, the exposed portion of the external lead-out terminal plate should be separated from the package surface.

[0005]

The function of the nut for fixing the conventional screw is given to the female screw provided on the external lead-out terminal plate.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic view of the internal structure of a power module of the first embodiment. This figure is an internal configuration diagram corresponding to FIG. A semiconductor chip 2 is arranged in a resin-made package 1, and a gel 3 (soft resin) for preventing the semiconductor chip 2 from dirt and moisture is filled in leaving a space. The external lead-out terminal plate 4 in the package 1 and the mount plate 5 on which the semiconductor chip 2 is mounted are connected by a connecting plate 6, and the external lead-out terminal plate 4 exposed to the outside of the package 1 is bent at a right angle to form a surface of the package 1. And the female screw 7 is provided. The location of the screw (in the circle) including this female screw is shown enlarged. In addition, a concave hole 8 is opened in the package 1 corresponding to the position where the female screw 7 is present, and the tip portion 10 of the screw is accommodated therein. The conductor 11 for forming the main circuit and the external lead-out terminal plate 4 are fixed with screws 9. Although not shown, naturally, the conductor 11 has a through hole through which the screw 9 passes.

FIG. 2 is a diagram showing the internal configuration of the power module of the second embodiment. This figure is also an internal configuration diagram corresponding to FIG. Since the external lead-out terminal plate 4 exposed to the outside of the package 1 is separated from the surface of the package 1 and the tip 10 of the screw is outside the package 1, it is not necessary to provide the concave hole in the package 1. Of course, if the tip of the screw contacts the package 1, a concave hole may be provided in the package. In this package 1, since the gel 3 fills the space, it is smaller than the case of FIG. A snubber circuit or the like can be provided in the space between the external lead-out terminal plate 4 and the surface of the package 1. Of course, this embodiment can be applied to the case where the gel 3 is not filled like the package 1 of FIG.

FIG. 3 is a diagram showing the internal construction of the power module of the third embodiment. This figure is an internal configuration diagram corresponding to FIG. This is an embodiment in which the screws 9 of FIG. 1 are applied to the package 1 of FIG. 2, and the size is smaller than that of FIG. 4 to 6 show modified examples corresponding to the first to third embodiments. A part of the external lead-out terminal plate 4 is embedded in the side wall 12 of the package. By doing so, the external lead-out terminal plate 4 is firmly fixed to the package 1 and the screw can be securely tightened.

[0009]

EFFECTS OF THE INVENTION By providing the role of the conventional nut for fixing the screw to the female screw provided on the external lead-out terminal plate, the nut is not required and the number of steps for fitting the nut into the package is reduced. Aim to reduce costs.

[Brief description of drawings]

FIG. 1 is a configuration diagram of an essential part inside a power module according to a first embodiment of the present invention.

FIG. 2 is a configuration diagram of an essential part inside a power module according to a second embodiment of the present invention.

FIG. 3 is a schematic diagram of the internal configuration of a power module according to a third embodiment of the present invention.

FIG. 4 is a configuration diagram of main parts inside a power module of a modified example of the first embodiment.

FIG. 5 is a configuration diagram of main parts inside a power module according to a modification of the second embodiment.

FIG. 6 is a configuration diagram of main parts inside a power module according to a modification of the third embodiment.

7A and 7B are configuration diagrams of a main part of a conventional power module, in which FIG. 7A is a top view, FIG. 7B is an internal configuration diagram of an X-X line cutting portion in FIG. 7A, and FIG. c) is an internal configuration diagram of the section cut along the line YY in FIG.

[Explanation of symbols]

 1 Package 2 Semiconductor Chip 3 Gel 4 External Derivation Terminal Plate 5 Mounting Plate 6 Connection Plate 7 Female Thread 8 Recessed Hole 9 Screw 10 Screw Tip 11 Conductor 12 Sidewall 13 Nut 14 Through Hole

Claims (3)

[Claims] 1. A semiconductor device having an external lead-out terminal plate led out from the inside of a package, wherein a female screw for fixing an external conductor is provided at a portion exposed to the outside of the external lead-out terminal plate. Characteristic semiconductor device. 2. An exposed portion of the external lead-out terminal plate is in contact with the package surface, and a concave hole larger than the diameter of the female screw is formed on the package side corresponding to the portion having the female screw. Item 1. The semiconductor device according to item 1. 3. The semiconductor device according to claim 1, wherein the exposed portion of the external lead-out terminal plate is separated from the package surface.