JPS58223343A - Transport mechanism - Google Patents

Abstract

PURPOSE:To decrease the number of movable parts, to simplify the constitution of the transport mechanism and to improve the yield of the manufacture of a semiconductor device by extracting and supplying a quartz tray, etc. between the treating chamber and preparatory chamber of a vacuum device through a motion of one reciprocation. CONSTITUTION:A section between the treating chamber 11 executing treatment such as edging and the preparatory chamber 12 evacuated up to vacuum is continued by a gate valve 17. First and second bellows 13, 14 incorporating vertical motion means vertically moving the first and second quartz trays A, B of different size are set up into the treating chamber 11. A feed-means 15 with a rack 18 horizontally reciprocating between the treating chamber 11 and the preparatory chamber 12, a pinion 19 and a motor 20 is set up into the preparatory chamber 12. The feed-means 15 on which the tray A is placed is moved to the treating chamber 11 from the preparatory chamber 12 under the state in which the second tray B placed on a treating base is lifted by the bellows 14 in the treating chamber 11, and the bellows is dropped and the tray B is placed on the feed-means 15 while the bellows 13 is elevated, thus simplifying the constitution of the transport mechanism.

Description

[Detailed description of the invention] (1) Technical part of the invention! l'l' The present invention is j! l! It relates generally to mechanisms, and more particularly to mechanisms for transporting and placing quartz trays, etc., within a vacuum apparatus.

(2) Background of the Technology In the manufacturing process of semiconductor devices, semiconductor wafers are etched using corrosive processing gas in a vacuum processing chamber. Since such processing involves both vacuum and corrosive gas, it uses a complex and sophisticated mechanism, but care must be taken to ensure the stability of the mechanism.

In the conventional Un II1 mechanism, a quartz tray shown in the perspective view of FIG.
Usually, ten wafers are placed on a tray to form one hatch, and batch processing is performed.

The mounting state of the wafer is shown in the cross-sectional view of the same figure (bl), and
2) Place the wafer 2 in the recess formed in the tray 1 so that its upper surface protrudes onto the surface of the tray.

Wafer processing is performed in a vacuum processing chamber, and a preliminary chamber is connected to the processing chamber in order to systematically move trays in and out. Figure 2 shows conventional luck Il! The mechanism is shown in a schematic cross-sectional view, and in the figure, 3t is a processing chamber, 4 is a preliminary chamber, 5 is a stage or lower electrode of the processing chamber (this electrode is used during etching), 6 is a gate valve, and 7 is a 1 - a first mechanism which has means for holding and releasing the tray and is non-interlocked with 8; a second mechanism 8 having means for holding and releasing the tray; mechanism, 9 is a third mechanism that moves up and down and the receiver serves as a plate; 10 is a motor;
&:L: Indicates a drive chain, respectively.

To summarize the processing of wafers in terms of the gamma positional relationship between the processing chamber and the preparatory chamber, the tray l carrying the wafers processed in the processing chamber 3 is returned to the preparatory chamber 4 . At this point, processing chamber 3 is empty, so another tray 1 (on which wafers are placed)
(placed as shown in a+) is transferred to the processing chamber 3. At this time, gate valves (3) 6 open and close to allow tray 1 to move.

The operation in the preliminary room 4 proceeds according to the following procedure. Two trays are used in connection with etching in the processing chamber.

While the wafers on tray I are being processed in the processing chamber, in the preliminary chamber, the first mechanism 7 takes out the already processed wafers from the tray 1 and supplies new wafers to the tray 1. Then, the first mechanism 7 moves downward to the position of the second mechanism 8. At this time, the third mechanism 9 is the second mechanism 8
1- comes to the position. iron, the first mechanism 7)
1/-1 is released, the third mechanism 9 receives it, and the preliminary chamber is evacuated and evacuated.

When etching is completed in the processing chamber, the gate valve 6 is opened. At this time, the processing chamber 3 and the preliminary chamber 4 are in a vacuum state. The second mechanism 8 moves into the processing chamber 3 in the open state and then the first
~Move Ray 1 to Preparatory Room 4.

The first mechanism 7 now lowers with its claws in an open, released state, grips the tray, and moves in that state. Next, the tray carrying unprocessed wafers is raised by the third mechanism 9 to the position of the second mechanism 8, (4) and the tray is lifted from the mechanism 9 by the holding mechanism of the mechanism 8, and is moved to the processing chamber 3. The holding mechanism is released at a predetermined position, leaving the tray in the processing chamber, and the mechanism 9 returns to the processing chamber 4. At this point, the gate valve 6 is closed and etching begins in the processing chamber 3. The first mechanism 7 takes out the etched wafer at a predetermined position t7 and supplies a new wafer. Thereafter, the above-described steps are sequentially repeated.

(3) Prior Art and Problems The above-described apparatus is operated in a vacuum using corrosive gases. On the other hand, since lubricants such as grease cannot be used in the connecting parts of various mechanisms, they are easily damaged, or loose. For example, Teflon bearings are currently used, but they wear out quickly and are corroded by gas, which prevents the mechanism from operating normally. In addition,
Due to the complexity and sophistication of conventional equipment, the effects of such damage are significant.

(4) Purpose of the Invention In view of the above-mentioned conventional problems, the present invention has a simple structure with less movement of component parts (5), can perform operations performed by conventional complicated and sophisticated equipment, and can supply trays. , we are lucky to be able to shorten the retrieval time from 2 round trips to 1 round trip, contributing to an increase in operating efficiency! The purpose is to provide a mechanism.

(5) Structure and object of the invention According to the present invention, a transport mechanism is provided which takes out and supplies quartz trays, etc. (hereinafter referred to as trays) between a processing chamber and a preliminary chamber of a vacuum device in one reciprocating motion. This is accomplished by providing one each of the first and second one-lays of different lengths, four hems each as a means for raising and lowering these trays,
A feeding means for horizontally reciprocating movement on which trays are placed, and a platform which is a lower electrode on which trays are alternately placed in the processing chamber are provided, and in operation, a second electrode placed on said platform in the processing chamber is provided. With the tray being lifted up by the four second bellows, the feeding means carrying the first tray in the preliminary chamber moves to the processing chamber, and then the four second bellows lower and hold it (6). By doing this, the second tray B is placed on the feeding means, and at the same time, the four first trays are raised and held, so that the first tray B is placed on the feeding means.
Tray A is floated from the feeding means, then the feeding means is moved from the processing chamber to the preliminary chamber, the four first hems are lowered, and each time the first tray A is placed on the stand, it is placed on the stand. It is characterized in that the first and second trays A and B to be loaded can be exchanged, and the reverse of the above is also possible by a similar series of operations.

(6) Examples of the invention Embodiments of the present invention will be described in detail below with reference to the drawings.

Figures 3 and 4 show the luck involved in this invention! The mechanism is shown in a schematic front sectional view and left side sectional view (in Figures 3 and below, the same parts as those already shown are indicated by the same reference numerals). 12 is a preliminary chamber (preparatory chamber) 2 whose earthen walls can be opened and closed so that wafers can be taken in and out manually), and 13 and 14 are air cylinders.
The lowered bellows (8 bellows are provided in the processing chamber), (7) 15, 15' carry the tray and move horizontally to the processing chamber 1.
1 and the preliminary chamber 12, A is the hollow first tray, B is the short second tray (both of these have the same structure as conventional quartz trays). ), 16 is a stand (lower electrode) installed in the processing chamber 11, 17 is a normal gate I-valve for opening and closing, 18 is a rank, 19 is a pinion, and 20 is a motor for driving the pinion 19. , 21 indicates a hair ring, and to the right of the preliminary chamber 12 is connected another preliminary chamber, but it is partially omitted from the illustration.As can be understood from the above, the first bellows] 3 is the first tray, the second
The bellows I4 is for raising and lowering the second tray 13, and within the processing chamber 11, the bellows only moves one step downward, and the mechanism for driving the feeding means that makes horizontal reciprocating motion is in reserve. It is provided only within the chamber 12, and only one pinion drive motor is located outside the reserve chamber.

5 is a plan view of the left portion of the arrangement shown in FIG. 3, and a top view of the mechanism of FIG. 4; FIG. FIG. 6 is a section (8) showing the details of the feeding means shown in FIG.
14 is in a lowered state. FIG. 7 is a perspective view of the mechanism shown in FIG. 6. Means for placing the tray on the rank 1 are formed below - and these means extend from the rack [8] and are chamfered to permit accurate positioning of the tray. The removal and loading (feeding) of the I-ray and the loading and unloading of wafers can be done manually or automatically.

In operation, in order to place tray A in the processing chamber 11,
The first tray 8 is raised upwardly from the level of the feed means 15 by lowering the first cog 13. In this state, the feeding means 15 is returned to the preliminary chamber. 1. Shi-hachiha Heroes 13
Since the feed means I5 is held upward by the feed means I5, it can return to the preliminary chamber 12 without any trouble. After the feeding means 15 has completely moved to the preliminary chamber 12, the tray A held by the bellows 13
is accommodated in the base (lower electrode) 16 as the bellows 13 descends. At this point, preparations for starting etching are completed.

After etching is completed, tray A is transferred to the preliminary chamber 12 (9), tray B is transferred to the processing chamber 11, and the same steps as described above are repeated. That is, the feeding means 15 is sent from the preliminary chamber 12 to the processing chamber 11, but before that, the bellows 13 holds the tray A on the stand 16.
Tray B is sent in this state. ] - Since the tray is raised upward by the bellows 13, it will not collide with tray B. At the same time as tray A is placed on the feeding means 15, tray B is lifted up by the second four hollows 14 in order to be placed on the stand 16. This raised state is the tray holding state. Tray 8 is the feeding means 15
In order to move it to the preliminary chamber 12, the feeding means 15 moves back. When the second bellows 14, which was raising the tray B, is lowered to the platform 16, the next etching can begin.

The relative level relationship between trays A and 13 is shown in the diagram in Figure 8, in which the positions indicated by A, C and C are at the level to the tray, and the positions indicated by 2, H and H are at the level of the tray. Indicates the level of B.

The tray A is held by the bellows 13.
), the mouth is the position where tray A is moved on the feeding means 15, c is the position where tray A is placed on the stand 16 (lower electrode), and the second position is where tray B is held by the bellows 14. - The lowered position, E is the position where tray B is moved on the feeding means 15, H is the position where tray B is placed on the stand 16'', and the lowest line is the position of the bellows 13.14. Indicates the lowered position.

The bellows 3 has a conical fixing means 23 at its tip, as shown in FIG.

With this configuration, the bellows 13 supports the tray A in the correct position, and since the fixing means 23 are housed in the holes 24, the tray A is prevented from moving from side to side as seen in the figure. The bellows 14 has exactly the same structure, and the tray B also has positioning holes formed in the same way.

The bellows protects the air cylinder housed inside, for example, from corrosive gases, and at the same time prevents the cylinder's lubricant from scattering into the evacuated processing chamber and causing problems such as etching. Problems experienced in the art with moving mechanisms within the process chamber are avoided. Further, since the only movable mechanism placed in the processing chamber is the bellows, the configuration and operation are simple. Furthermore, the feeding means is of a simple structure using a rack and a pinion, and since it enters the processing chamber when etching or other processing has been completed, there is no corrosion due to gas, and the driving means for it is Since some motors are located outside the reserve chamber, damage to the motors and negative effects on the vacuum by the motors are avoided.

Although the above description has been made using an example of transporting a wafer to be etched in a processing chamber, the scope of application of the present invention is not limited to that case, but also extends to general transport of articles to a vacuum processing chamber. Needless to say. Also, the tray moves up and down,
Regarding the mechanism and structure of tray conveyance, not only combinations of bellows and air cylinders and ranks and binions, but also general drive systems are covered.

(7) Effects of the Invention''-1 As explained in detail, the present invention (12) provides a transportation mechanism with a small number of moving parts and a simple structure and operation, which facilitates semiconductor device manufacturing. This not only contributes to improved yields, but also extends the lifespan of the device itself.

[Brief explanation of the drawing]

Figure 1 fat is a perspective view of a quartz l-ray for wafer transfer.
The same figure (BL is a cross-sectional view showing the wafer placed on the stone pod tray in the same figure (AL), Figure 2 is a schematic diagram of the conveyance mechanism between the conventional processing chamber and the preparatory chamber. 4 is a left sectional view of the transportation mechanism of FIG. 3, FIG. 5 is a plan view of the left part of the transportation mechanism of FIG. 3, and FIG. 6 is a detailed view of the left part of FIG. 4, FIG. 7 is a perspective view of the portion shown in FIG. 6, FIG. 8 is a line diagram showing the level of the quartz tray and bellows in the conveyance mechanism of the present invention, and FIG.
The figure is a sectional view showing the relative relationship between the tip of the bellows and the quartz tray. 11-Processing chamber, 12-Preliminary chamber, 13.14-Bellows,
15-Feeding means, 16 one unit (lower electrode), 17-Gade valve, 1B-Rank, 19-Binion, (13) 20-Motor, 21-Bearing, 22-Fixing plate, 2
3-Fixing means, 24-Positioning hole, A, B--Single quartz l.ray (14> Bow D
-179- Figure 5 Figure 6 117 Figure 1 -11 Figure 8

Claims (1)

[Claims] A mi! ? ! In the mechanism for in-feeding trays on which objects are placed, first and second heros each having a built-in vertical movement means for vertically moving the first and second trays having different dimensions are installed in the processing chamber, respectively. , a feeding means that can horizontally reciprocate between the processing chamber and the preliminary chamber is installed in the preliminary chamber, and the second tray on the processing table is moved to the second tray in the processing chamber.
The feeding means carrying the first tray is moved from the preparatory chamber to the processing chamber while being lifted up by the melting roller, and then the second tray is placed on the feeding means by lowering and holding the second tray, At the same time, the first bellows is raised and held to float the first tray above the feeding means, then the feeding means is moved from the processing chamber to the preliminary chamber, and the first bellows is lowered (1). A 1ll1 mechanism characterized by having a structure in which a tray is placed on a stand.