JPS58219750A - Sealing method for semiconductor device - Google Patents

Sealing method for semiconductor device

Info

Publication number
JPS58219750A
JPS58219750A JP57104418A JP10441882A JPS58219750A JP S58219750 A JPS58219750 A JP S58219750A JP 57104418 A JP57104418 A JP 57104418A JP 10441882 A JP10441882 A JP 10441882A JP S58219750 A JPS58219750 A JP S58219750A
Authority
JP
Japan
Prior art keywords
resin
cover
air hole
sealing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57104418A
Other languages
Japanese (ja)
Inventor
Shogo Ariyoshi
有吉　昭吾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57104418A priority Critical patent/JPS58219750A/en
Publication of JPS58219750A publication Critical patent/JPS58219750A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16151—Cap comprising an aperture, e.g. for pressure control, encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To seal an air hole with high reliability in a short time by a method wherein the hole is provisionally sealed with instantaneously setting type resin, and thereafter sealed with thermosetting type resin. CONSTITUTION:The adhesion of a cover 3 is performed by means of the thermosetting type resin 2. The air hole 5 is provided through the cover 3. The air hole 5 is provided to prevent the increase of inner pressure generated on adhesion of the cover 3. After adhering the cover 3, the sealing of the air hole 5 is performed with the instantaneously setting resin 6. Next, it is completely sealed with the thermosetting resin 2. The resin 6 is only necessary for the period until the resin 2 solidifies, and it is no problem even when said resin 6 deteriorates thereafter because of the temporary requirement for the quality thereof.

Description

【発明の詳細な説明】 本発明は金属又は樹脂成形された箱状のケースに収めら
れた半導体！Ｉｔのカバーの空気穴の封止方法に関する
ものである。DETAILED DESCRIPTION OF THE INVENTION The present invention is a semiconductor housed in a box-shaped case made of metal or resin! The present invention relates to a method for sealing air holes in a cover of a computer.

従来上記のような構造のカバーの封止には、第１図に示
すように熱硬化型の樹脂（２）を用いてカバー（３）の
接着を行うが、その密封状態は加熱に伴う熱のため箱型
フレーム（１１の内圧が上が９、樹脂（２）の塗布面に
ボイドが発生する欠点があった。そのためカバー（３７
Ｋ空気穴（５７を設けて、内圧が高くならないようにし
ていた。Conventionally, to seal the cover with the above structure, a thermosetting resin (2) is used to adhere the cover (3) as shown in Fig. Because of this, the internal pressure of the box-shaped frame (11 was above 9, and there was a drawback that voids were generated on the coated surface of the resin (2). Therefore, the cover (37
A K air hole (57) was provided to prevent the internal pressure from becoming too high.

しかし、この空気穴（５］の封止も熱硬化性樹脂（２）
で封止するとカバー（３）の封止面と同様ボイドを生じ
るので、常温硬化性樹脂［４１を用い内圧が上がらない
ようにしていたｂところが、硬化時間が熱硬化性の樹脂
に比較し、非常に長（（例えば熱硬化１．５Ｈｒ　、常
＠硬化２４Ｈｒ〜）、また硬化後の機械的強度も一般的
に常温硬化の場合には劣るものであった〇 本発明はこれらの欠点を除去しようとするもので、瞬間
硬化型の樹脂で、仮シに穴を封じて、その後熱硬化型の
樹脂で封止することによって、短時間に機械的強度の商
（信頼性の良い空気穴の封止方法を提供するものである
。However, this air hole (5) is also sealed using thermosetting resin (2).
When sealed with a thermosetting resin, voids were created similar to the sealing surface of the cover (3), so a room temperature curing resin [41] was used to prevent the internal pressure from increasing. The present invention eliminates these drawbacks. By sealing the hole in the temporary with an instant-curing resin and then sealing it with a thermosetting resin, the mechanical strength quotient (reliable air hole) can be achieved in a short time. The present invention provides a sealing method.

以下、本発明の一実施例を図に基づいて説明する。Hereinafter, one embodiment of the present invention will be described based on the drawings.

第２図は本発明の封止方法を示す半導体装置の断面図で
、カバー（３）の接肴までは第１図のものと同様である
が、空気穴（５）の封止をまず、瞬間硬化性樹脂ｔ６Ｊ
　Ｋよって図示の如く基ぐ。この樹脂（６）は後に使用
する熱硬化性樹脂（２）が固るまで持てば良く、その後
劣化するようなものであっても問題はない。FIG. 2 is a cross-sectional view of a semiconductor device showing the sealing method of the present invention. The steps up to the attachment of the cover (3) are the same as those in FIG. 1, but the air hole (5) is first sealed. Instant curing resin t6J
Therefore, it is based as shown in the figure. This resin (6) only needs to last until the thermosetting resin (2) to be used later hardens, and there is no problem even if it deteriorates after that.

次に熱硬化性樹脂（２）にて第３図の拡大図の９口＜完
全に封じてしまう。Next, the 9 openings shown in the enlarged view of FIG. 3 are completely sealed with thermosetting resin (2).

この方法であれば、信頼性の旨い半導体装置を安１ｌｌ
Ｉｉニ作ることがり能である。With this method, highly reliable semiconductor devices can be produced at a low cost.
This is Noh.

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の半導体装置の封止方法を示す断面図、第
２図は本発明の半導体装置の封止方法を示す断面図、Ｊ
Ｘ３図はその要部拡大断面図である。 図中、同一符号は同一または相当部分を示す。 図において、（１１は箱型フレーム、（２）はカバー接
着用熱硬化性樹脂、（３）はカバー、（５Ｊはカバー（
３）の空気穴、（６）は瞬間硬化性樹脂Ｃある。 代理人　　葛　野　信　− 第１図 第２図 第；３図FIG. 1 is a sectional view showing a conventional method for sealing a semiconductor device, and FIG. 2 is a sectional view showing a method for sealing a semiconductor device according to the present invention.
Figure X3 is an enlarged sectional view of the main part. In the drawings, the same reference numerals indicate the same or corresponding parts. In the figure, (11 is a box-shaped frame, (2) is a thermosetting resin for cover adhesion, (3) is a cover, (5J is a cover (
3) Air hole, (6) is instant curing resin C. Agent Shin Kuzuno - Figure 1 Figure 2; Figure 3

Claims (1)

【特許請求の範囲】[Claims] 金属又は樹脂成形されｆｃｓ状のケースに収められてい
る半導体装置、この半導体装置のカバーに設けられた空
気穴の封止方法において、瞬間硬化型の樹脂で穴封止後
ざらに熱硬化型の樹脂で封止することを特徴とする半導
体装置の封止方法。A semiconductor device molded from metal or resin and housed in an FCS-like case, and a method for sealing an air hole provided in the cover of this semiconductor device, after sealing the hole with an instant-curing resin, a thermosetting resin is used. A method for encapsulating a semiconductor device, characterized by encapsulating it with a resin.
JP57104418A 1982-06-15 1982-06-15 Sealing method for semiconductor device Pending JPS58219750A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57104418A JPS58219750A (en) 1982-06-15 1982-06-15 Sealing method for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57104418A JPS58219750A (en) 1982-06-15 1982-06-15 Sealing method for semiconductor device

Publications (1)

Publication Number Publication Date
JPS58219750A true JPS58219750A (en) 1983-12-21

Family

ID=14380140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57104418A Pending JPS58219750A (en) 1982-06-15 1982-06-15 Sealing method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS58219750A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4893171A (en) * 1988-03-30 1990-01-09 Director General, Agenty Of Industrial Science And Technology Semiconductor device with resin bonding to support structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975275A (en) * 1972-11-22 1974-07-19

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975275A (en) * 1972-11-22 1974-07-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4893171A (en) * 1988-03-30 1990-01-09 Director General, Agenty Of Industrial Science And Technology Semiconductor device with resin bonding to support structure

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